Infineon has announced a new family of ferroelectric RAM—an energy-efficient, non-volatile memory solution designed for data-critical applications.
Infineon has announced a new family of ferroelectric RAM—an energy-efficient, non-volatile memory solution designed for data-critical applications.
BeBop Sensors has released a new reference design dubbed “RoboSkin” to provide a highly sensitive sense of touch to…
BeBop Sensors has released a new reference design dubbed “RoboSkin” to provide a highly sensitive sense of touch to the next generation of advanced robots.
Wolfspeed, STMicroelectronics, SK Siltron, and Onsemi have independently announced new efforts to bolster the SiC supply…
Wolfspeed, STMicroelectronics, SK Siltron, and Onsemi have independently announced new efforts to bolster the SiC supply chain over the next five years.
Eliminating cost/performance trade offs, Rohde & Schwarz has unveiled an oscilloscope that does 12-bit resolution across…
Eliminating cost/performance trade offs, Rohde & Schwarz has unveiled an oscilloscope that does 12-bit resolution across all sample speeds and a 4.5 million waveform/sec update rate.
The new partnership will give startups and research labs access to valuable R&D resources—particularly with open-source chips.
The new partnership will give startups and research labs access to valuable R&D resources—particularly with open-source chips.
It's finally Friday, which means Industry Tech Days 2022 is on its last day! Check out our final Keynote made up of an…
It's finally Friday, which means Industry Tech Days 2022 is on its last day! Check out our final Keynote made up of an executive panel.
Using a modified microwave oven, a team of Cornell researchers have solved a limiting challenge in semiconductor manufacturing.
Using a modified microwave oven, a team of Cornell researchers have solved a limiting challenge in semiconductor manufacturing.
In yet another win for RISC-V, Intel has released a program to bolster the pre-silicon development of RISC-V devices.
In yet another win for RISC-V, Intel has released a program to bolster the pre-silicon development of RISC-V devices.
Propelled by the CHIPS and Science Act, the new fab based in Boise, Idaho, will generate 2,000 new jobs at Micron and…
Propelled by the CHIPS and Science Act, the new fab based in Boise, Idaho, will generate 2,000 new jobs at Micron and 17,000 new jobs in side sectors.
Setting out to enter the high-end processing niche within RISC-V, startup LeapFive has unveiled a quad-core 1.8 GHz RISC-V SoC.
Setting out to enter the high-end processing niche within RISC-V, startup LeapFive has unveiled a quad-core 1.8 GHz RISC-V SoC.
With wildfires causing historic levels of damage, developers are enlisting sensors and artificial intelligence (AI) to…
With wildfires causing historic levels of damage, developers are enlisting sensors and artificial intelligence (AI) to help fight, mitigate, and prevent these catastrophes.
Digi-Key Electronics opened its new distribution center this week at its headquarters. The new facility triples the…
Digi-Key Electronics opened its new distribution center this week at its headquarters. The new facility triples the location’s shipping rate to 81,000 boxes per day of electronic parts.
OmniVision keeps shrinking the pixel size of its complementary metal-oxide semiconductor (CMOS) image sensors by…
OmniVision keeps shrinking the pixel size of its complementary metal-oxide semiconductor (CMOS) image sensors by introducing its latest sensor with the "world’s smallest" pixel size.
Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth…
Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.
InnovationLab says its additive PCB process is more energy efficient and produces less waste than traditional PCB…
InnovationLab says its additive PCB process is more energy efficient and produces less waste than traditional PCB manufacturing methods.
A go-ahead has been given to the CHIPS and Science Act as President Biden signed off the law on Tuesday.
A go-ahead has been given to the CHIPS and Science Act as President Biden signed off the law on Tuesday.
Join your engineering community peers and take our EETech 2022 Global Engineering Survey. You’ll get a summary of the…
Join your engineering community peers and take our EETech 2022 Global Engineering Survey. You’ll get a summary of the results once they’re released. And you’ll be entered for a chance to win an Amazon card prize!
The new MPU family hopes to address traditional challenges in the design of HMI systems.
The new MPU family hopes to address traditional challenges in the design of HMI systems.
A new wave of time-of-flight (ToF) sensors are finding use in applications such as PCs, smart door lock facial…
A new wave of time-of-flight (ToF) sensors are finding use in applications such as PCs, smart door lock facial recognition, 3D image sensing, and more.
With the go-ahead for the CHIPS+ Act in place, manufacturers are laying down plans for U.S. fab sites.
With the go-ahead for the CHIPS+ Act in place, manufacturers are laying down plans for U.S. fab sites.
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