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Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

This summer, three major EDA companies have ramped up their software tools to better assist IC designers.


News Oct 19, 2020 by Jake Hertz
What is DrMOS—the IC Powering Next-Gen Processors?

What is DrMOS—the IC Powering Next-Gen Processors?

Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.


News Sep 30, 2020 by Adrian Gibbons
Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Double the Protocols, Cut the Board Space: How Multi-Protocol SoCs are Simplifying IoT Design

Silicon Labs and STRATIS announced a collaboration to connect smart apartment complexes. What tech underlies this news?


News Sep 29, 2020 by Jake Hertz
TSMC Reveals Ambitious Plans for Its 4nm and 3nm Processes

TSMC Reveals Ambitious Plans for Its 4nm and 3nm Processes

At the company’s very first online symposium, TSMC showcased a range of new technologies, including its N4 process, which is scheduled to come online in late 2021.


News Aug 26, 2020 by Luke James
RISC-V Celebrates 10 Years of Open-Source ISA

RISC-V Celebrates 10 Years of Open-Source ISA

On the heels of RISC-V’s 10th birthday, let's explore the history of RISC-V from its inception to today.


News Aug 25, 2020 by Jake Hertz
As Moore’s Law Ends, Samsung Releases 3D IC Technology

As Moore’s Law Ends, Samsung Releases 3D IC Technology

Samsung announced the availability of its 3D IC technology at both 7nm and 5nm. How does this technology help system designers?


News Aug 17, 2020 by Jake Hertz
Intel and Analog Devices Link Up to Streamline 5G Network Design

Intel and Analog Devices Link Up to Streamline 5G Network Design

The two RF powerhouses have teamed up to create a flexible radio platform that addresses 5G network design challenges.


News Aug 05, 2020 by Jake Hertz
NASA Taps Teledyne CCD Image Sensors to Search for Past Life on Mars

NASA Taps Teledyne CCD Image Sensors to Search for Past Life on Mars

Teledyne e2v’s CCD image sensor is headed to Mars on NASA's Perseverance Rover. Its mission? To investigate rock samples on the red planet for past signs of life.


SiFive, Co-Founder of RISC-V, Unveils Major Upgrades to RISC-V-Based Processors

SiFive, Co-Founder of RISC-V, Unveils Major Upgrades to RISC-V-Based Processors

As the co-founders of RISC-V, SiFive's level-up on processors could have significant implications for custom SoC design.


News Jul 25, 2020 by Vanessa Samuel
Radiation Plus Electronics is a Bad Combo. Enter a New Rad-Hard Manufacturing Method

Radiation Plus Electronics is a Bad Combo. Enter a New Rad-Hard Manufacturing Method

Space radiation can wreak havoc on electronic devices. While there are many ways to prevent damage, MIT's newly-developed manufacturing technique using rad-hard CMOS technology shows promise.


News Jul 13, 2020 by Jake Hertz
AI Chip Strikes Down the von Neumann Bottleneck With In-Memory Neural Net Processing

AI Chip Strikes Down the von Neumann Bottleneck With In-Memory Neural Net Processing

The von Neumann Architecture, which has been a staple in computer architecture, may soon find itself less useful in the world of artificial intelligence.


News Jul 10, 2020 by Jake Hertz
New Senate Bill Proposes to Pump $25 Billion Into U.S. Semiconductor Industry

New Senate Bill Proposes to Pump $25 Billion Into U.S. Semiconductor Industry

Known as the American Foundries Act of 2020, this bill will award grants for microelectronics manufacturing, defense, and R&D. What does this mean for U.S.-based EEs?


News Jul 03, 2020 by Jake Hertz
IC Designers Now Have a Platform to Design Chips in the Cloud

IC Designers Now Have a Platform to Design Chips in the Cloud

Samsung Electronics, in collaboration with Rescale, has just announced the launch of the Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP).


News Jun 22, 2020 by Jake Hertz
Nokia Taps Three Major Chip Vendors for Customized 5G Chipset

Nokia Taps Three Major Chip Vendors for Customized 5G Chipset

With 5G around the corner, Nokia is boosting SoC processing power and intelligence with the help of Broadcom, Marvell, and Intel.


News Jun 17, 2020 by Gary Elinoff
A New Partnership Brings Professional Dev Tools to RISC-V Microcontrollers

A New Partnership Brings Professional Dev Tools to RISC-V Microcontrollers

The joint efforts of GigaDevice and IAR Systems may speed the development time when working with RISC-V.


News Jun 04, 2020 by Gary Elinoff
What Designers Should Know About AEC-Q100

What Designers Should Know About AEC-Q100

One defective component can snowball into 1,000 defective vehicles. That's why AEC-Q100 has an iron fist on automotive standards.


News May 29, 2020 by Tyler Charboneau
COVID-19 Puts Spotlight on Open-Source RISC-V Cores, IP

COVID-19 Puts Spotlight on Open-Source RISC-V Cores, IP

Remote work during this pandemic has shed light anew on the virtues of RISC-V, which has just gotten more accessible.


TSMC Responds to Pressure for US-Based Fab, Announces Plans for $12 Billion Chip Factory in Arizona

TSMC Responds to Pressure for US-Based Fab, Announces Plans for $12 Billion Chip Factory in Arizona

Responding to the US government's request for more US chip factories earlier this week, TSMC has announced plans to cash out $12 billion for a fab house in Arizona.


News May 15, 2020 by Hannah DeTavis
RISC-V International Partners with GlobalPlatform to Simplify Security Design for IoT Devices and Processors

RISC-V International Partners with GlobalPlatform to Simplify Security Design for IoT Devices and Processors

The collaboration is fuelled by the desire to develop open-source standards that simplify security design for hardware developers and enhance the security of IoT devices.


News May 15, 2020 by Luke James
US Government Approaches the Big Three—TSMC, Intel, Samsung—to Build US Chip Factories

US Government Approaches the Big Three—TSMC, Intel, Samsung—to Build US Chip Factories

Intel enthusiastically agreed; TSMC—not so much.


News May 12, 2020 by Gary Elinoff