Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as well as a layout example based on an…
Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as well as a layout example based on an op-amp in the SOT23 package.
Knowing the issues with Foveros technology, Intel includes improvements, from interference to power consumption, into its…
Knowing the issues with Foveros technology, Intel includes improvements, from interference to power consumption, into its roadmap. How is Intel aiming to improve this technology?
Simplifying designs are never easy, especially with power. So how did these three companies tackle simplifying power…
Simplifying designs are never easy, especially with power. So how did these three companies tackle simplifying power conversion systems?
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we…
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.
This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative…
This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative resistance” or “oscillation allowance”.
Learn how the load capacitance mismatch can “pull” the crystal to oscillate at a different frequency and how we can…
Learn how the load capacitance mismatch can “pull” the crystal to oscillate at a different frequency and how we can circumvent this problem.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline…
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.
Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience…
Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience just waiting to be discovered.
The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for…
The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.
Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.
Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and…
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke…
GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.
Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using…
Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using symmetric PCB layout.
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the…
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).
This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.
This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This…
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Junction-to-ambient thermal resistance (or θJA) should be measured under standardized testing conditions. Learn about…
Junction-to-ambient thermal resistance (or θJA) should be measured under standardized testing conditions. Learn about these details to use this thermal metric appropriately.
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