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APEC 2019 Focuses on the Needs of the Practical, Practicing Power Engineer

APEC 2019 Focuses on the Needs of the Practical, Practicing Power Engineer

Learn what's in store and get the latest power engineering news from AAC reporting live from the conference.


News Mar 18, 2019 by Gary Elinoff
Micron Multichip Packages | New Product Brief

Micron Multichip Packages | New Product Brief

Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.


Can Near Field Communication Be Secure In the IoT? NXP’s New NFC Tag Aims For Highest Security

Can Near Field Communication Be Secure In the IoT? NXP’s New NFC Tag Aims For Highest Security

Despite security fears, RFID and NFC use is growing. NXP aims to make NFC more secure with its NTAG 424 DNA.


News Mar 16, 2019 by Baker Lawley
New Dual Simultaneous Sampling ADCs from ADI Feature On-Chip Oversampling Blocks

New Dual Simultaneous Sampling ADCs from ADI Feature On-Chip Oversampling Blocks

This article looks at two new A/D converters from Analog Devices: the AD7380 and AD7381.


News Mar 15, 2019 by Dr. Steve Arar
NXP EVB Evaluation Boards | New Product Brief

NXP EVB Evaluation Boards | New Product Brief

NXP S32K EVB evaluation boards can be used for quick prototyping and demonstration of applications using the S32K116 and S32K118 MCUs.


Time-To-Digital Converters Emerge as Key Components in Autonomous Vehicles

Time-To-Digital Converters Emerge as Key Components in Autonomous Vehicles

See how advancements in resolution and power consumption spur new applications in flow meters and LIDAR.


News Mar 14, 2019 by Gary Elinoff
New STMicro BLDC Controller Takes a Highly Integrated Approach to Motor Control

New STMicro BLDC Controller Takes a Highly Integrated Approach to Motor Control

Take a closer look at the STSPIN32F0B SiP from STMicroelectronics.


News Mar 14, 2019 by Robert Keim
ISI BGA Reballing | Tech Specs

ISI BGA Reballing | Tech Specs

ISI offers BGA reballing that includes removing the lead-free solder balls, then attaching eutectic tin-lead solder balls or other special solder ball alloys.


new products Mar 14, 2019 by TTI, Inc
What Are the DNL and INL Specifications of a DAC? Non-Linearity in Digital-to-Analog Converters

What Are the DNL and INL Specifications of a DAC? Non-Linearity in Digital-to-Analog Converters

This article looks at the DNL and INL specifications of a digital-to-analog converter (DAC).


New Mesh Networking Products Expand Use Cases for Connected Devices

New Mesh Networking Products Expand Use Cases for Connected Devices

Learn how mesh networking, with low power needs and fast deployment, may be crucial in IoT and automation.


News Mar 13, 2019 by Gary Elinoff
STMicroelectronics STM32G0 32-Bit MCUs | New Product Brief

STMicroelectronics STM32G0 32-Bit MCUs | New Product Brief

STMicroelectronics STM32G0 32-bit MCUs are cost-effective MCUs for consumer and industrial applications.


New Displacement Sensor from Eye Vision Technology Claims Fastest and Highest Resolution 3D Scans

New Displacement Sensor from Eye Vision Technology Claims Fastest and Highest Resolution 3D Scans

The EyeScan AT 3D Max can measure the smallest details with a resolution of 1 µm, at speeds up to 100 kHZ.


News Mar 12, 2019 by Gary Elinoff
CKB-VM as a RISC-V Instruction Set: Inspiration, Design, and Benefits

CKB-VM as a RISC-V Instruction Set: Inspiration, Design, and Benefits

Learn about CKB-virtual machine (VM), which is a RISC-V instruction set that utilizes RISC-V's open-source instruction set architecture.


New Microcontroller from Maxim Targets Low-Power, Space-Constrained Consumer Electronics

New Microcontroller from Maxim Targets Low-Power, Space-Constrained Consumer Electronics

Maxim's new microcontroller supports a wide supply-voltage range and consumes 0.2 µA in low-power mode.


News Mar 12, 2019 by Robert Keim
Taiyo Yuden Bluetooth Low Energy 5.0 Module | New Product Brief

Taiyo Yuden Bluetooth Low Energy 5.0 Module | New Product Brief

Taiyo Yuden’s EYSLSNZWW Bluetooth Low Energy 5.0 Module provides wireless connectivity and advanced processing in a compact package ideal for wearables and IoT devices.


The Operation and Characteristics of Voltage-Mode R-2R DACs

The Operation and Characteristics of Voltage-Mode R-2R DACs

This article looks at the voltage-mode R-2R DAC structure.


Microchip Announces New SAR ADC Family for the Toughest Automotive Environments

Microchip Announces New SAR ADC Family for the Toughest Automotive Environments

Microchip announces a new 16-bit SAR ADC family designed for tough automotive environments.


News Mar 11, 2019 by Gary Elinoff
New ams Time-to-Digital Converter Aims to Combine High Precision with Small Form Factor

New ams Time-to-Digital Converter Aims to Combine High Precision with Small Form Factor

ams has introduced the AS6500, which can provide high-sampling-rate time-to-digital conversion for optical rangefinder systems in automobiles, robots, and drones.


News Mar 10, 2019 by Robert Keim
RECOM Power RPM Low-Profile DC/DC Converters | New Product Brief

RECOM Power RPM Low-Profile DC/DC Converters | New Product Brief

RECOM Power RPM Low-Profile DC/DC Converters are compact, high density power modules for use in IoT, Industry 4.0, and Point-of-Load applications.


Phase Margin Estimation Using the Rate-of-Closure

Phase Margin Estimation Using the Rate-of-Closure

How can we gauge stability in a negative-feedback circuit? For minimum-phase circuits, try rate-of-closure.