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Since Three-Phase Motors Mean Triple the Components, TI Banks on Integration

Since Three-Phase Motors Mean Triple the Components, TI Banks on Integration

Texas Instruments claims its highly-integrated BLDC motor driver can reduce PCB area by as much as 30%—a possible catalyst for speeding mild-hybrid EV adoption.


News Feb 22, 2021 by Jake Hertz
Researchers Claim World’s First Terahertz IC May Leapfrog Past 5G to 6G

Researchers Claim World’s First Terahertz IC May Leapfrog Past 5G to 6G

Working closely with ROHM Semiconductor, researchers at Osaka University have developed a device that operates in the terahertz spectrum to transmit large, uncompressed 8K videos uninterrupted within a 300 GHz bandwidth.


5G Plus GNSS? u-blox Aims for the Best of Both Worlds in a Small SiP

5G Plus GNSS? u-blox Aims for the Best of Both Worlds in a Small SiP

u-blox’s newest technology integrates both GNSS and 5G onto the same package. We had the chance to sit down with Senior Product Manager Samuele Falcomer to get the details.


News Jan 26, 2021 by Jake Hertz
On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.


News Jan 25, 2021 by Adrian Gibbons
Researchers Claim Record-Breaking Speeds in New Optical Neuromorphic Chip

Researchers Claim Record-Breaking Speeds in New Optical Neuromorphic Chip

According to the researchers, this new type of optical neuromorphic processor can operate more than 1,000 times faster than any previous type of processor.


News Jan 17, 2021 by Luke James
DARPA “Toolbox” Lowers Barriers to Semiconductor IP for Researchers

DARPA “Toolbox” Lowers Barriers to Semiconductor IP for Researchers

Some challenges to EE research include tight budgets and limited access to reputable silicon IP. DARPA Toolbox hopes to open access to these resources to drive microelectronic innovation forward.


News Jan 13, 2021 by Tyler Charboneau
IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

IEEE Awards TSMC for 7nm Leadership. Where Is TSMC Going Next?

TSMC has been formally recognized by the IEEE with the 2021 IEEE Corporate Innovation Award. The 7nm node is just the beginning of TSMC's plans, though.


News Dec 17, 2020 by Luke James
New Test Chip Analyzing 3D Thin Film Structures Hits the Market

New Test Chip Analyzing 3D Thin Film Structures Hits the Market

Chipmetrics Oy, a Finnish company, has begun to commercialize a test chip for analyzing thin-film structures in 3D chips.


News Dec 01, 2020 by Jake Hertz
Department of Defense Backs New Secure Electron Beam Lithography Initiative

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.


News Nov 28, 2020 by Luke James
Security IC Solutions: Build or Buy?

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.


Chipmakers Petition for Language Change in Funding Bill to Include Mission-Critical Devices

Chipmakers Petition for Language Change in Funding Bill to Include Mission-Critical Devices

A bill currently going through Congress which would see semiconductor firms handed an extra $3 billion in funding could do more harm than good if its language isn’t modified, some defense firms have said.


News Nov 07, 2020 by Luke James
Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?


News Nov 06, 2020 by Dr. Steve Arar
A New Multimodal Architecture Said to Redefine the Way Transistors Work

A New Multimodal Architecture Said to Redefine the Way Transistors Work

Researchers at the University of Surrey have come up with a new type of transistor that offers linear behavior and huge upside.


News Nov 02, 2020 by Jake Hertz
Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

This summer, three major EDA companies have ramped up their software tools to better assist IC designers.


News Oct 19, 2020 by Jake Hertz
What is DrMOS—the IC Powering Next-Gen Processors?

What is DrMOS—the IC Powering Next-Gen Processors?

Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.


News Sep 30, 2020 by Adrian Gibbons
Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?


News Sep 29, 2020 by Jake Hertz
TSMC Reveals Ambitious Plans for Its 4nm and 3nm Processes

TSMC Reveals Ambitious Plans for Its 4nm and 3nm Processes

At the company’s very first online symposium, TSMC showcased a range of new technologies, including its N4 process, which is scheduled to come online in late 2021.


News Aug 26, 2020 by Luke James
RISC-V Celebrates 10 Years of Open-Source ISA

RISC-V Celebrates 10 Years of Open-Source ISA

On the heels of RISC-V’s 10th birthday, let's explore the history of RISC-V from its inception to today.


News Aug 25, 2020 by Jake Hertz
As Moore’s Law Ends, Samsung Releases 3D IC Technology

As Moore’s Law Ends, Samsung Releases 3D IC Technology

Samsung announced the availability of its 3D IC technology at both 7nm and 5nm. How does this technology help system designers?


News Aug 17, 2020 by Jake Hertz
Intel and Analog Devices Link Up to Streamline 5G Network Design

Intel and Analog Devices Link Up to Streamline 5G Network Design

The two RF powerhouses have teamed up to create a flexible radio platform that addresses 5G network design challenges.


News Aug 05, 2020 by Jake Hertz