For students back in college for their Fall semester—and anyone who needs a refresher—here’s the lowdown on our top-notch textbooks, technical articles,…
For students back in college for their Fall semester—and anyone who needs a refresher—here’s the lowdown on our top-notch textbooks, technical articles, and calculators for EE studies.
Switched-mode power supplies (SMPS) appear simple to route on your PCB, but are they? This article identifies two noise…
Switched-mode power supplies (SMPS) appear simple to route on your PCB, but are they? This article identifies two noise sources and simple fixes to improve your EMC performance.
Altium Education guides college students from the basics of PCB design through developing their first printed circuit board.
Altium Education guides college students from the basics of PCB design through developing their first printed circuit board.
Multi-layer PCBs are known for saving size and weight. Now, 3D printing these boards may be an option for more designers…
Multi-layer PCBs are known for saving size and weight. Now, 3D printing these boards may be an option for more designers on a large scale.
Announced at AltiumLive, the new Altimade application brings designers, supply chain experts, and manufacturers all on…
Announced at AltiumLive, the new Altimade application brings designers, supply chain experts, and manufacturers all on the same continuous digital thread.
It’s the start of the holiday season and almost a new year. There’s always something to be thankful for, but here are…
It’s the start of the holiday season and almost a new year. There’s always something to be thankful for, but here are the things we’re grateful for the most at AAC.
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that…
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
In this article, we’ll discuss why a discrete implementation cannot provide a high accuracy in resistive current sensing.
In this article, we’ll discuss why a discrete implementation cannot provide a high accuracy in resistive current sensing.
Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as…
Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as well as a layout example based on an op-amp in the SOT23 package.
Knowing the issues with Foveros technology, Intel includes improvements, from interference to power consumption, into its…
Knowing the issues with Foveros technology, Intel includes improvements, from interference to power consumption, into its roadmap. How is Intel aiming to improve this technology?
Simplifying designs are never easy, especially with power. So how did these three companies tackle simplifying power…
Simplifying designs are never easy, especially with power. So how did these three companies tackle simplifying power conversion systems?
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we…
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.
This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative…
This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative resistance” or “oscillation allowance”.
Learn how the load capacitance mismatch can “pull” the crystal to oscillate at a different frequency and how we can…
Learn how the load capacitance mismatch can “pull” the crystal to oscillate at a different frequency and how we can circumvent this problem.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline…
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.
Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience…
Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience just waiting to be discovered.
The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for…
The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.
Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.
Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.
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