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Density Demands Push Memory Solutions to New Heights

Density Demands Push Memory Solutions to New Heights

From embedded systems to high-performance storage, the latest memory advancements are stacking skyward to maximize density and speed.


News Apr 29, 2024 by Aaron Carman
Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0

Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0

Today's processors support large-language models scaling to over a trillion parameters. Rambus is keeping up with this computational load with a new memory solution.


News Apr 24, 2024 by Aaron Carman
Applying IP Customization to Improve AI Chips: A Case Study

Applying IP Customization to Improve AI Chips: A Case Study

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.


Micron to ‘Revolutionize’ Smart Vehicles With First Quad-Port SSD

Micron to ‘Revolutionize’ Smart Vehicles With First Quad-Port SSD

Micron simplifies data access in new vehicle architectures with its first multi-port automotive SSD.


News Apr 16, 2024 by Aaron Carman
Circuit and Operation of a D Flip-Flop

Circuit and Operation of a D Flip-Flop

D-type flip-flops are fundamental digital memory components. Here, we examine their input-output behavior and internal circuitry.


Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.


News Apr 02, 2024 by Jake Hertz
Infineon SEMPER™ X1 | Fast Facts

Infineon SEMPER™ X1 | Fast Facts

Enable next-generation automotive E/E architectures.


Pragmatic Semi is Breaking the Rules and Bending Silicon Electronics

Pragmatic Semi is Breaking the Rules and Bending Silicon Electronics

Pragmatic Semiconductor’s Founder and Executive Director joins us to discuss their thin-film, low-cost alternative to traditional silicon manufacturing and their aim to disrupt applications from smart labeling to IoT sensors and fingerprint sensors.


Understanding How CXL 3.0 Links the Data Center Fabric

Understanding How CXL 3.0 Links the Data Center Fabric

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements and benefits of this protocol, along with what’s new in CXL version 3.0.


Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.


News Mar 13, 2024 by Duane Benson
ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5 with 8 Gb/s/pin—all without leaving the 10 nm process.


News Feb 27, 2024 by Duane Benson
Jay W. Forrester and the Invention of Magnetic Core Memory

Jay W. Forrester and the Invention of Magnetic Core Memory

During his long and remarkably productive career, Jay Forrester accumulated an impressive list of innovations and achievements in electrical engineering, social science, and business management.


News Feb 09, 2024 by Robert Keim
Kioxia First to Release UFS 4.0 Embedded Flash Memory for Automotive

Kioxia First to Release UFS 4.0 Embedded Flash Memory for Automotive

The company’s UFS 4.0 solution meets AEC-Q100 Grade 2 requirements.


News Feb 01, 2024 by Jake Hertz
Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.


News Jan 09, 2024 by Duane Benson
Rambus Improves DDR5 Transfer Speeds By 50% With New RCD

Rambus Improves DDR5 Transfer Speeds By 50% With New RCD

Rambus' latest registering clock driver inches DDR5 memory closer to data center-level performance.


News Jan 02, 2024 by Aaron Carman
SOT-MRAM May Soon Contend With SRAM for Cache Memory

SOT-MRAM May Soon Contend With SRAM for Cache Memory

Memory at both the HPC and edge levels may get a big leg up with help from magnetics.


News Dec 22, 2023 by Aaron Carman
International Researchers Move the Needle on Memristor Technology

International Researchers Move the Needle on Memristor Technology

Academics across the globe have made concurrent breakthroughs in a new form of non-volatile memory.


News Dec 19, 2023 by Jake Hertz
Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Boasting a cost-effective approach, today Kinara is rolling out its new edge AI processor designed to take on the demanding workloads brought on by generative AI.


News Dec 12, 2023 by Jake Hertz
Cerabyte Aims to Revolutionize Data Storage With Nanodots on Ceramic

Cerabyte Aims to Revolutionize Data Storage With Nanodots on Ceramic

Cerebyte uses laser-etched ceramic on glass to produce archival data storage systems rivaling the longevity of ancient cuneiform tablets.


News Dec 05, 2023 by Duane Benson
Understanding Hysteresis in Electronic Components and Circuits

Understanding Hysteresis in Electronic Components and Circuits

Learn about the behavior and benefits of hysteresis in comparator circuits, magnetic components, and high-power devices.