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The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


A Dual 38W Power Amplifier: A Compact STA540-Based Stereo Audio Board

A Dual 38W Power Amplifier: A Compact STA540-Based Stereo Audio Board

This project brief describes how to build a compact dual-channel power amplifier module that delivers 38 W per channel into 4-ohm speakers using STMicroelectronics' STA540 audio amplifier IC.


Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.


News Jul 28, 2026 by Jeff Child
Understanding Noise in FM Systems: The Tone-Modulated Scenario, Part 1

Understanding Noise in FM Systems: The Tone-Modulated Scenario, Part 1

Explore how frequency-modulated waves resist interference. We break down the demodulator architecture and derive the exact output signal power for a sinusoidal message.


Why Supply Chain Visibility Is Becoming an Engineering Requirement

Why Supply Chain Visibility Is Becoming an Engineering Requirement

Hidden upstream dependencies can turn great product designs into costly delays. Discover why component sourcing risk must now be factored into early product decisions.


A Precision Multi-Sensor Data Acquisition Module

A Precision Multi-Sensor Data Acquisition Module

Build a low-noise, 32-bit delta-sigma ADC board designed around the ADS1262. This 10-channel design features integrated signal conditioning for RTDs, thermocouples, and strain gauges.


Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Understanding the Noise Performance of AM Receivers with Envelope Detection

Understanding the Noise Performance of AM Receivers with Envelope Detection

Envelope detection is simple, but that simplicity has a noise-performance cost. Here’s how much SNR conventional AM gives up compared to its coherent counterparts.


An Ultra-Low-Noise Pre-Amp For Audio Applications

An Ultra-Low-Noise Pre-Amp For Audio Applications

Build an ultra-low-noise preamplifier with a JFE150 JFET and OPA202 op-amp, perfect for high-impedance sensors, hydrophones, guitar pickups, microphones, and turntables.


STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
Analyzing the Noise Performance of Coherent SSB Demodulators

Analyzing the Noise Performance of Coherent SSB Demodulators

Using a graphical approach, we show that coherent SSB demodulation leaves the input and output SNR unchanged, then compare its noise performance to DSB-SC and baseband systems.


Toshiba Adds 60 V, 100 V N-Channel MOSFETs in 3 Compact Packages

Toshiba Adds 60 V, 100 V N-Channel MOSFETs in 3 Compact Packages

The 60 V and 100 V parts pair low on-resistance with small footprints as industrial systems migrate from 12 V and 24V rails toward 48 V distribution.


News Jul 10, 2026 by Luke James
Bourns High-Power Modular Contacts | Featured Product Spotlight

Bourns High-Power Modular Contacts | Featured Product Spotlight

Bourns High-Power Modular Contacts deliver compact, reliable, and scalable interconnect solutions for high-current applications in demanding environments. Watch and learn all about their features, specs, applications, and more!


Nordic’s Prototyping Tag to Streamline ‘Find My’ and Asset Tag Designs

Nordic’s Prototyping Tag to Streamline ‘Find My’ and Asset Tag Designs

The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.


News Jul 06, 2026 by Jake Hertz
Understanding SNR in DSB‑SC Coherent Detection: A Graphical Approach

Understanding SNR in DSB‑SC Coherent Detection: A Graphical Approach

Visualizing how correlated and uncorrelated signals combine offers an intuitive look at power transformation. See how this difference boosts baseband power to double the output SNR.


AI-Powered Compliance: Reducing Market Barriers for Electronics Manufacturers

AI-Powered Compliance: Reducing Market Barriers for Electronics Manufacturers

Learn how AI-powered compliance replaces manual, fragmented regulatory workflows with structured, automated data, dramatically lowering the cost of EU market entry for SMEs and manufacturers.


Designing a Tuneable Ultrasonic Filter

Designing a Tuneable Ultrasonic Filter

Learn how to build a constant-bandwidth band-pass filter covering 20 kHz to 60 kHz, with an integrated frequency counter for precise tuning.


Why Your PCB Design Review Process is Obsolete and How to Fix It

Why Your PCB Design Review Process is Obsolete and How to Fix It

Sending static PDFs and Gerbers for feedback is killing your project timelines and leading to costly PCB rework. Learn how to break down engineering silos and modernize your PCB design reviews.


ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child