Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL)…
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533…
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.
Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible…
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing…
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing applications.
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of…
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of connected devices.
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor…
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from…
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
Memory at both the HPC and edge levels may get a big leg up with help from magnetics.
Memory at both the HPC and edge levels may get a big leg up with help from magnetics.
Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores,…
Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores, marking the biggest architectural change since the 80286.
Based on the Arm Cortex-M85 processor, Renesas' RA8D1 provides high-performance graphics and security for consumer,…
Based on the Arm Cortex-M85 processor, Renesas' RA8D1 provides high-performance graphics and security for consumer, medical, and industrial applications.
At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.
At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and…
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and extend operating times for battery-powered devices and systems.
As we look back on 2023, we give tribute to the 50th anniversary of the cellphone. After half a century, this device is…
As we look back on 2023, we give tribute to the 50th anniversary of the cellphone. After half a century, this device is almost unrecognizable from its two-pound form in the 70s and 80s.
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