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Analog Design Trade-Offs in Applying Linearization Techniques Using Example CMOS Circuits

Analog Design Trade-Offs in Applying Linearization Techniques Using Example CMOS Circuits

This article will look at the trade-offs we face when trying to improve the linearity of a circuit.


AI-focused Education Indicates That Industry 4.0 is Closer Than We Think

AI-focused Education Indicates That Industry 4.0 is Closer Than We Think

This article reviews how AI is making its way into education, which in turn may direct the future of Industry 4.0.


News Jan 11, 2020 by Cabe Atwell
CEVA Debuts Integrated Hardware and Software Platform for Contextually-aware IoT Devices

CEVA Debuts Integrated Hardware and Software Platform for Contextually-aware IoT Devices

SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.


News Jan 09, 2020 by Tyler Charboneau
NXP Makes Way for Software-upgradable Cars with New Vehicle Network Processor

NXP Makes Way for Software-upgradable Cars with New Vehicle Network Processor

NXP designed S32G, a vehicle network processor, to reduce software complexity and enhance data security.


News Jan 07, 2020 by Gary Elinoff
OmniVision Brands 4K Video Processor as Lowest Power Consuming SoC of Its Kind

OmniVision Brands 4K Video Processor as Lowest Power Consuming SoC of Its Kind

Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.


News Jan 06, 2020 by Gary Elinoff
Do Loongson Technologies’ Quad-Core Processors Rival AMD’s 28nm CPUs?

Do Loongson Technologies’ Quad-Core Processors Rival AMD’s 28nm CPUs?

Loongson’s 3A4000 and 3B000 processors were manufactured using ST’s 28nm FD-SOI process.


News Jan 06, 2020 by Cabe Atwell
What’s New in Space? Components Designed to Weather Aerospace and Defense

What’s New in Space? Components Designed to Weather Aerospace and Defense

This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.


News Jan 05, 2020 by Hannah DeTavis
AAEON’s Industrial Power Module Ramps Up Processing Power with 8th Gen Intel Core Processors

AAEON’s Industrial Power Module Ramps Up Processing Power with 8th Gen Intel Core Processors

The COM-WHUC6 module, measuring at 95mm x 95mm, can support up to 64GB of eMMC memory with two available DDR4 slots.


News Jan 03, 2020 by Gary Elinoff
UltraSense Systems’ “Smallest Ultrasound SoC” Designed to Turn Any Surface Into a User Interface

UltraSense Systems’ “Smallest Ultrasound SoC” Designed to Turn Any Surface Into a User Interface

The TouchPoint ultrasound sensor utilizes sound waves to turn any surface into a touchscreen, eliminating the need for physical buttons.


News Jan 03, 2020 by Cabe Atwell
Kumu Networks Reveals First Analog Finite Impulse Response Filter on a Chip

Kumu Networks Reveals First Analog Finite Impulse Response Filter on a Chip

The KU1500 is designed to allow radios to send and receive signals at the same time on the same or adjacent channels.


News Dec 31, 2019 by Gary Elinoff
PRO DESIGN Extends Family of FPGA-based Prototyping Modules

PRO DESIGN Extends Family of FPGA-based Prototyping Modules

The XCVU13P module incorporates 52 multi-gigabit transceivers for stable performance up to 32.75Gbps.


News Dec 26, 2019 by Gary Elinoff
Advanced Machine Learning with the Multilayer Perceptron

Advanced Machine Learning with the Multilayer Perceptron

This article explains why high-performance neural networks need an extra “hidden” layer of computational nodes.


 Maxim Calls Its Isolated SiC Gate Driver “Best in Class” for Reducing Power Loss by 30%

Maxim Calls Its Isolated SiC Gate Driver “Best in Class” for Reducing Power Loss by 30%

The MAX22701E features a typical 300kV/µs common-mode transient immunity (CMTI)—the "industry’s highest."


News Dec 18, 2019 by Gary Elinoff
Dialog Semiconductor Licenses Flex Logix’s Embedded FPGA Technology for High-volume ICs

Dialog Semiconductor Licenses Flex Logix’s Embedded FPGA Technology for High-volume ICs

Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.


News Dec 18, 2019 by Cabe Atwell
Xilinx SP701 Evaluation Kit | New Product Brief

Xilinx SP701 Evaluation Kit | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


How to Calibrate MCU Internal Oscillators

How to Calibrate MCU Internal Oscillators

This article describes the internal RC oscillator calibration mechanism available in low-end microcontroller units. A basic calibration procedure and considerations on automated calibration are presented.


Digi Launches a System-on-Module Based on NXP’s Applications Processor

Digi Launches a System-on-Module Based on NXP’s Applications Processor

The Digi ConnectCore 8M Nano SOM platform is designed to reduce time to market for sophisticated IoT designs.


News Dec 06, 2019 by Gary Elinoff
Utilizing INICnet for Automotive Networking and Connectivity

Utilizing INICnet for Automotive Networking and Connectivity

In this article, learn about INICnet and how it helps to solve the question of how designers can create a safe and effective connectivity method for vehicles.


AI Hardware Built from a Software-first Perspective: Groq’s Flexible Silicon Architecture

AI Hardware Built from a Software-first Perspective: Groq’s Flexible Silicon Architecture

Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that offers inference solutions for AI acceleration.


News Dec 03, 2019 by Majeed Ahmad
AXI Interconnects Tutorial: Multiple AXI Masters and Slaves in Digital Logic

AXI Interconnects Tutorial: Multiple AXI Masters and Slaves in Digital Logic

This article will explore AXI interconnects, the digital logic that allows multiple AXI masters and AXI slaves to communicate.