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IBM Introduces Co-Packaged Optics, an Optical Link Packaging Scheme

IBM Introduces Co-Packaged Optics, an Optical Link Packaging Scheme

IBM believes its new research may increase the efficiency and density of generative AI computing.


News Jan 14, 2025 by Jake Hertz
Qualcomm Brings Leveled-Up Snapdragon X Platform to Next Wave of PCs

Qualcomm Brings Leveled-Up Snapdragon X Platform to Next Wave of PCs

Qualcomm's Snapdragon X Platform, announced at CES 2025, brings high-performance computing and advanced AI to affordable, miniature PCs.


News Jan 14, 2025 by Luke James
Intel Is Raining Edge AI Processors at CES 2025

Intel Is Raining Edge AI Processors at CES 2025

AI took center stage at CES 2025, with Intel showcasing its leadership through new Core and Core Ultra processors designed for AI-driven tasks.


News Jan 09, 2025 by Luke James
MediaTek Goes All In on First All Big Core Chip for Smartphones

MediaTek Goes All In on First All Big Core Chip for Smartphones

This chip includes an All Big Core CPU architecture, a seven‑core graphics engine, a generative AI NPU, HDR imaging, and a 5G modem.


News Jan 08, 2025 by Luke James
TI Reveals Radar Sensor and Audio ICs to Elevate Auto In-Cabin Designs

TI Reveals Radar Sensor and Audio ICs to Elevate Auto In-Cabin Designs

Announced today ahead of CES, Texas Instruments designed the mmWave radar sensor and two audio processors to cater to vehicles ranging from entry-level to luxury.


News Jan 06, 2025 by Jake Hertz
Industry Weighs in With 2025 Forecasts—Part 2: Company Predictions

Industry Weighs in With 2025 Forecasts—Part 2: Company Predictions

In part 2, we share predictions from a selection of companies on where they see themselves heading in 2025.


News Jan 01, 2025 by Jeff Child
Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

Industry Weighs in With 2025 Forecasts—Part 1: General Predictions

On this New Years Day, we share 2025 predictions from leading companies in our industry.


News Jan 01, 2025 by Jeff Child
Tradeshows Help Make This a People Business—A Look Back at Four 2024 Events

Tradeshows Help Make This a People Business—A Look Back at Four 2024 Events

Merry Christmas! Never forget that our business is a people business. Enjoy this review of four of the trade shows All About Circuits attended this year, and the great people we met.


News Dec 25, 2024 by Jeff Child
Everything Goes Up! Top Trends of 2024

Everything Goes Up! Top Trends of 2024

Three hot technologies are leading the way in continuing the Moore’s Law performance increases that can no longer be achieved by transistor scaling alone.


News Dec 23, 2024 by Dale Wilson
ST Adds ‘Most Powerful ST MCU To Date’ to Edge AI Portfolio

ST Adds ‘Most Powerful ST MCU To Date’ to Edge AI Portfolio

The new MCU brings neural acceleration to edge vision, audio, and other consumer and industrial edge applications.


News Dec 12, 2024 by Duane Benson
Harnessing the Power of a Software-Based Image Signal Processing Approach

Harnessing the Power of a Software-Based Image Signal Processing Approach

There are numerous advantages to leveraging a software-based image signal processor (ISP) approach. Learn the advantages and the solutions available to implement this technology.


Synopsys Unveils ‘Industry’s First’ Ultra Ethernet and UALink IP

Synopsys Unveils ‘Industry’s First’ Ultra Ethernet and UALink IP

Unveiled today, Synopsys' two new IP solutions allow up to a million nodes, each with 1,024 accelerators.


News Dec 11, 2024 by Duane Benson
Broadcom Reaches New Processing Heights With Stacked Die and Face-to-Face Chiplets

Broadcom Reaches New Processing Heights With Stacked Die and Face-to-Face Chiplets

The new configuration increases computing core area within the same overall processor package dimensions.


News Dec 09, 2024 by Duane Benson
Electronica 2024 Was Jammed Packed With Exciting Technologies and Products

Electronica 2024 Was Jammed Packed With Exciting Technologies and Products

Enjoy this selection of fascinating technology news from the recent Electronica 2024 trade show in Munich, Germany.


News Nov 28, 2024 by Jeff Child
What Are MRDIMMs? The Memory Tech Server Designers Are Talking About

What Are MRDIMMs? The Memory Tech Server Designers Are Talking About

A new memory technology has been sweeping the industry and bringing substantial performance gains with it.


News Nov 26, 2024 by Jake Hertz
Electronica Exclusive: Synaptics Makes Edge AI Pivot to Meet the IoT Evolution

Electronica Exclusive: Synaptics Makes Edge AI Pivot to Meet the IoT Evolution

The company is taking on a new role to embrace the world of IoT.


News Nov 25, 2024 by Jake Hertz
Lake Shore Cryotronics Introduces First SMU With Both DC and AC Sourcing

Lake Shore Cryotronics Introduces First SMU With Both DC and AC Sourcing

Announced at Electronica 2024 this week, the new source measurement unit measures nano-scale semiconductor device signals that would otherwise be drowned out by electrical noise.


News Nov 15, 2024 by Duane Benson
A Deep Dive on Winbond’s Memory Technology for Edge AI

A Deep Dive on Winbond’s Memory Technology for Edge AI

In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.


News Nov 13, 2024 by Jeff Child
Siemens Unwraps Electronic Systems Design Software With AI Enhancements

Siemens Unwraps Electronic Systems Design Software With AI Enhancements

The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative user experience.


News Nov 13, 2024 by Duane Benson
AMD First to Release FPGA Devices With CXL 3.1 and PCIe Gen6

AMD First to Release FPGA Devices With CXL 3.1 and PCIe Gen6

Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.


News Nov 12, 2024 by Jake Hertz