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Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors are high-precision, 24-bit isolated sensing solutions engineered for the rigorous demands of modern power management. Watch and learn all about their features, specs, applications, and more!


new products Feb 05, 2026 by Mouser
Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


Phoenix Contact E-Mobility CHARX Charge Inlets | New Product Brief

Phoenix Contact E-Mobility CHARX Charge Inlets | New Product Brief

Phoenix Contact E-Mobility CHARX Charge Inlets provide a high-power, versatile charging interface for electric and plug-in hybrid vehicles, supporting both continuous currents up to 250A and temporary boosts up to 500A. Watch and learn all about their features, specs, applications, and more!


new products Feb 03, 2026 by Mouser
Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Modular Architecture: The Key to Reliable EV Charging Infrastructure

Modular Architecture: The Key to Reliable EV Charging Infrastructure

Learn how modular design principles contribute to EV charger reliability, scalability, and maintenance for engineers planning charging networks.


Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors | Featured Product Spotlight

TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors | Featured Product Spotlight

TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors, are high-precision wire-to-board solutions engineered for space-constrained modern applications. Watch and learn all about their features, specs, applications, and more!


new products Jan 27, 2026 by Mouser
ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers | New Product Brief

ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers | New Product Brief

ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers are high-performance, compact gate driver solutions specifically engineered for the precise control of three-phase BLDC and PMSM motors. Watch and learn all about their features, specs, applications, and more!


new products Jan 27, 2026 by Mouser
Bulgin Vitalis Buccaneer Solutions | New Product Brief

Bulgin Vitalis Buccaneer Solutions | New Product Brief

Bulgin Vitalis Buccaneer Solutions represents a breakthrough in sustainable engineering, offering a rugged connectivity solution constructed with up to 86% bio-based content by weight. Watch and learn all about their features, specs, applications, and more!


new products Jan 26, 2026 by Mouser
Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz
Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Learn how evolving regulations, lifecycle security strategies, and quantum-ready cryptography are reshaping automotive cybersecurity.


Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.


News Jan 15, 2026 by Austin Futrell
Software-Defined Systems: Reshaping the Future of Modern Cars

Software-Defined Systems: Reshaping the Future of Modern Cars

This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and systems, enabling truly software-defined vehicles.


Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James
Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.


News Jan 12, 2026 by Jake Hertz
Ceva Expands Edge AI Portfolio From Wearables to SDVs

Ceva Expands Edge AI Portfolio From Wearables to SDVs

At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.


News Jan 12, 2026 by Jake Hertz
High-Performance Automotive Camera Connectivity | Tech Guide

High-Performance Automotive Camera Connectivity | Tech Guide

Explore high-performance automotive camera connectivity with TE Connectivity’s FAKRA and MATE-AX connectors. Watch now to get started!


new products Jan 07, 2026 by Mouser