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Is Two Better Than One? Multi-beam Signals Target 5G Reliability and Throughput

Is Two Better Than One? Multi-beam Signals Target 5G Reliability and Throughput

Multipath signals are generally considered an undesirable noise source in RF links. Flipping conventional thinking on its head, UC San Diego Researchers are capitalizing on two beams being better than one.


News Aug 30, 2021 by Adrian Gibbons
Beyond HBM: Samsung Breaks Processing-in-memory Into AI Applications

Beyond HBM: Samsung Breaks Processing-in-memory Into AI Applications

AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these issues by combining processing-in-memory with high bandwidth memory.


Wearable Sensors Monitor Biometrics Underwater—and in Deep Tissue

Wearable Sensors Monitor Biometrics Underwater—and in Deep Tissue

Health wearables are one of the most in-demand consumer electronics. Here's a roundup of a few recent sensor-level innovations.


News Aug 29, 2021 by Ikimi .O
From Home to the Quantum Realm: 3 Companies Push Processor Limitations

From Home to the Quantum Realm: 3 Companies Push Processor Limitations

As the need for better, faster, and safer processing continues to grow, companies like Intel, Cadence, and QuantWare are bringing their A-game to the workplace, vehicles, and quantum computing.


News Aug 28, 2021 by Ikimi .O
Achronix’s Speedster7t FPGA Launches to the Next Level Thanks to Synopsys’ IP

Achronix’s Speedster7t FPGA Launches to the Next Level Thanks to Synopsys’ IP

Designing on silicon is expensive, which is why it's important to get it right on your first pass. Achieving just that is Achronix's Speedster7t FPGA for AI applications, with Synopsys' help.


News Aug 27, 2021 by Jake Hertz
IBM’s First CPU With On-chip AI Acceleration Detects Fraud at Lightning Speeds

IBM’s First CPU With On-chip AI Acceleration Detects Fraud at Lightning Speeds

Containing 22 billion transistors, IBM's new processor, Telum, features on-chip acceleration for AI inferencing. The goal: to detect fraud before a transaction is complete.


News Aug 27, 2021 by Adrian Gibbons
Update HDL Code in Space From Earth? ST and Xilinx Team Up for Rad-hard FPGAs

Update HDL Code in Space From Earth? ST and Xilinx Team Up for Rad-hard FPGAs

The race for space has created a flood of innovations in space-rated tech. Hoping to strike gold with updatable FPGAs, Xilinx and STMicroelectronics have teamed up for a rad-hard solution.


News Aug 26, 2021 by Jake Hertz
AI Accelerator Chip with 1000 RISC-V Cores Shakes Up Data Center Inference

AI Accelerator Chip with 1000 RISC-V Cores Shakes Up Data Center Inference

As the need for AI and data center processing keeps rising, a new AI accelerator has risen to the challenge. After years of development, Esperanto has announced its ET-SoC-1 ML inference chip.


News Aug 26, 2021 by Jake Hertz
Toasty Textiles: Researchers Weave Thermoelectric Generators Into Cotton

Toasty Textiles: Researchers Weave Thermoelectric Generators Into Cotton

Researchers are now diving into textile-based thermoelectric generators—a niche subfield of wearables.


News Aug 25, 2021 by Abdulwaliy Oyekunle
Intel Strikes Back: How CEO Pat Gelsinger Plans to Revive a Microchip Goliath

Intel Strikes Back: How CEO Pat Gelsinger Plans to Revive a Microchip Goliath

Despite many challenges, like companies moving to in-house chip fabrication and delays in processing node technology, Intel hopes to forge ahead with a new CEO and roadmap.


News Aug 25, 2021 by Tyler Charboneau
Highlights of Intel’s 2021 Architecture Day—a Computing-centric Event

Highlights of Intel’s 2021 Architecture Day—a Computing-centric Event

At Intel's 2021 Architecture Day, CEO Pat Gelsinger called the company's new computing technology "magic." Here are a few highlights from the event.


News Aug 24, 2021 by Jake Hertz
Qualcomm Brings ML and 5G Communication to Drones

Qualcomm Brings ML and 5G Communication to Drones

Communication is often a pain point in drone design. Now, Qualcomm says it is leveraging "swarm support" and its tensor accelerator to vault these challenges.


Coupled Inductors Boost Maxim’s Multi-Phase AI Chipset For Buck Design

Coupled Inductors Boost Maxim’s Multi-Phase AI Chipset For Buck Design

Aiming to address applications like AI, graphics processing, and networking ASICs, Maxim Integrated is tackling the demand for scalable high-density power with a multiphase buck & coupled inductor solution.


News Aug 23, 2021 by Adrian Gibbons
From Trolleys to e-Highways? Paving the Road to Eco-friendly Transportation

From Trolleys to e-Highways? Paving the Road to Eco-friendly Transportation

Hoping to take on long-haul trucking electrification, Siemens and Traton re-invent the cable car system and pantographs to create an e-Highway solution.


News Aug 21, 2021 by Biljana Ognenova
Dialog Designs New PMICs to Help Cars Be Smarter, Not Hotter

Dialog Designs New PMICs to Help Cars Be Smarter, Not Hotter

AI embedded processors are becoming a staple in next-gen vehicles. But this high level of processing also generates massive heat. Multiphase buck technology can mitigate the trade-off.


News Aug 20, 2021 by Jake Hertz
Sub-6G and mmWave Tech Cuts Through the Haze of 5G Antenna Design

Sub-6G and mmWave Tech Cuts Through the Haze of 5G Antenna Design

Antennas were once considered a passive element in the radio frontend. Now, just starting the 5G conversation requires active multiplexing and electronic beam steering.


News Aug 19, 2021 by Adrian Gibbons
Broadcom’s Cathy Liu Wins DesignCon 2021’s Engineer of the Year Award

Broadcom’s Cathy Liu Wins DesignCon 2021’s Engineer of the Year Award

With over 20 patents and leading roles in the EE community, Cathy Liu is voted DesignCon 2021's Engineer of the Year.


News Aug 19, 2021 by Jake Hertz
Can 3D NAND Flash Memory Side Step the Challenges of NAND?

Can 3D NAND Flash Memory Side Step the Challenges of NAND?

Traditional NAND often faces power, performance, and cost inefficiencies. NEO Semiconductor has announced recently-patented X-NAND to bypass these limitations.


News Aug 18, 2021 by Ikimi .O
Xanadu and Imec’s Photonic Chips Take On Quantum Scaling and Fault Tolerance

Xanadu and Imec’s Photonic Chips Take On Quantum Scaling and Fault Tolerance

Scaling and fault tolerance are just two major challenges facing quantum computing. Hoping to rise to the challenge, imec and Xanadu bet on silicon nitride (SiN) photonic chips.


News Aug 18, 2021 by Jake Hertz
Edge Computing Pushes Forward with Help From FPGAs to Testbed Environments

Edge Computing Pushes Forward with Help From FPGAs to Testbed Environments

As more and more IoT devices become commonplace, companies like Microchip, IBM, Verizon, Stratus, and Schneider Electric are hoping to propel edge computing into the future.


News Aug 17, 2021 by Jake Hertz