With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.
With a multi-billion dollar annual budget, the NSF is moving the needle in electrical engineering by funding research in universities and innovation in corporations.
Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max,…
Apple appears to dominate the market again with its newest generation of Apple silicon. Two chips, the M1 Pro & M1 Max, claim more than 2x the performance of the M1.
The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to…
The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and…
A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.
Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.
Ramping up chip R&D and manufacturing will also help industries that have been hard hit by the semiconductor supply shortage.
Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will…
Following a licensing agreement with X-Celeprint, X-FAB Silicon Foundries can now use a fabrication technique that will combine a wide range of semiconductors on a single 3D IC.
RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end…
RISC-V is often associated with embedded projects. Now, the open-source ISA may be a more common player in higher-end computing markets.
As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years…
As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years of development, Esperanto has announced its ET-SoC-1 ML inference chip.
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few…
At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC…
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design.…
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the…
RISC-V, the open-source instruction set architecture, is making inroads against industry giants, with the support of the RISC-V Foundation.
As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?
As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?
Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space…
Pushing technological limitations to extremes can cause benefits beyond its original scope. Looking back at past space technology, it is clear the effects they have had here on Earth.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
In an announcement clearly intended to draw in engineers and laymen alike, IBM heralds the arrival of tiny 2 nm chips…
In an announcement clearly intended to draw in engineers and laymen alike, IBM heralds the arrival of tiny 2 nm chips with 50 billion transistors apiece and the heir apparent to the age of FinFETs.
Two years after releasing the "world's largest computer chip," AI computing startup Cerebras Systems is upping the…
Two years after releasing the "world's largest computer chip," AI computing startup Cerebras Systems is upping the transistor punch from 1.2 trillion to 2.6 trillion.
This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations…
This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?
Intel has released a new processor for data center applications. How does this new x86 processor look compared to other…
Intel has released a new processor for data center applications. How does this new x86 processor look compared to other processor advancements?
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline…
In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.
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