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EW ‘25 Exclusive—Nuvoton’s President Talks AI, Automotive, IoT, and Sustainability

EW ‘25 Exclusive—Nuvoton’s President Talks AI, Automotive, IoT, and Sustainability

We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI embedded development, automotive, IoT, sustainability, and the forecast for 2025.


News Mar 24, 2025 by Jeff Child
Infineon Blends Three Types of Touch Sensing in New PSOC MCU

Infineon Blends Three Types of Touch Sensing in New PSOC MCU

The new microcontrollers combine liquid sensing, inductive sensing, and hover touch.


News Mar 07, 2025 by Joshua Tidwell
Targeting Low-Voltage Loads, ST Unveils Highly Integrated Buck Converter

Targeting Low-Voltage Loads, ST Unveils Highly Integrated Buck Converter

ST claims its new buck converter brings high efficiency and flexibility to low-voltage applications like smart meters and industrial systems with few additional components.


News Mar 04, 2025 by Joshua Tidwell
Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

On this New Years Day, we share 2025 predictions from leading companies in our industry.


News Jan 01, 2025 by Jeff Child
PI Introduces 1700V Switcher IC With More Than 99% Reliability

PI Introduces 1700V Switcher IC With More Than 99% Reliability

Power Integrations has upped its GaN game with InnoMux-2 IC, delivering more than 90% efficiency from a 1000 VDC bus and supplying up to 60 W from three accurately regulated outputs.


Renesas Rolls Out MCUs Aimed at Appliances and Building Automation

Renesas Rolls Out MCUs Aimed at Appliances and Building Automation

The new MCUs merge performance, efficiency, and security for smart appliances.


News Oct 24, 2024 by Jake Hertz
Evolving Beyond Single-Processor Embedded Systems for IoT Edge Sensor Nodes

Evolving Beyond Single-Processor Embedded Systems for IoT Edge Sensor Nodes

Learn how system partitioning can optimize IoT edge sensor node operation by intelligently separating the analog sensors that measure slowly varying signals from the communication networks using high-speed digital signals.


How to Hurdle Overswing and Noise In Low Power Designs

How to Hurdle Overswing and Noise In Low Power Designs

Overswing can occur when Zener diodes are pushed to their limits. Learn about why this happens and the problems it causes—and how to overcome the issue.


Rethinking MCU Architectures for the AI Era

Rethinking MCU Architectures for the AI Era

MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.


Understanding Inductors With Gapped Cores

Understanding Inductors With Gapped Cores

In this article, we explore the advantages of introducing an air gap to the magnetic core of an inductor.


Moving Data Through an LTspice Parallel-Load Shift Register

Moving Data Through an LTspice Parallel-Load Shift Register

This article demonstrates the operation of an LTspice shift register and discusses details of its schematic and timing relationships.


TI Unveils GaN Device for Motor Energy Efficiency

TI Unveils GaN Device for Motor Energy Efficiency

TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.


News Jun 14, 2024 by Kevin Clemens
Designing a Battery Pack That’s Right For Your Application

Designing a Battery Pack That’s Right For Your Application

Learn how to design the battery array that best fits your system’s power requirements. This article will help you interpret battery specifications, estimate operating life, and understand the relationship between capacity, load, and environment.


Remembering Caroline Haslett, a Staunch Advocate for Women in Engineering

Remembering Caroline Haslett, a Staunch Advocate for Women in Engineering

In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.


News Mar 15, 2024 by Ingrid Fadelli
Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.


News Feb 26, 2024 by Jake Hertz
Siemens Unveils 3-Piece Emulation and Prototyping Solution

Siemens Unveils 3-Piece Emulation and Prototyping Solution

The new hardware-assisted verification and validation system marks a first for the EDA industry.


News Feb 21, 2024 by Jake Hertz
Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.


News Jan 17, 2024 by Duane Benson
Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.


News Dec 27, 2023 by Jeff Child
Understanding Wi-Fi Design Choices: Wi-Fi 6/6E vs. Wi-Fi 7 and MLO

Understanding Wi-Fi Design Choices: Wi-Fi 6/6E vs. Wi-Fi 7 and MLO

Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets, costs, and power consumption. Get up to speed on MIMO, MU-MIMO, MU-OFDMA, and more.


Renesas Unveils Industry’s First MCUs Based on Arm Cortex-M85 Core

Renesas Unveils Industry’s First MCUs Based on Arm Cortex-M85 Core

The new family of devices aims to bridge the gap between low-power MCUs and high-performance MPUs.


News Oct 31, 2023 by Jake Hertz