The new RZ/G3E MPU with quad CPU and NPU powers next-generation HMI devices with advanced processing.
The new RZ/G3E MPU with quad CPU and NPU powers next-generation HMI devices with advanced processing.
Built on the Arm Cortex-M23 core, the new MCU family delivers precise, low-power motor control with built-in safety and…
Built on the Arm Cortex-M23 core, the new MCU family delivers precise, low-power motor control with built-in safety and diagnostic features.
MEMS microphones, ToF sensors, and motion-tracking IMUs from TDK deliver responsive, energy-efficient performance across…
MEMS microphones, ToF sensors, and motion-tracking IMUs from TDK deliver responsive, energy-efficient performance across smart home appliances, remotes, speakers, locks, and more.
We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI…
We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI embedded development, automotive, IoT, sustainability, and the forecast for 2025.
The new microcontrollers combine liquid sensing, inductive sensing, and hover touch.
The new microcontrollers combine liquid sensing, inductive sensing, and hover touch.
ST claims its new buck converter brings high efficiency and flexibility to low-voltage applications like smart meters and…
ST claims its new buck converter brings high efficiency and flexibility to low-voltage applications like smart meters and industrial systems with few additional components.
On this New Years Day, we share 2025 predictions from leading companies in our industry.
On this New Years Day, we share 2025 predictions from leading companies in our industry.
Power Integrations has upped its GaN game with InnoMux-2 IC, delivering more than 90% efficiency from a 1000 VDC bus and…
Power Integrations has upped its GaN game with InnoMux-2 IC, delivering more than 90% efficiency from a 1000 VDC bus and supplying up to 60 W from three accurately regulated outputs.
The new MCUs merge performance, efficiency, and security for smart appliances.
The new MCUs merge performance, efficiency, and security for smart appliances.
TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.
TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.
In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
In this Women's History Month feature, we explore the life of Caroline Haslett, a leader in many societies for female engineers.
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power…
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
The new hardware-assisted verification and validation system marks a first for the EDA industry.
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible…
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from…
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
The new family of devices aims to bridge the gap between low-power MCUs and high-performance MPUs.
The new family of devices aims to bridge the gap between low-power MCUs and high-performance MPUs.
SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.
SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.
The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.
The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.
The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.
The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.
Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an…
Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.
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