Latest EDA Tools News

Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.

Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design…

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.

The P348 is designed for transducer simulation and provides carrier frequencies over a range of 0.5MHz to 20MHz.

The P348 is designed for transducer simulation and provides carrier frequencies over a range of 0.5MHz to 20MHz.

Concord Pro allows each player in the design process to share up-to-date component information.

Concord Pro allows each player in the design process to share up-to-date component information.

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.

AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.

AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.

Microchip's new Meta-DX1 family incorporates FlexE and MACsec on a single chip.

Microchip's new Meta-DX1 family incorporates FlexE and MACsec on a single chip.

A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.

A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.

A conversation with Altium's Vice President of Global Marketing, Lawrence Romine, about how EEs must evolve.

A conversation with Altium's Vice President of Global Marketing, Lawrence Romine, about how EEs must evolve.

Altium today announced Altium 365, a cloud-based design platform intended to bring manufacturing and sourcing into a…

Altium today announced Altium 365, a cloud-based design platform intended to bring manufacturing and sourcing into a hardware design environment.

The days of manual prototyping may be numbered, but so could prohibitively expensive IP licenses.

The days of manual prototyping may be numbered, but so could prohibitively expensive IP licenses.

Ever wonder what it would be like to alter your DNA? Researchers at Boston University and MIT are working on genetic…

Ever wonder what it would be like to alter your DNA? Researchers at Boston University and MIT are working on genetic circuit design automation that might allow you to do just that.

An engineering career is still a good way to make a living—but for which types of people? AAC's Technical Director…

An engineering career is still a good way to make a living—but for which types of people? AAC's Technical Director Robert Keim reflects on the nature of electrical engineering and how it's changed as technology accelerates.

AAC recently spoke with Parker Dillmann, lead EE and co-founder of MacroFab, a PCB manufacturing company that aims to…

AAC recently spoke with Parker Dillmann, lead EE and co-founder of MacroFab, a PCB manufacturing company that aims to take some of the old-school pain out of the product development and scaling processes.

Sudipta Chakraborty is the Director of Energy Systems at OPAL-RT. In this Engineer Spotlight, he speaks about challenges…

Sudipta Chakraborty is the Director of Energy Systems at OPAL-RT. In this Engineer Spotlight, he speaks about challenges facing power system design, how hardware-in-the-loop simulations are important for problem-solving with grid integration, and his work on the IEEE-1547 standard for power grid test procedures.

Cadence Design Systems and Imec have recently introduced the world’s first 3nm tapeout. The companies have achieved a…

Cadence Design Systems and Imec have recently introduced the world’s first 3nm tapeout. The companies have achieved a reduction in size of transistor (FinFET) nodes which will allow even more transistors to be packed onto a chip.

A new tri-stimulus color sensor is designed for providing color measurements that closely match the human eye's response…

A new tri-stimulus color sensor is designed for providing color measurements that closely match the human eye's response to visible light.

Just in time for the new year, Altium LLC has announced the newest release of the company’s flagship PCB design…

Just in time for the new year, Altium LLC has announced the newest release of the company’s flagship PCB design software—Altium Designer 18.