Teledyne e2v’s CCD image sensor is headed to Mars on NASA's Perseverance Rover. Its mission? To investigate rock samples on the red planet for past signs of life.
Teledyne e2v’s CCD image sensor is headed to Mars on NASA's Perseverance Rover. Its mission? To investigate rock samples on the red planet for past signs of life.
As the co-founders of RISC-V, SiFive's level-up on processors could have significant implications for custom SoC design.
As the co-founders of RISC-V, SiFive's level-up on processors could have significant implications for custom SoC design.
Space radiation can wreak havoc on electronic devices. While there are many ways to prevent damage, MIT's newly-developed…
Space radiation can wreak havoc on electronic devices. While there are many ways to prevent damage, MIT's newly-developed manufacturing technique using rad-hard CMOS technology shows promise.
The von Neumann Architecture, which has been a staple in computer architecture, may soon find itself less useful in the…
The von Neumann Architecture, which has been a staple in computer architecture, may soon find itself less useful in the world of artificial intelligence.
Known as the American Foundries Act of 2020, this bill will award grants for microelectronics manufacturing, defense, and…
Known as the American Foundries Act of 2020, this bill will award grants for microelectronics manufacturing, defense, and R&D. What does this mean for U.S.-based EEs?
Samsung Electronics, in collaboration with Rescale, has just announced the launch of the Samsung Advanced Foundry…
Samsung Electronics, in collaboration with Rescale, has just announced the launch of the Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP).
With 5G around the corner, Nokia is boosting SoC processing power and intelligence with the help of Broadcom, Marvell, and Intel.
With 5G around the corner, Nokia is boosting SoC processing power and intelligence with the help of Broadcom, Marvell, and Intel.
The joint efforts of GigaDevice and IAR Systems may speed the development time when working with RISC-V.
The joint efforts of GigaDevice and IAR Systems may speed the development time when working with RISC-V.
One defective component can snowball into 1,000 defective vehicles. That's why AEC-Q100 has an iron fist on automotive standards.
One defective component can snowball into 1,000 defective vehicles. That's why AEC-Q100 has an iron fist on automotive standards.
Remote work during this pandemic has shed light anew on the virtues of RISC-V, which has just gotten more accessible.
Remote work during this pandemic has shed light anew on the virtues of RISC-V, which has just gotten more accessible.
Responding to the US government's request for more US chip factories earlier this week, TSMC has announced plans to cash…
Responding to the US government's request for more US chip factories earlier this week, TSMC has announced plans to cash out $12 billion for a fab house in Arizona.
The collaboration is fuelled by the desire to develop open-source standards that simplify security design for hardware…
The collaboration is fuelled by the desire to develop open-source standards that simplify security design for hardware developers and enhance the security of IoT devices.
Intel enthusiastically agreed; TSMC—not so much.
Intel enthusiastically agreed; TSMC—not so much.
Inspired by a need for faster COVID-19 testing, two research groups have hit a breakthrough: a new CMOS biosensor chip…
Inspired by a need for faster COVID-19 testing, two research groups have hit a breakthrough: a new CMOS biosensor chip that promises rapid, handheld DNA sequencing and viral/antibody testing.
Using existing IC fabrication technologies, scientists have figured out how to eliminate crosstalk among qubits on a 2D-plane.
Using existing IC fabrication technologies, scientists have figured out how to eliminate crosstalk among qubits on a 2D-plane.
How will different semiconductor sectors weather the COVID-19 storm?
How will different semiconductor sectors weather the COVID-19 storm?
One of the trickiest aspects of chip design is figuring out how to pack more circuitry into a smaller footprint while…
One of the trickiest aspects of chip design is figuring out how to pack more circuitry into a smaller footprint while maintaining power, speed, and energy efficiency.
Osaka University researchers have built a new device that can be customized by the user for maximum efficiency in AI applications.
Osaka University researchers have built a new device that can be customized by the user for maximum efficiency in AI applications.
Apple ultimately canceled its wireless power program because of coil alignment. Three new platforms aim to work around…
Apple ultimately canceled its wireless power program because of coil alignment. Three new platforms aim to work around the problem that slowed the tech giant down.
In this article, we'll assess a few examples of new ASICs on the market that may be of use to designers working with…
In this article, we'll assess a few examples of new ASICs on the market that may be of use to designers working with 5G-bound designs.
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