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Teardown Tuesday: Microsoft Xbox 360 Kinect

Teardown Tuesday: Microsoft Xbox 360 Kinect

In this teardown, we inspect the PCBs and their major components (ICs) found inside Microsoft's Xbox 360 Kinect.


News Jun 06, 2017 by Nick Davis
A Page in the History of Transistors: Ingenuity in Post-War Japan

A Page in the History of Transistors: Ingenuity in Post-War Japan

Learn about Japan's semiconductor journey to dominance in the global electronics industry.


News Apr 08, 2017 by Robin Mitchell
New TECs from CUI Use Conductive Resin to Extend the Traditional Peltier Device Lifecycle

New TECs from CUI Use Conductive Resin to Extend the Traditional Peltier Device Lifecycle

This news brief highlights CUI's newly-announced line of TECs. CUI claims their arcTEC structure increases the reliability and lifespan of traditional Peltier devices.


News Apr 05, 2017 by Kate Smith
Lithium-Ion Shipping and Travel Regulations: What You Need to Know

Lithium-Ion Shipping and Travel Regulations: What You Need to Know

Learn more about the regulations that dictate how lithium-Ion batteries may be shipped.


News Mar 24, 2017 by Chantelle Dubois
Teardown Tuesday: Projector Alarm Clock with Humidity and Temperature Sensors

Teardown Tuesday: Projector Alarm Clock with Humidity and Temperature Sensors

In this Teardown Tuesday, we will tear down an LED projector alarm clock with integrated humidity and temperature sensors.


News Mar 21, 2017 by Robin Mitchell
NASA’s New High-Temperature Components Could Enable Missions to Venus

NASA’s New High-Temperature Components Could Enable Missions to Venus

NASA scientists work to make ICs more durable to survive the harsh conditions of the surface of Venus.


News Feb 21, 2017 by Robin Mitchell
Graphene Nano-Chimneys Could Cool Future Circuits

Graphene Nano-Chimneys Could Cool Future Circuits

Rice University students have determined that chimney-like structures made of carbon nanotubes could be the key to the future of heat dissipation.


News Feb 15, 2017 by Robin Mitchell
Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Transceivers, Heat Dissipation, and Wearables: Are Diamonds the Future of Microelectronics?

Due to their resilient structure, synthetic diamonds are being used to create the next generation of microelectronics.


News Jan 25, 2017 by Chantelle Dubois
3D-Printed Embedded Electronics Make this Drone Ready to Fly Straight out of the Printer

3D-Printed Embedded Electronics Make this Drone Ready to Fly Straight out of the Printer

This 3D-printed drone features built-in printed electronics.


News Jan 20, 2017 by Robin Mitchell
Calculating the Lifespan of Electrolytic Capacitors with De-Rating

Calculating the Lifespan of Electrolytic Capacitors with De-Rating

Aluminum electrolytic capacitors have a reputation as having a short life expectancy and being unreliable...but are they really that much worse than other types of capacitor?


News Dec 26, 2016 by David Williams
A Robot that Sweats? Engineers Try Bio-Inspired Heat Management

A Robot that Sweats? Engineers Try Bio-Inspired Heat Management

Researchers have designed a humanoid robot which sweats water through its metal frame to cool itself.


News Dec 12, 2016 by Dr. Steve Arar
Gold-Coated DNA Nanowires Could Power Genetic Computing

Gold-Coated DNA Nanowires Could Power Genetic Computing

A team of scientists in Germany have created genetic nanostructures that could be the key to genetic computers.


News Dec 01, 2016 by Robin Mitchell
Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Could Nanowires Change the Way We Manage Heat Dissipation in ICs?

Heat dissipation is one of the biggest obstacles in semiconductor reduction. A team at the University of California has developed nanowires that can significantly improve heat dissipation characteristics and shape the future of silicon chip design.


News Nov 23, 2016 by Robin Mitchell
Why the Future of Data Centers Could Be in the Oceans

Why the Future of Data Centers Could Be in the Oceans

Researchers at the National Institute of Informatics are closing in on a solution to keep computers cool by submerging them under water.


News Nov 11, 2016 by Robin Mitchell
MIT Fusion Reactor Sets Another Record Right Before Being Shut Down for Good

MIT Fusion Reactor Sets Another Record Right Before Being Shut Down for Good

MIT’s experimental fusion reactor, Alcator C-Mod, breaks the plasma pressure record on its last day of operation.


News Oct 26, 2016 by Dr. Steve Arar
Silicon Carbide Chips Kickstart a New Era in Power Electronics

Silicon Carbide Chips Kickstart a New Era in Power Electronics

SiC devices—both diodes and transistors—are making inroads in automotive, energy, and industrial environments amid high-power handling capability and power loss savings.


News Oct 24, 2016 by Majeed Ahmad
Nanoporous Material Could Make Wearable Tech that Keeps You Cool

Nanoporous Material Could Make Wearable Tech that Keeps You Cool

Researchers at Stanford University have developed a low-cost plastic material which keeps the wearer much cooler than the conventional textiles.


News Oct 17, 2016 by Dr. Steve Arar
Teardown Tuesday: Thermal Camera

Teardown Tuesday: Thermal Camera

In this Teardown Tuesday, we are going to take a look at the insides of an inexpensive thermal camera.


News Sep 13, 2016 by Alex Udanis
3D Printing Filaments: HT vs PLA Final Overview

3D Printing Filaments: HT vs PLA Final Overview

Results of testing the filament under both heat and shock, as well as a final overview of the tests.


News Sep 11, 2016 by Michael Greer
HT vs PLA Filament for High-Temperature 3D Printing

HT vs PLA Filament for High-Temperature 3D Printing

In this article, we compare the thermal and structural properties of high-temperature filament.


News Sep 10, 2016 by Michael Greer