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Microchip Jumps on New CoaXPress Standard with Chips for Machine Vision

Microchip Jumps on New CoaXPress Standard with Chips for Machine Vision

CoaXPress 2.0—the communication standard for machine vision—is here. Microchip wasted no time to develop a family of devices to meet the new standard.


News Aug 20, 2020 by Jake Hertz
When Will the Semiconductor Industry Bounce Back? Market Experts Weigh In

When Will the Semiconductor Industry Bounce Back? Market Experts Weigh In

COVID-19 hard hit the semiconductor industry. How long will it take for the business to recover?


News Jul 15, 2020 by Ingrid Fadelli
Semiconductor Nanophotonics Linked to Higher Communication Speed for Supercomputers and Data Centers

Semiconductor Nanophotonics Linked to Higher Communication Speed for Supercomputers and Data Centers

In the world of electronics and indeed science on the whole, when something simply just works without explanation, that’s not good enough; lots of questions get asked and researchers poke and prod until they can understand the underlying mechanisms and processes at work.


News May 21, 2020 by Luke James
MATLAB and Simulink Get a Major Deep Learning Facelift

MATLAB and Simulink Get a Major Deep Learning Facelift

MathWorks has revamped MATLAB and Simulink with a host of deep learning development tools—and they say these updates will be a major boon for automotive and wireless designers.


News May 09, 2020 by Robin Mitchell
As Suppliers Hunker Down on IoT, Multi-Protocol Chips May Spike

As Suppliers Hunker Down on IoT, Multi-Protocol Chips May Spike

Suppliers are producing more multi-protocol chips to meet the power and connectivity demands of IoT. Can we expect to see more tech like NXP's multiprotocol mesh networking MCUs in the future?


News May 08, 2020 by Gary Elinoff
Energy Sharing—The Key to Preventing LED Drivers from Overheating?

Energy Sharing—The Key to Preventing LED Drivers from Overheating?

Managing heat in LED drivers is a challenge when the device encounters a high input voltage, but the output voltage is low. In these cases, an “energy sharing” mechanism may be a solution.


News Apr 14, 2020 by Dr. Steve Arar
Silicon Labs Puts Down $308 Million in Cash to Chart a Roadmap for Wi-Fi 6

Silicon Labs Puts Down $308 Million in Cash to Chart a Roadmap for Wi-Fi 6

Silicon Labs is taking over Redpine Signals' connectivity business. What does the San Jose-based startup bring to the table?


News Mar 13, 2020 by Gary Elinoff
A Brief Guide to Bluetooth Low Energy IPs on the Market

A Brief Guide to Bluetooth Low Energy IPs on the Market

Keep this guide in your back pocket for the next time you're designing a device that requires BLE connectivity.


News Mar 05, 2020 by Robin Mitchell
New Wireless Charging IC from ST Designed to Amp Up Power Transfer

New Wireless Charging IC from ST Designed to Amp Up Power Transfer

The STWLC68 integrates a high-power receiver and transmitter with a 32-bit Arm Cortex microcontroller core.


News Feb 26, 2020 by Cabe Atwell
Dialog Semiconductor’s IO-Link ICs Bring Connectivity to IIoT Sensors and Actuators

Dialog Semiconductor’s IO-Link ICs Bring Connectivity to IIoT Sensors and Actuators

Dialog Semiconductor's latest IO-Link IC integrates advanced circuit protection and low power dissipation into a 3 mm x 3 mm package.


News Feb 26, 2020 by Robin Mitchell
Nordic Semiconductor’s RF System-on-Chip Supports Standard and Proprietary Protocols

Nordic Semiconductor’s RF System-on-Chip Supports Standard and Proprietary Protocols

This article briefly reviews some important principles of power-supply design before discussing the features of the nRF5340.


News Feb 22, 2020 by Robert Keim
Murata Debuts “World’s Smallest LoRa Module”

Murata Debuts “World’s Smallest LoRa Module”

The Type 1SJ is designed for ISM bands ranging from 868 MHz to 916 MHz, including those employed in the US, Europe, and Asia.


News Feb 04, 2020 by Gary Elinoff
Upcoming embedded world 2020 Demonstrates the Latest Developments in Embedded System Technologies

Upcoming embedded world 2020 Demonstrates the Latest Developments in Embedded System Technologies

The embedded world Conference is the world’s leading meeting place for the embedded community, and it is returning again for its 18th year.


News Feb 03, 2020 by Luke James
Digilent’s New Dev Boards Help C and C++ Designers Interface With FPGA

Digilent’s New Dev Boards Help C and C++ Designers Interface With FPGA

Diligent’s Eclypse Z7 and Genesys ZU are designed to speed development for projects based on Xilinx’s Zynq-7000 and Zynq Ultrascale+.


News Jan 30, 2020 by Gary Elinoff
NXP Tacks On Near-field Communication to Two New Bluetooth MCUs

NXP Tacks On Near-field Communication to Two New Bluetooth MCUs

The QN9090 and QN9030 are Bluetooth low-energy (BLE) devices that integrate Arm Cortex-M4 CPUs.


News Jan 29, 2020 by Gary Elinoff
Toray Industries Communicates Wirelessly Across UHF Band With a Printed Semiconductor

Toray Industries Communicates Wirelessly Across UHF Band With a Printed Semiconductor

Toray Industries recently claimed that they were the first in the world to communicate wirelessly across the ultrahigh-frequency (UHF) band.


News Jan 27, 2020 by Lisa Boneta.
Google Unveils New and Updated Coral Hardware for 2020

Google Unveils New and Updated Coral Hardware for 2020

During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.


News Jan 13, 2020 by Cabe Atwell
CEVA Debuts Integrated Hardware and Software Platform for Contextually-aware IoT Devices

CEVA Debuts Integrated Hardware and Software Platform for Contextually-aware IoT Devices

SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.


News Jan 09, 2020 by Tyler Charboneau
ST Announces “First LoRa SoC,” Including Advanced Semtech Radio

ST Announces “First LoRa SoC,” Including Advanced Semtech Radio

The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.


News Jan 08, 2020 by Gary Elinoff
What’s New in Space? Components Designed to Weather Aerospace and Defense

What’s New in Space? Components Designed to Weather Aerospace and Defense

This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.


News Jan 05, 2020 by Hannah DeTavis