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Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

A new project indicates the value of 3D printing in PCB design: fast prototyping.


News May 22, 2020 by Gary Elinoff
MATLAB and Simulink Get a Major Deep Learning Facelift

MATLAB and Simulink Get a Major Deep Learning Facelift

MathWorks has revamped MATLAB and Simulink with a host of deep learning development tools—and they say these updates will be a major boon for automotive and wireless designers.


News May 09, 2020 by Robin Mitchell
Altium’s New Collaborative Platform Said to Slash the Lofty Price Tag on Design Miscommunication

Altium’s New Collaborative Platform Said to Slash the Lofty Price Tag on Design Miscommunication

There's a high price to pay when electrical engineers and mechanical engineers miscommunicate. Altium's new collaborative platform, Altium 365, may help.


News May 07, 2020 by Robin Mitchell
Printed Circuit Boards Receive an AI Boost Through Fraunhofer’s Modular Platform

Printed Circuit Boards Receive an AI Boost Through Fraunhofer’s Modular Platform

The AI platform from the Fraunhofer Institute for Applied Information Technology (FIT) is comprised of modules for artificial intelligence, machine learning, and deep learning.


News May 06, 2020 by Luke James
Arm Now Offers Silicon Startups Free Access to Its Extensive IP Portfolio

Arm Now Offers Silicon Startups Free Access to Its Extensive IP Portfolio

For select silicon startups, Arm has swung open the doors on its IP portfolio.


7 Collaborative PCB Software Programs for Designers Working Remotely

7 Collaborative PCB Software Programs for Designers Working Remotely

Social distancing doesn't mean your productivity must come to a halt.


News Apr 01, 2020 by Kayla Matthews
Cypress Semi Announces USB-C Controllers to Shrink Design Footprint of USB-Enabled Devices

Cypress Semi Announces USB-C Controllers to Shrink Design Footprint of USB-Enabled Devices

Cypress Semiconductor recently announced its latest USB-C controllers that are designed to improve next-generation PCs and notebooks.


News Mar 22, 2020 by Luke James
What 3D-Printed CurveBoards Offer for Circuit Design Testing

What 3D-Printed CurveBoards Offer for Circuit Design Testing

MIT has developed a software design kit that speeds up electronic device development and prototyping by creating curved breadboards with pinholes and connections mapped out automatically.


News Mar 06, 2020 by Luke James
Magnetic Assembly: A New Option for Delicate 3D Integration?

Magnetic Assembly: A New Option for Delicate 3D Integration?

Pick-and-place can damage sensitive parts and contactless methods are inefficient for high volumes. What about magnetic assembly?


News Mar 04, 2020 by Robin Mitchell
The Curiously Low-tech Side of High-tech Manufacturing

The Curiously Low-tech Side of High-tech Manufacturing

In this article, engineers discuss seemingly primitive parts of the manufacturing process and the feasibility of replacing those processes with automation.


News Feb 08, 2020 by Ingrid Fadelli
“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.


News Jan 29, 2020 by Robin Mitchell
Fieldscale and ST Introduce Simulation Software for STM32-based Capacitive Touch Sensors

Fieldscale and ST Introduce Simulation Software for STM32-based Capacitive Touch Sensors

Fieldscale’s SENSE simulation software allows OEMs to develop touch-enabled devices with far less hardware prototyping.


News Jan 28, 2020 by Gary Elinoff
Zuken Announces New High-speed Configuration for Its Online PCB Design Platform

Zuken Announces New High-speed Configuration for Its Online PCB Design Platform

Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.


News Dec 28, 2019 by Gary Elinoff
Cadence to Acquire AWR for $160 Million to Simplify RF IC Design

Cadence to Acquire AWR for $160 Million to Simplify RF IC Design

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.


News Dec 09, 2019 by Gary Elinoff
Highland Technology’s Quadrature Modulator Geared for Aerospace Simulation

Highland Technology’s Quadrature Modulator Geared for Aerospace Simulation

The P348 is designed for transducer simulation and provides carrier frequencies over a range of 0.5MHz to 20MHz.


News Nov 26, 2019 by Gary Elinoff
Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Concord Pro allows each player in the design process to share up-to-date component information.


News Nov 01, 2019 by Gary Elinoff
TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.


News Aug 29, 2019 by Gary Elinoff
New App Tool for Augmented Reality PCB Design Enters Beta

New App Tool for Augmented Reality PCB Design Enters Beta

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.


News Jul 22, 2019 by Mark Hughes
Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.


News Jun 22, 2019 by Mark Hughes
Microchip Reveals Investment on Ethernet in the 5G Age with New 1.2 Terabit Physical-Layer ICs

Microchip Reveals Investment on Ethernet in the 5G Age with New 1.2 Terabit Physical-Layer ICs

Microchip's new Meta-DX1 family incorporates FlexE and MACsec on a single chip.


News Jun 06, 2019 by Gary Elinoff