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Siemens EDA Launches Revamped Mixed-signal IC Verification Platform

Siemens EDA Launches Revamped Mixed-signal IC Verification Platform

At this week’s Design Automation Conference (DAC), Siemens EDA rolled out a next generation version of its mixed-signal IC verification tool adding new capabilities.


News Jul 12, 2022 by Jeff Child
Thermocouple Principles—the Seebeck Effect and Seebeck Coefficient

Thermocouple Principles—the Seebeck Effect and Seebeck Coefficient

Learn about the Seebeck effect, the Seebeck coefficient, and their relationship with temperature.


Microcontrollers Bulk Up with Added Security, TSN Support, and More

Microcontrollers Bulk Up with Added Security, TSN Support, and More

High expectations are placed on today’s microcontrollers (MCUs). To keep pace, MCU companies are beefing up peripheral mixes and security, while some are even adding time-sensitive networking (TSN).


News Jul 09, 2022 by Abdulwaliy Oyekunle
Introduction to Allan Variance—Non-overlapping and Overlapping Allan Variance

Introduction to Allan Variance—Non-overlapping and Overlapping Allan Variance

Learn about non-overlapping and overlapping Allan variance and how the Allan variance curve can be used to identify different types of random errors present in a signal.


onsemi NCP51561 5kVRMS Isolated Dual-Channel Gate Drivers | New Product Brief

onsemi NCP51561 5kVRMS Isolated Dual-Channel Gate Drivers | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.


Sensor ICs Suit Up to Play in EVs, RFIDs, and the IoT

Sensor ICs Suit Up to Play in EVs, RFIDs, and the IoT

New sensor innovations have emerged to play in market-specific zones. Among these are IS0-26262 electric vehicle (EV) sensors, RFID sensors, and sensors geared for the Internet of Things (IoT).


LiDAR’s Future Looks Bright With New Tech Demos at Sensors Converge 2022

LiDAR’s Future Looks Bright With New Tech Demos at Sensors Converge 2022

The All About Circuits team reviews just a couple of the many demonstrations of new LiDAR technologies from this week’s Sensors Converge conference in Silicon Valley.


News Jun 29, 2022 by Dale Wilson
Manufacturers Raise Concern as CHIPS Act Sits on Back Burner

Manufacturers Raise Concern as CHIPS Act Sits on Back Burner

The consequences of the semiconductor shortage are looming large as the CHIPS for America Act remains at a standstill.


News Jun 28, 2022 by Biljana Ognenova
Piezoelectric Accelerometers: IEPE Sensors vs. Charge Output Sensors

Piezoelectric Accelerometers: IEPE Sensors vs. Charge Output Sensors

Learn about integrated electronics piezoelectrics (IEPE) sensors, powering them, and how they compare to charge output (non-IEPE) systems.


TSMC Scales Down to 2nm Node, Announces New “FINFLEX” Architecture

TSMC Scales Down to 2nm Node, Announces New “FINFLEX” Architecture

At this year's North American Technology Symposium, TSMC announced new process nodes that may innovate chip design at an architectural level.


News Jun 23, 2022 by Jake Hertz
Semtech Cloud Service Simplifies LoRa IoT Asset Tracking

Semtech Cloud Service Simplifies LoRa IoT Asset Tracking

By moving location calculation to the cloud, Semtech’s new service allows for lower-power LoRa devices to be embedded in tracked Internet of Things (IoT) assets.


News Jun 22, 2022 by Jeff Child
AMD Ups Performance with 2nd-gen Ryzen Embedded SoC

AMD Ups Performance with 2nd-gen Ryzen Embedded SoC

Aimed at industrial IoT and vision systems, AMD’s new generation of its Ryzen Embedded R-Series SoCs, doubles core count, links to four 4K displays, and includes Windows 11 support.


News Jun 21, 2022 by Jeff Child
Rohm’s Latest LDO Regulator ICs Target Nanoscale Output Capacitance

Rohm’s Latest LDO Regulator ICs Target Nanoscale Output Capacitance

Tackling capacitor challenges, Rohm's latest low-dropout (LDO) regulators aim to offer stability in power supply circuits designed with low capacitance values.


News Jun 20, 2022 by Abdulwaliy Oyekunle
IoT Communication Protocols—IoT Data Protocols

IoT Communication Protocols—IoT Data Protocols

Dive deeper into the Internet of Things (IoT) communication through a brief overview of the different IoT data protocols.


Purdue University Kicks Off First Semiconductor Degrees Program

Purdue University Kicks Off First Semiconductor Degrees Program

With an eye on the semiconductor engineering shortage, Purdue University has launched a six-component flexible study program.


News Jun 15, 2022 by Biljana Ognenova
CUI Devices Pressure Sensors | Featured Product Spotlight

CUI Devices Pressure Sensors | Featured Product Spotlight

This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.


Intel Rethinks a Common Substrate to Combat Chip Shortage

Intel Rethinks a Common Substrate to Combat Chip Shortage

Intel is getting creative in how it addresses manufacturing slowdowns—this time, by doubling up on capacitors for both sides of the ABF substrate.


News Jun 13, 2022 by Jake Hertz
onsemi Launches Industry “First” Solutions for PoE and KNX

onsemi Launches Industry “First” Solutions for PoE and KNX

The new building automation solutions from onsemi aim to incorporate essential components that serve the needs of a modern smart home system


News Jun 13, 2022 by Abdulwaliy Oyekunle
Microchip Pushes First RISC-V-based SoC FPGA to Mass Production

Microchip Pushes First RISC-V-based SoC FPGA to Mass Production

Microchip continues the push for RISC-V hardware by reaching milestones with its PolarFire system-on-a-chip (SoC) field-programmable gate array (FPGA) and Mi-V ecosystem.


News Jun 10, 2022 by Jake Hertz
Silicon Lifecycle Management: Enabling Silicon Visibility Through Intelligent Analysis

Silicon Lifecycle Management: Enabling Silicon Visibility Through Intelligent Analysis

Learn about silicon lifecycle management (SLM), what it is, the EDA challenges involved, how it relates to SoC systems, and its overall benefits.