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TI Unveils GaN Device for Motor Energy Efficiency

TI Unveils GaN Device for Motor Energy Efficiency

TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.


News Jun 14, 2024 by Kevin Clemens
Remembering Caroline Haslett, a Staunch Advocate for Women in Engineering

Remembering Caroline Haslett, a Staunch Advocate for Women in Engineering

In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.


News Mar 15, 2024 by Ingrid Fadelli
Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Onsemi Intros 7th Gen IGBT-based Intelligent Power Modules

Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.


News Feb 26, 2024 by Jake Hertz
Siemens Unveils 3-Piece Emulation and Prototyping Solution

Siemens Unveils 3-Piece Emulation and Prototyping Solution

The new hardware-assisted verification and validation system marks a first for the EDA industry.


News Feb 21, 2024 by Jake Hertz
Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.


News Jan 17, 2024 by Duane Benson
Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.


News Dec 27, 2023 by Jeff Child
Renesas Unveils Industry’s First MCUs Based on Arm Cortex-M85 Core

Renesas Unveils Industry’s First MCUs Based on Arm Cortex-M85 Core

The new family of devices aims to bridge the gap between low-power MCUs and high-performance MPUs.


News Oct 31, 2023 by Jake Hertz
SiFive Rolls Out RISC-V Cores Aimed at Generative AI and ML

SiFive Rolls Out RISC-V Cores Aimed at Generative AI and ML

SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.


News Oct 16, 2023 by Jake Hertz
Toshiba Adds Six Over-Temperature Detection ICs to Portfolio

Toshiba Adds Six Over-Temperature Detection ICs to Portfolio

The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.


News Sep 19, 2023 by Aaron Carman
AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.


News Jun 27, 2023 by Jake Hertz
Exclusive—Titan Haptics Debuts Clustered Array to Serve Non-standard Designs

Exclusive—Titan Haptics Debuts Clustered Array to Serve Non-standard Designs

Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.


News Jun 20, 2023 by Jeff Child
STMicroelectronics Debuts ‘First’ Waterproof MEMS Pressure Sensor

STMicroelectronics Debuts ‘First’ Waterproof MEMS Pressure Sensor

A new waterproof sensor from ST promises precision in gas- and water-metering equipment, weather monitoring, air conditioning, and home appliances.


News Jun 05, 2023 by Jake Hertz
Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).


News May 31, 2023 by Jake Hertz
Infineon Unwraps Wireless Power Transmitter IC for up to 50 W Charging

Infineon Unwraps Wireless Power Transmitter IC for up to 50 W Charging

Released in time for PCIM Europe this week, the new chip's integrated approach is aimed at enabling easier and more-cost-efficient wireless charging designs.


News May 08, 2023 by Jake Hertz
TinyML Summit: Designing Multi-model Smart HMIs

TinyML Summit: Designing Multi-model Smart HMIs

At TinyML Summit 2023, NXP presented an approach to developing smart human-machine interfaces (HMI).


News May 02, 2023 by Jake Hertz
Renesas Unveils RISC-V MCU for Voice-controlled HMI Designs

Renesas Unveils RISC-V MCU for Voice-controlled HMI Designs

The latest chip from Renesas adds voice recognition to the industry’s RISC-V ecosystem.


News Apr 04, 2023 by Aaron Carman
Modules and Dev Kits Emerge for Building Amazon Sidewalk Devices

Modules and Dev Kits Emerge for Building Amazon Sidewalk Devices

As the company opens Sidewalk up for testing, the service from Amazon could have big implications in the IoT and smart home space.


News Mar 29, 2023 by Jake Hertz
Microchip Grows Its Secure Authentication Set With Six New ICs

Microchip Grows Its Secure Authentication Set With Six New ICs

At Embedded World last week, Microchip rolled out its expanded portfolio of security solutions that provide strong authentication and encryption capabilities in electronic systems


News Mar 23, 2023 by Darshil Patel
NXP Rolls MCU, NFC, and Security Together Into a One-chip Solution

NXP Rolls MCU, NFC, and Security Together Into a One-chip Solution

At Embedded World 2023, NXP unveils a chip that integrates a microcontroller, an NFC front end, and security into a single IC.


News Mar 16, 2023 by Jeff Child
IoT Solutions Focus on Cloud Development, NB-IoT, and Matter—a Roundup

IoT Solutions Focus on Cloud Development, NB-IoT, and Matter—a Roundup

Offering a variety of rich features for IoT system developers, the latest crop of IoT products offer cloud development, NB-IoT/GNSS support, Matter interoperability, and more.


News Mar 11, 2023 by Shraddha Tupe