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5 V MCUs and 5 V Tolerant MCUs—What’s the Difference and Why It Matters

5 V MCUs and 5 V Tolerant MCUs—What’s the Difference and Why It Matters

5 V microcontrollers vs. 5 V Tolerant microcontrollers: That single word is a massive differentiator. Learn the crucial difference between supply voltage and I/O tolerance for predictable 5 V logic design.


Gigadevice Targets HMI and Edge Designs with New MCU Series

Gigadevice Targets HMI and Edge Designs with New MCU Series

Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.


News May 06, 2026 by Austin Futrell
Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data centers, and upcoming 5G networks.


News May 06, 2026 by Duane Benson
Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Google Cloud split the TPU line into training and inference variants, with Arm Neoverse-based Axion CPUs as the host across the stack. Arm also rolled out Performix, a free performance toolkit aimed at the silicon's growing developer base.


News May 05, 2026 by Luke James
TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.


News May 05, 2026 by Duane Benson
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


NXP Semiconductors FRDM-MCXW23 Development Board | New Product Brief

NXP Semiconductors FRDM-MCXW23 Development Board | New Product Brief

NXP Semiconductors FRDM-MCXW23 Development Board is a compact and flexible platform designed for rapid Bluetooth® Low Energy 5.3 prototyping and embedded system development. Watch and learn all about their features, specs, applications, and more!


HARTING ix Industrial® IP20 PushPull Cables | New Product Brief

HARTING ix Industrial® IP20 PushPull Cables | New Product Brief

HARTING ix Industrial® IP20 PushPull Cables provide compact, high-performance connectivity for demanding industrial Ethernet applications. Watch and learn all about their features, specs, applications, and more!


TE Connectivity 1.25mm HPI Wire-to-Board Connectors | Featured Product Spotlight

TE Connectivity 1.25mm HPI Wire-to-Board Connectors | Featured Product Spotlight

TE Connectivity 1.25mm HPI Wire-to-Board Connectors provide compact, high-reliability interconnect solutions for signal and low-power applications in space-constrained designs. Watch and learn all about their features, specs, applications, and more!


Congatec Module Adds NPU-Based AI to Entry-Level x86 Embedded Designs

Congatec Module Adds NPU-Based AI to Entry-Level x86 Embedded Designs

The module brings Intel's NPU-integrated processors to entry-level x86 systems, scaling edge AI performance and simplifying integration and long-term upgrades.


News May 04, 2026 by Joshua Tidwell
Toshiba Collapses MCU, Motor Driver, and Sensorless Control Into One IC

Toshiba Collapses MCU, Motor Driver, and Sensorless Control Into One IC

The new motor control device simplifies high-efficiency brushless DC systems by combining a 32-bit processor with a specialized hardware vector engine.


News May 04, 2026 by Jake Hertz
Understanding the Hogge Detector and the Triwave Solution

Understanding the Hogge Detector and the Triwave Solution

The Hogge phase detector plays multiple roles in CDR circuits. In this article, we'll explore the Hogge detector's behavior, highlight its main drawbacks, and introduce a different configuration that addresses them.


ST’s New High-Precision Op Amp Takes Aim at the 4 V to 36 V Range

ST’s New High-Precision Op Amp Takes Aim at the 4 V to 36 V Range

The dual operational amplifier offers 20-µV precision across a wide 36-V supply range, eliminating the need for complex compensation in industrial and automotive signal chains.


News May 01, 2026 by Jake Hertz
Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

The new ADAA245x series increases bandwidth by 400 percent and introduces Ethernet tunneling for software-defined vehicles.


News May 01, 2026 by Jake Hertz
Research Roundup: Earbud Heart Monitors, Aging on a Chip, and More

Research Roundup: Earbud Heart Monitors, Aging on a Chip, and More

New biomedical technologies use earbuds, light-driven interfaces, and microfluidic chips to improve heart monitoring and aging research.


News Apr 30, 2026 by Austin Futrell
How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

The CAN FD-capable part targets battery management systems and high-voltage industrial buses, integrating signal isolation with bus protection in a single package.


News Apr 29, 2026 by Luke James
Design and Performance of the Class D Output Stage for Piezo Drivers

Design and Performance of the Class D Output Stage for Piezo Drivers

In this article, we explore the operation of a Class D stage with a capacitive load and how it can be used in piezo amplifier design.


Higher Volts, Smaller Caps: New MLCCs for Auto, Aero, and Defense

Higher Volts, Smaller Caps: New MLCCs for Auto, Aero, and Defense

Discover how the latest MLCCs from Samsung, Murata, and Kyocera are tackling extreme environments through unprecedented power density and miniaturization.


News Apr 28, 2026 by Duane Benson
Littelfuse 59150 Flange-Mounting Reed Sensors | New Product Brief

Littelfuse 59150 Flange-Mounting Reed Sensors | New Product Brief

Littelfuse 59150 Flange-Mounting Reed Sensors deliver reliable magnetic proximity sensing for industrial and commercial applications requiring durable, long-lasting performance. Watch and learn all about their features, specs, applications, and more!