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Infineon Gives PSoC Edge MCUs an Edge AI Upgrade With Nvidia TAO Support

Infineon Gives PSoC Edge MCUs an Edge AI Upgrade With Nvidia TAO Support

With the toolkit's integration, designers can more easily develop edge AI solutions on their PSoC MCUs.


News Mar 20, 2025 by Jake Hertz
Edge AI Meets Next-Gen Cooling: The Breakthrough of Silicon-Based Micro-Cooling Fans

Edge AI Meets Next-Gen Cooling: The Breakthrough of Silicon-Based Micro-Cooling Fans

MEMS-based miniature-fan technology can provide improved thermal performance, increased reliability, and reduced noise for advanced processors.


Renesas Adds Reconfigurable Processor With AI Accelerator to MPU Lineup

Renesas Adds Reconfigurable Processor With AI Accelerator to MPU Lineup

Unveiled at Embedded World, the new MPU targets endpoint dual-vision systems and delivers size and power-efficient fanless operation.


News Mar 18, 2025 by Duane Benson
IDTechEx Forecasts 8.6x Boom in the Photonic Integrated Circuit Market

IDTechEx Forecasts 8.6x Boom in the Photonic Integrated Circuit Market

Photonic integrated circuits (PICs) may be the way to expand beyond Moore’s law over the next decade.


News Mar 18, 2025 by Seth Price
Navigating the AI Revolution in Education, Workforce Development, and Government

Navigating the AI Revolution in Education, Workforce Development, and Government

Listen in as the Sr. Director for Artificial Intelligence Computing at NVIDIA shares his journey, AI's evolution, and its future impact on education, healthcare, and our lives.


MediaTek Redefines Generative AI at the Edge With Two IoT Platforms

MediaTek Redefines Generative AI at the Edge With Two IoT Platforms

IoT devices today have steep demands: fast edge processing, low power consumption, and advanced multimedia features. MediaTek aims to deliver on all of these fronts with two new platforms.


News Mar 17, 2025 by Jake Hertz
Ginni Rometty: The CEO Who Heralded IBM’s 21st Century Transformation

Ginni Rometty: The CEO Who Heralded IBM’s 21st Century Transformation

In this installment of Women's History Month spotlights, we highlight Ginni Rometty, IBM's CEO from 2012–2020, who led the company through a time of rapid digital transformation.


News Mar 17, 2025 by Luke James
Chipmakers and Research Power Houses Partner to Prep for AI Boom

Chipmakers and Research Power Houses Partner to Prep for AI Boom

In the next 10 years, the AI hardware market is projected to grow from $31 billion to $624 billion. Here's how companies and researchers are building resources to accommodate this new age of AI.


News Mar 14, 2025 by Luke James
ADI Expands CodeFusion Studio Toolset for Data Security and More

ADI Expands CodeFusion Studio Toolset for Data Security and More

With graphical system-level evaluation and enhanced data trust, the new CodeFusion Studio update may speed up and simplify edge software development.


News Mar 14, 2025 by Aaron Carman
AMD Shakes Up Chip Architecture In New Server-Grade Embedded Processors

AMD Shakes Up Chip Architecture In New Server-Grade Embedded Processors

Unveiled today at Embedded World, Cisco and IBM have already adopted the CPUs with their “Zen 5” architecture, which offers server-grade performance and efficiency.


News Mar 12, 2025 by Jake Hertz
Embedded World 2025: Altera Releases New FPGAs for Smart Edge Devices

Embedded World 2025: Altera Releases New FPGAs for Smart Edge Devices

In the face of shrinking electronics, Altera designed the Agilex 3 series to boost the brainpower of edge devices.


News Mar 11, 2025 by Aaron Carman
Synaptics Intros Multimodal Edge AI MCU and Triple Combo Wireless SoC

Synaptics Intros Multimodal Edge AI MCU and Triple Combo Wireless SoC

Announced today ahead of Embedded World, the new MCU families bring new possibilities to edge and connected devices.


News Mar 10, 2025 by Jake Hertz
A Preview of What’s Brewing for Embedded World 2025

A Preview of What’s Brewing for Embedded World 2025

Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show in Nuremberg, Germany.


News Mar 08, 2025 by Jeff Child
Amazon Debuts Its First Quantum Computing Chip for Error Correction

Amazon Debuts Its First Quantum Computing Chip for Error Correction

Ocelot uses bosonic cat qubits to correct errors with just nine physical qubits per logical qubit—far fewer than traditional surface codes.


News Mar 06, 2025 by Luke James
Flux Upgrade Graduates AI Assistant to AI Circuit Co-Designer

Flux Upgrade Graduates AI Assistant to AI Circuit Co-Designer

I gave Copilot's latest upgrade a trial run to see if artificial intelligence could take a circuit from idea to PCB layout. Here's what I found.


News Mar 06, 2025 by Duane Benson
Arm Singles Out Next-Gen IoT With New Edge AI Platform

Arm Singles Out Next-Gen IoT With New Edge AI Platform

Arm says the new platform brings the power of Armv9 technology across the gamut of computing, from edge to cloud.


News Mar 05, 2025 by Jake Hertz
Microchip Launches Advanced MPUs for HMI and Connectivity Applications

Microchip Launches Advanced MPUs for HMI and Connectivity Applications

The new MPUs may bring high-performance graphics, connectivity, and energy efficiency to industrial, medical, and logistics applications.


News Mar 03, 2025 by Joshua Tidwell
5 Industry Partnerships Driving AI and Computing Innovations

5 Industry Partnerships Driving AI and Computing Innovations

The applications for AI are diverse and manifold: Battery management, airline operations, networking, and beyond. Here are a few partnerships advancing its reach across industries.


News Feb 28, 2025 by Luke James
Intel Rounds Out Xeon 6 Portfolio With New CPUs for AI and Networking

Intel Rounds Out Xeon 6 Portfolio With New CPUs for AI and Networking

Intel says the new processors cover the “broadest set of workloads in the industry.”


News Feb 27, 2025 by Aaron Carman
ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility

ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility

The company demonstrated configurable, bandwidth-scalable heterogenous 2.5D interfaces across 20 chiplets from two foundries.


News Feb 24, 2025 by Duane Benson