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Designing a Battery Pack That’s Right For Your Application

Designing a Battery Pack That’s Right For Your Application

Learn how to design the battery array that best fits your system’s power requirements. This article will help you interpret battery specifications, estimate operating life, and understand the relationship between capacity, load, and environment.


Remembering Caroline Haslett, a Staunch Advocate for Women in Engineering

Remembering Caroline Haslett, a Staunch Advocate for Women in Engineering

In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.


News Mar 15, 2024 by Ingrid Fadelli
Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.


News Feb 26, 2024 by Jake Hertz
Siemens Unveils 3-Piece Emulation and Prototyping Solution

Siemens Unveils 3-Piece Emulation and Prototyping Solution

The new hardware-assisted verification and validation system marks a first for the EDA industry.


News Feb 21, 2024 by Jake Hertz
Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.


News Jan 17, 2024 by Duane Benson
Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.


News Dec 27, 2023 by Jeff Child
Understanding Wi-Fi Design Choices: Wi-Fi 6/6E vs. Wi-Fi 7 and MLO

Understanding Wi-Fi Design Choices: Wi-Fi 6/6E vs. Wi-Fi 7 and MLO

Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets, costs, and power consumption. Get up to speed on MIMO, MU-MIMO, MU-OFDMA, and more.


Renesas Unveils Industry’s First MCUs Based on Arm Cortex-M85 Core

Renesas Unveils Industry’s First MCUs Based on Arm Cortex-M85 Core

The new family of devices aims to bridge the gap between low-power MCUs and high-performance MPUs.


News Oct 31, 2023 by Jake Hertz
Improving Battery Life in IoT Smart Camera Designs

Improving Battery Life in IoT Smart Camera Designs

The wireless connectivity side eats up a huge portion of the power budget in an IoT smart home security camera design. Learn how to keep power low as smart cameras add more processing intelligence.


TOSHIBA TMPM3H Arm® Microcontroller | New Product Brief

TOSHIBA TMPM3H Arm® Microcontroller | New Product Brief

Toshiba's TMPM3H Arm Microcontrollers are equipped with a Cortex M3 core, offering up to 512 kilobytes of code flash and 32 kilobytes of data flash. Watch and learn all about their features, specs, applications, and more!


SiFive Rolls Out RISC-V Cores Aimed at Generative AI and ML

SiFive Rolls Out RISC-V Cores Aimed at Generative AI and ML

SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.


News Oct 16, 2023 by Jake Hertz
Bluetooth LE: Security Modes and Procedures Explained

Bluetooth LE: Security Modes and Procedures Explained

In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five critical BLE security procedures.


Toshiba Adds Six Over-Temperature Detection ICs to Portfolio

Toshiba Adds Six Over-Temperature Detection ICs to Portfolio

The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.


News Sep 19, 2023 by Aaron Carman
How Will Angstrom-Scale Chips Advance the Electronics Industry?

How Will Angstrom-Scale Chips Advance the Electronics Industry?

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).


The Challenge of Integrating an Antenna Into Small IoT Devices

The Challenge of Integrating an Antenna Into Small IoT Devices

Designing antennas for compact IoT devices is a tricky task, but an increasingly important one. Learn more about this challenge and how to meet it.


Understanding Security Keys in Bluetooth Low Energy

Understanding Security Keys in Bluetooth Low Energy

Learn the roles of the three security keys in Bluetooth LE—Long Term Key (LTK), Connection Signature Resolving Key (CSRK), and Identity Resolving Key (IRK).


Whitening Filters Help Low-Power Radios Tackle Issues Caused by Long Identical Bit Sequences

Whitening Filters Help Low-Power Radios Tackle Issues Caused by Long Identical Bit Sequences

Learn how whitening filters solve problems in low-power radios when transmitting long identical bit sequences. Explore their significance in protocols like BLE and ZigBee.


AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.


News Jun 27, 2023 by Jake Hertz
Securing BLE Connections—An Overview of the Security Protocol

Securing BLE Connections—An Overview of the Security Protocol

Learn about Bluetooth LE's security features and tools, how to use them, and understand how they keep connections secure.


Exclusive—Titan Haptics Debuts Clustered Array to Serve Non-standard Designs

Exclusive—Titan Haptics Debuts Clustered Array to Serve Non-standard Designs

Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.


News Jun 20, 2023 by Jeff Child