With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI…
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.
ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power…
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL)…
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533…
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
By measuring position with magnetics, the new position sensor frees up system real estate for designers.
Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.
Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible…
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing…
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing applications.
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of…
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of connected devices.
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor…
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from…
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
Memory at both the HPC and edge levels may get a big leg up with help from magnetics.
Memory at both the HPC and edge levels may get a big leg up with help from magnetics.
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