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ST Packs the Power and Connectivity Strengths of STM32 Into a Wireless MCU Module

ST Packs the Power and Connectivity Strengths of STM32 Into a Wireless MCU Module

Designing a transceiver and antenna is no small feat. A new module from ST is designed to help small companies to spend less time on the hardware and more time on the Bluetooth LE, Zigbee, or Thread application itself.


News Jan 07, 2021 by Dr. Steve Arar
Atomera Partners Up to Extend Moore’s Law Through Material Science, Not Downscaling

Atomera Partners Up to Extend Moore’s Law Through Material Science, Not Downscaling

Discussions on extending Moore's law usually involve shrinking board space. One company, Atomera, has attracted attention because of its novel method called Mears Silicon Technology.


News Jan 06, 2021 by Jake Hertz
What to Expect from an All-Digital CES 2021

What to Expect from an All-Digital CES 2021

With CES 2021 taking place as an all-digital show for the very first time, things are going to be a little different. Here’s a brief rundown of what to expect.


News Jan 06, 2021 by Luke James
Xilinx Joins Confidential Computing Consortium With Hopes to Bring Security to Accelerators

Xilinx Joins Confidential Computing Consortium With Hopes to Bring Security to Accelerators

The Confidential Computing Consortium is drilling down on hardware-based Trusted Execution Environments, and Xilinx is the newest member to benefit.


News Jan 04, 2021 by Jake Hertz
Worth Over $20 Billion by 2041, Transparent Electronics Have a Clear Trajectory

Worth Over $20 Billion by 2041, Transparent Electronics Have a Clear Trajectory

A recent report from IDTechEx predicts that the transparent electronics industry will be worth over $20 billion by 2041. What is this technology and why does it have such a great potential upside?


News Jan 02, 2021 by Jake Hertz
Reflections on the Year Ahead: Engineers, Science, and the Legacy of 2020

Reflections on the Year Ahead: Engineers, Science, and the Legacy of 2020

In a world increasingly influenced by scientific assessments and pronouncements, EE insights can extend beyond signals and circuits.


News Jan 01, 2021 by Robert Keim
Can Wide-Bandgap Devices Help Lead to a Carbon-Neutral Future?

Can Wide-Bandgap Devices Help Lead to a Carbon-Neutral Future?

STMicroelectronics announced a goal to be carbon neutral by 2027, and they plan to get there by using wide-bandgap semiconductors. How might this technology bring the industry toward carbon neutrality?


News Dec 31, 2020 by Jake Hertz
Efforts to Bring Chip Manufacturing to U.S. Soil Will Continue in 2021

Efforts to Bring Chip Manufacturing to U.S. Soil Will Continue in 2021

The U.S. government has made big pushes for domestic chip manufacturing in 2020. What does this trajectory look like for 2021?


News Dec 30, 2020 by Luke James
Was 2020 the Year of Edge AI Compute?

Was 2020 the Year of Edge AI Compute?

In 2020, many companies released flagship low-power devices with the goal of bringing AI to the edge. We’ll review some of the most recent ones and see how they compare.


News Dec 28, 2020 by Jake Hertz
On the 12 Days of Christmas, an EE Gave to Me…

On the 12 Days of Christmas, an EE Gave to Me…

In this electrical engineering edition of the 12 days of Christmas, we take a look at a few familiar highlights of the season and zoom in on the technologies electrical engineers have contributed to make them possible.


News Dec 25, 2020 by Hannah DeTavis
Factors Suppliers Consider Before Sending a Memory Device to Space

Factors Suppliers Consider Before Sending a Memory Device to Space

Despite the pandemic, 2020 was a monumental year for space exploration. And pivotal to each mission's success at the circuit level was radiation-hardened memory devices.


News Dec 21, 2020 by Tyler Charboneau
Boston Dynamics Changes Hands Yet Again as Hyundai Acquires Robot Maker

Boston Dynamics Changes Hands Yet Again as Hyundai Acquires Robot Maker

In a $1.1 billion deal, Hyundai has purchased a controlling stake in robot maker Boston Dynamics from SoftBank. What could this mean for the future of the famous robotics house?


News Dec 19, 2020 by Luke James
IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

TSMC has been formally recognized by the IEEE with the 2021 IEEE Corporate Innovation Award. The 7nm node is just the beginning of TSMC's plans, though.


News Dec 17, 2020 by Luke James
Could Indium Gallium Arsenide Dethrone Silicon in the Race for Smaller Transistors?

Could Indium Gallium Arsenide Dethrone Silicon in the Race for Smaller Transistors?

Recent work by researchers at MIT has led to better understanding of an alloy known as indium gallium arsenide, a room-temperature semiconductor that could lead to faster, denser chips.


News Dec 15, 2020 by Luke James
“vRAN” Is Becoming a Key Focus for Developers of 5G Radio Units

“vRAN” Is Becoming a Key Focus for Developers of 5G Radio Units

With an influx of 5G devices, telecom companies, specifically those aligned with the O-RAN Alliance, are further developing virtualized radio access networks.


Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Updates to the IEEE 1588 standard protocol map out a low-cost method for synchronizing distributed clocks.


European Legislators Spark Renewed Discussion on Global Right to Repair Movement

European Legislators Spark Renewed Discussion on Global Right to Repair Movement

France and Austria have recently made headway in the right to repair movement. How is the conversation on obsolescence and repairability rolling forward?


News Dec 11, 2020 by Tyler Charboneau
2020 Chip Market Year in Review: DRAM Comes Out on Top

2020 Chip Market Year in Review: DRAM Comes Out on Top

According to IC Insights, DRAM was the biggest IC product category for 2020 with sales of $65.2 billion, followed by NAND coming in second at $55.2 billion.


News Dec 10, 2020 by Luke James
FPGAs and Firmware: An Ironclad Security Duo at Every Stage of Design and Manufacture

FPGAs and Firmware: An Ironclad Security Duo at Every Stage of Design and Manufacture

With increased data transfer comes increased hardware security. We sat down with Lattice Semiconductor to discuss a new security-focused FPGA that may be a solution to many firmware vulnerabilities.


News Dec 08, 2020 by Jake Hertz
Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Qualcomm recently unveiled Snapdragon 888, the company’s new high-end mobile platform built on the N5 process node.


News Dec 08, 2020 by Luke James