Latest Layout Articles and Videos

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke…

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.

Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using…

Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using symmetric PCB layout.

In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the…

In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).

This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.

This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This…

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.  

Learn about an important thermal metric for designing the interface between an IC package and a heat sink.

Learn about an important thermal metric for designing the interface between an IC package and a heat sink.

Junction-to-ambient thermal resistance (or θ_JA) should be measured under standardized testing conditions. Learn about…

Junction-to-ambient thermal resistance (or θ_JA) should be measured under standardized testing conditions. Learn about these details to use this thermal metric appropriately.

Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied,…

Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical…

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.

Learn the high-level steps behind RFIC design.

Learn the high-level steps behind RFIC design.

Learn the basic steps of the analog IC design process and how it compares to digital IC design.

Learn the basic steps of the analog IC design process and how it compares to digital IC design.

This article explains the theory and the construction of the circuit of a 10W practice guitar amplifier.

This article explains the theory and the construction of the circuit of a 10W practice guitar amplifier.

Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about…

Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about how to leverage the different modeling methods in Fusion 360.

Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of…

Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of complex designs.

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as…

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.

Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?

Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?

This article dives into how Fusion 360 can be used to produce smarter microelectronics.

This article dives into how Fusion 360 can be used to produce smarter microelectronics.

MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have…

MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.

Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a…

Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.