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Vehicle Networking Startup Ethernovia Secures $64 Million Funding

Vehicle Networking Startup Ethernovia Secures $64 Million Funding

As validation of its technology, Ethernovia recently raised a large sum in its A-round financing.


News May 26, 2023 by Jake Hertz
Broadcom to Supply Apple’s 5G Components in the US

Broadcom to Supply Apple’s 5G Components in the US

Despite Apple’s internal efforts, the company still needs to rely on third parties for wireless chips.


News May 24, 2023 by Jake Hertz
Ethernet Turns 50 Today: A Day to Review the Feats of Robert Metcalfe, Co-Inventor of Ethernet

Ethernet Turns 50 Today: A Day to Review the Feats of Robert Metcalfe, Co-Inventor of Ethernet

50 years ago today, on May 22, 1973, Robert Metcalfe wrote a memo to management at Xerox Palo Alto Research Center explaining how Ethernet could work.


News May 22, 2023 by Chantelle Dubois
5G Base-Station-on-a-Chip Company EdgeQ Closes $75M in Series-B Funding

5G Base-Station-on-a-Chip Company EdgeQ Closes $75M in Series-B Funding

With its 5G base-station-on-a-chip SoC leading the way, EdgeQ has closed a $75 million round of investment funding.


News Apr 19, 2023 by Jeff Child
TI Launches Pair of Wi-Fi 6 Companion ICs to Serve IoT System Designs

TI Launches Pair of Wi-Fi 6 Companion ICs to Serve IoT System Designs

As Wi-Fi 6-enabled IoT devices proliferate into the billions, TI’s new Wi-Fi 6 companion chips are aimed at meeting the challenges associated with this crowded landscape.


News Apr 18, 2023 by Jeff Child
Semtech Unveils Chip That Eases 5G Mobile Device Compliance

Semtech Unveils Chip That Eases 5G Mobile Device Compliance

A new IC from Semtech hopes to improve 5G device performance in the face of Specific Absorption Rate compliance.


News Apr 17, 2023 by Jake Hertz
Modules and Dev Kits Emerge for Building Amazon Sidewalk Devices

Modules and Dev Kits Emerge for Building Amazon Sidewalk Devices

As the company opens Sidewalk up for testing, the service from Amazon could have big implications in the IoT and smart home space.


News Mar 29, 2023 by Jake Hertz
Startup Enfabrica’s Accelerated Compute Fabric Addresses AI/ML in the Cloud

Startup Enfabrica’s Accelerated Compute Fabric Addresses AI/ML in the Cloud

The networking silicon and software company emerged from stealth mode today at the inaugural MemCon, where it is introducing new Accelerated Compute Fabric (ACF) devices with the goal of addressing interface bottlenecks and scalability challenges in AI computing.


News Mar 28, 2023 by Dale Wilson
From a New Chip to Broader Ranges—The Push for Terahertz Technology Continues

From a New Chip to Broader Ranges—The Push for Terahertz Technology Continues

Since terahertz technology is being looked at as the next step toward 6G, companies like Cannon, universities such as Harvard, and agencies like NASA aim to keep this technology advancing.


News Mar 18, 2023 by Kristijan Nelkovski
Silicon Labs Spins Bluetooth SoC and MCU for Small Form-factor Designs

Silicon Labs Spins Bluetooth SoC and MCU for Small Form-factor Designs

With a goal of serving the design needs of small form-factor embedded systems, Silicon Labs is rolling out families of MCUs and wireless SoCs in tiny packages.


News Mar 17, 2023 by Jeff Child
Ahead of MWC 2023, AMD Unveils RF SoC Duo for 4G/5G Radio Unit Designs

Ahead of MWC 2023, AMD Unveils RF SoC Duo for 4G/5G Radio Unit Designs

Targeting emerging 4G/5G radio unit markets, AMD has released two new members of its Zynq UltraScale+ RFSoC digital front-end (DFE) family.


News Feb 23, 2023 by Jeff Child
Qualcomm and SES-imagotag Team to Leverage New Bluetooth ESL Standard

Qualcomm and SES-imagotag Team to Leverage New Bluetooth ESL Standard

Industry leaders have their sights set on standardizing smart store labels using the latest Bluetooth SIG standard.


News Feb 20, 2023 by Aaron Carman
MIT and Caltech Team Up on Ingestible Sensor That Pinpoints GI Issues

MIT and Caltech Team Up on Ingestible Sensor That Pinpoints GI Issues

The two powerhouse research centers developed an ingestible capsule containing a magnetic sensor and wireless transmitter to monitor GI motility.


News Feb 17, 2023 by Jake Hertz
Share Files With a Fist Bump: Wi-R Confines Signal to a User’s Body

Share Files With a Fist Bump: Wi-R Confines Signal to a User’s Body

The latest wireless protocol ditches radiation and focuses on a new medium: your body.


News Feb 14, 2023 by Aaron Carman
IoT Modules and Dev Kits Enable Low-power, Edge Device Designs

IoT Modules and Dev Kits Enable Low-power, Edge Device Designs

Serving up low-power wireless connectivity, high-performance computing, and comprehensive development resources, this batch of IoT modules, SoCs, and dev boards smooth the way for IoT system designers.


News Feb 13, 2023 by Jeff Child
For Tonight’s Big Game, Thank the Navy for Sharing Its Broadband Spectrum

For Tonight’s Big Game, Thank the Navy for Sharing Its Broadband Spectrum

When Kansas City squares off against Philadelphia at the Big Game tonight, the NFL will have access to the Citizen Broadband Radio System as a safety net in case of internet failure.


News Feb 12, 2023 by Chantelle Dubois
Fabless FPGA/eFPGA Players Ramp up Their Innovations—a Roundup

Fabless FPGA/eFPGA Players Ramp up Their Innovations—a Roundup

With products built on some of the most advanced semiconductor fab processes—like TSMC’s 7 nm node—fabless FPGA/eFPGA providers are rolling out new updated open-source tools, new devices, and new IP.


News Feb 08, 2023 by Jeff Child
IEEE RWW Keynotes: Future of RF Looks Rocky and That’s a Good Thing

IEEE RWW Keynotes: Future of RF Looks Rocky and That’s a Good Thing

At IEEE Radio and Wireless Week (RWW), keynote speakers highlighted the trends in RF and wireless technology, and how design engineers must adapt to meet the new challenges head on.


News Feb 02, 2023 by Aaron Carman
IEEE Radio and Wireless Week Panel: Getting to D-Band is a Group Effort

IEEE Radio and Wireless Week Panel: Getting to D-Band is a Group Effort

At IEEE Radio and Wireless Week 2023, industry leaders in chip fabrication and measurement engaged in a panel discussion to give engineers their opinions on the future of D-band technology.


News Jan 30, 2023 by Aaron Carman
Matter Protocol Multiverse Grows with SoCs, Dev Kits, and Design Wins

Matter Protocol Multiverse Grows with SoCs, Dev Kits, and Design Wins

Leveraging the Matter 1.0 protocol, companies are rolling out solutions for engineers to build next-gen interoperable smart home and IoT devices.


News Jan 27, 2023 by Abdulwaliy Oyekunle