Amid market trends toward higher integration, AMD has released two new processors that strip things back.
Amid market trends toward higher integration, AMD has released two new processors that strip things back.
The new flagship smartphone SoC takes an unconventional approach to on-device generative AI and gaming with MediaTek's…
The new flagship smartphone SoC takes an unconventional approach to on-device generative AI and gaming with MediaTek's “All-Big-Core” architecture.
The new SoC leverages 28 billion transistors to make the new iPad Pro "the most powerful device of its kind."
The new SoC leverages 28 billion transistors to make the new iPad Pro "the most powerful device of its kind."
Microchip made an important addition to its family of USB MCUs with the new security-conscious AVR DU family.
Microchip made an important addition to its family of USB MCUs with the new security-conscious AVR DU family.
At Embedded World today, Renesas lifted the curtain on a new family of entry-level MCUs filling out its RA series. We…
At Embedded World today, Renesas lifted the curtain on a new family of entry-level MCUs filling out its RA series. We spoke to Renesas' Masashi Ueda to learn more.
Infineon has added three PSOC Edge MCUs with Arm Cores and dual-domain architectures to ramp up edge performance.
Infineon has added three PSOC Edge MCUs with Arm Cores and dual-domain architectures to ramp up edge performance.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional…
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI…
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.
ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power…
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL)…
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533…
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
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