DSPs mark the third credible silicon choice for deep learning products, especially the embedded systems that require affordable and low-power solutions.
DSPs mark the third credible silicon choice for deep learning products, especially the embedded systems that require affordable and low-power solutions.
Cadence Design Systems will be dropping the curtain on some exciting new technology solutions this year at TSMC 2016 in…
Cadence Design Systems will be dropping the curtain on some exciting new technology solutions this year at TSMC 2016 in San Jose on March 15th.
Micron's HMC started shipping in September. Here's a rundown on key features of the very welcome memory solution.
Micron's HMC started shipping in September. Here's a rundown on key features of the very welcome memory solution.
A brief overview of several of the major free EDA tools out on the market geared toward budding electrical circuit designers.
A brief overview of several of the major free EDA tools out on the market geared toward budding electrical circuit designers.
Toshiba has released a new flash memory based on its 48-layer stacking process. It has far more storage than traditional…
Toshiba has released a new flash memory based on its 48-layer stacking process. It has far more storage than traditional NAND flash memory, greater write/erase reliability endurance, and faster write speeds.
Facebook
Google
GitHub
Linkedin