Latest IC Design News

In this article, we'll take a closer look at recently available smartphone chips and how these chips are responding to…

In this article, we'll take a closer look at recently available smartphone chips and how these chips are responding to higher demands of processing and memory.

The ISL70005SEH, geared for satellite orbit, incorporates both a synchronous buck converter and a low dropout (LDO)…

The ISL70005SEH, geared for satellite orbit, incorporates both a synchronous buck converter and a low dropout (LDO) regulator in one monolithic IC.

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.

Five thousand industry professionals and more than 175 suppliers will be on hand to present their latest design tools,…

Five thousand industry professionals and more than 175 suppliers will be on hand to present their latest design tools, technologies, and new advancements.

Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.

Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.

The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.

The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.

Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home…

Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.

The TouchPoint ultrasound sensor utilizes sound waves to turn any surface into a touchscreen, eliminating the need for…

The TouchPoint ultrasound sensor utilizes sound waves to turn any surface into a touchscreen, eliminating the need for physical buttons.

Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.

Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.

The Core-V Chassis evaluation SoC will feature a CV64A 64-bit core and a CV32E 32-bit coprocessor core as well as 3D and 2D GPUs.

The Core-V Chassis evaluation SoC will feature a CV64A 64-bit core and a CV32E 32-bit coprocessor core as well as 3D and 2D GPUs.

Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.

Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design…

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.

Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that…

Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that offers inference solutions for AI acceleration.

The new 7nm SoC is the first device in a chipset family offering integrated 5G modems.

The new 7nm SoC is the first device in a chipset family offering integrated 5G modems.

These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC…

These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC prototyping.

Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT…

Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.

Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers,…

The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.

The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.

The MLX90821 measures pressures that dip down to 50 mbars in the EVAP systems of internal combustion or hybrid engines.