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Testing the Waters: Quantum T&M Equipment Adds Rohde & Schwarz to Its Roster

Testing the Waters: Quantum T&M Equipment Adds Rohde & Schwarz to Its Roster

With quantum computing striving to become mainstream, T&M equipment will play a pivotal role. Ensuring this, Rohde & Schwarz jump into the quantum T&M playing field.


News Jul 23, 2021 by Kristijan Nelkovski
NXP and MOTER Brings Software to the Data for Real-time Data to Insurance

NXP and MOTER Brings Software to the Data for Real-time Data to Insurance

NXP and MOTER join forces to provide insurance companies with a way to get real-time data on intelligent vehicle systems, skipping the dense and costly method of sending all data to the cloud.


News Jul 20, 2021 by Jake Hertz
NVIDIA Dives Into Industrial High-performance Computing with HGX Platform

NVIDIA Dives Into Industrial High-performance Computing with HGX Platform

Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release of a new platform: the HGX HPC platform.


News Jul 19, 2021 by Ikimi .O
Marvell’s OCTEON 10: The First DPU To Use Neoverse N2 ARMv9 Architecture

Marvell’s OCTEON 10: The First DPU To Use Neoverse N2 ARMv9 Architecture

Marvell’s newest 5 nm data processing unit (DPU), the OCTEON 10, offers 3x improvement over the previous generation along with the newest ARMv9 Core.


News Jul 07, 2021 by Adrian Gibbons
From Schottky Diodes to MOSFETS: 3 Team-ups Lower Power with SiC Technology

From Schottky Diodes to MOSFETS: 3 Team-ups Lower Power with SiC Technology

The world of SiC technology is about to boom with three different team-ups, from research to large tech companies. Who is teaming up, how are they advancing with SiC, and why?


News Jun 26, 2021 by Ikimi .O
A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

A RISC-V Future? SiFive and Andes Aim to Shake Up the Processor Industry

RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.


News Jun 25, 2021 by Adrian Gibbons
Entering the Era of AI IC Design: Where Do EEs Fit In?

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?


News Jun 25, 2021 by Jake Hertz
IBM Accelerates Germany as a Quantum Hub with EU’s First Quantum Computer

IBM Accelerates Germany as a Quantum Hub with EU’s First Quantum Computer

Quantum computing momentum just got faster with the EU's first quantum computer: IBM's "Quantum System One." What could this computer mean for the EU, quantum technology, and Germany?


News Jun 24, 2021 by Tyler Charboneau
Xilinx’s Versal AI Edge Blends the Border Between Programming and EEs

Xilinx’s Versal AI Edge Blends the Border Between Programming and EEs

Wrapping up a two-part series on the new Versal AI Edge series ACAP from Xilinx, AAC talks about the intersection of engineering disciplines and ACAP applications.


News Jun 15, 2021 by Adrian Gibbons
Supporting the AI Boom: Facing the Challenges of Hardware and Deployment

Supporting the AI Boom: Facing the Challenges of Hardware and Deployment

AI has been a hot topic recently, especially this week. With all the efforts coming out, there is a growing need for better hardware, collaborating, and easing deployment.


News Jun 11, 2021 by Rushi Patel
Xilinx Opens a New Door to Edge AI with Newest Adaptable Compute Platform

Xilinx Opens a New Door to Edge AI with Newest Adaptable Compute Platform

Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute acceleration platforms, the Versal AI Edge series.


News Jun 09, 2021 by Adrian Gibbons
Easing the Effort: Mipsology Accelerates ML with Zebra FPGA IP

Easing the Effort: Mipsology Accelerates ML with Zebra FPGA IP

Today, Mipsology is announcing its solution for FPGA programming: Zebra FPGA IP. This IP aims to ease FPGA programming, giving the designer more time to design.


News Jun 09, 2021 by Sam Holland
Mythic Redefines Edge AI by Combining Analog Processing and Flash Memory

Mythic Redefines Edge AI by Combining Analog Processing and Flash Memory

A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest processor could be a hopeful contender in the world of edge computing.


News Jun 07, 2021 by Jake Hertz
AI on Demand: SambaNova Hopes to Bridge the AI Integration Gap

AI on Demand: SambaNova Hopes to Bridge the AI Integration Gap

U.S. start-up SambaNova hopes to bridge the gap that currently exists between businesses and artificial intelligence with its innovative "Dataflow-as-a-Service" platform.


News Jun 03, 2021 by Luke James
From Smallest to Quantum: Rounding Up Image Sensor 2021 World “Firsts”

From Smallest to Quantum: Rounding Up Image Sensor 2021 World “Firsts”

It’s a busy quarter-year for image sensor technology. Sony with Microsoft, OmniVision, and Gigajot have all released new product classes claiming “world firsts.”


News May 27, 2021 by Adrian Gibbons
Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

This week All About Circuits had the chance to sit down with Qualcomm and talk about its newest chipset for IIoT and how it is moving 5G to industrial settings.


News May 21, 2021 by Jake Hertz
NVIDIA Makes Waves in the Industry with ADLINK

NVIDIA Makes Waves in the Industry with ADLINK

ADLink has tapped into NVIDIA’s resources for two new products this month, sealing its impact in the electronics industry.


News May 17, 2021 by Jake Hertz
Blending AI and Hardware: 3 Startups Reach for AVs and the Cloud

Blending AI and Hardware: 3 Startups Reach for AVs and the Cloud

AI may be the buzzword of the century, with companies ranging from startups to Fortune 500 clamoring to harness the technology.


News May 11, 2021 by Jake Hertz
Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.


News May 10, 2021 by Adrian Gibbons
Is Software Going to Revolutionize Memory? IBM Digs into Software-defined Storage

Is Software Going to Revolutionize Memory? IBM Digs into Software-defined Storage

You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to catch up on this cloud-focused technology.