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Around the Industry: Examples of How Complex ICs Require Complex Design Tools

Around the Industry: Examples of How Complex ICs Require Complex Design Tools

Industries like aerospace and defense are only raising the bar on IC requirements. Here are a few recently announced tools helping IC designers meet the task.


News Dec 21, 2021 by Ikimi .O
IBM Quantum Summit 2021: QPU Eagle Breaks the 100-qubit Barrier

IBM Quantum Summit 2021: QPU Eagle Breaks the 100-qubit Barrier

Building on year-over-year engineering advancements IBM unveils Eagle, a 127-qubit quantum processor, and the next generation of cloud-based quantum systems.


News Nov 18, 2021 by Adrian Gibbons
Cadence’s HiFi 1 DSP Leverages New LC3 Codec for Improved Audio Systems

Cadence’s HiFi 1 DSP Leverages New LC3 Codec for Improved Audio Systems

A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their Bluetooth Audio (LE Audio) profile applications, including Multi-Stream and Broadcast audio.


News Nov 01, 2021 by Adrian Gibbons
Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.


News Oct 14, 2021 by Jake Hertz
Cadence Releases First ECAD Platform Dedicated to 3D System Design

Cadence Releases First ECAD Platform Dedicated to 3D System Design

The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.


News Oct 12, 2021 by Adrian Gibbons
Facebook Open-sources Its Newest Hardware, the Time Appliance Project

Facebook Open-sources Its Newest Hardware, the Time Appliance Project

The Time Appliance Project (TAP) is Facebook’s newest sub-microsecond network time synchronization system. Designed to enhance data centers, it is open-source, well documented, and ready to review.


News Oct 08, 2021 by Adrian Gibbons
Siemens Unleashes mPower: A Power Integrity Toolset for EM and IR Analysis

Siemens Unleashes mPower: A Power Integrity Toolset for EM and IR Analysis

A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.


News Sep 28, 2021 by Jake Hertz
Update HDL Code in Space From Earth? ST and Xilinx Team Up for Rad-hard FPGAs

Update HDL Code in Space From Earth? ST and Xilinx Team Up for Rad-hard FPGAs

The race for space has created a flood of innovations in space-rated tech. Hoping to strike gold with updatable FPGAs, Xilinx and STMicroelectronics have teamed up for a rad-hard solution.


News Aug 26, 2021 by Jake Hertz
Entering the Era of AI IC Design: Where Do EEs Fit In?

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?


News Jun 25, 2021 by Jake Hertz
Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?


News Apr 18, 2021 by Jake Hertz
Why Physical Verification Is Only Getting Tougher With Advanced Nodes

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.


New Tool from UnitedSiC Aims to Simplify the Increasingly Confusing Transistor Landscape

New Tool from UnitedSiC Aims to Simplify the Increasingly Confusing Transistor Landscape

A new component selection tool from UnitedSiC aims to make the design of SiC-based applications more straightforward and economical.


News Mar 27, 2021 by Jake Hertz
Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?


News Nov 06, 2020 by Dr. Steve Arar
Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

This summer, three major EDA companies have ramped up their software tools to better assist IC designers.


News Oct 19, 2020 by Jake Hertz
The Evolution of SPICE Continues With PSPICE for TI

The Evolution of SPICE Continues With PSPICE for TI

The new PSPICE for TI enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products.


News Sep 17, 2020 by Jake Hertz
In-Mold Electronics Processes Show Promising Results for Speedy 3D-Shaped Design Development

In-Mold Electronics Processes Show Promising Results for Speedy 3D-Shaped Design Development

In-mold electronic devices will emerge as a significant trend in electronic manufacturing.


News Jul 16, 2020 by Gary Elinoff
Aesthetics vs. Functionality in Circuit Design? In-Mold Electronics Eliminates the Tradeoff

Aesthetics vs. Functionality in Circuit Design? In-Mold Electronics Eliminates the Tradeoff

An emerging field in electronics manufacturing may provide lightweight and cost-effective solutions to meet design constraints. But it's not without drawbacks.


News Jul 15, 2020 by Jake Hertz
Advancing Future Flexible Wearable Electronics Through Liquid Metal Synthesis

Advancing Future Flexible Wearable Electronics Through Liquid Metal Synthesis

Research aims to harness the piezoelectric properties of unique ultra-thin materials.


News Jul 13, 2020 by Gary Elinoff
IC Designers Now Have a Platform to Design Chips in the Cloud

IC Designers Now Have a Platform to Design Chips in the Cloud

Samsung Electronics, in collaboration with Rescale, has just announced the launch of the Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP).


News Jun 22, 2020 by Jake Hertz
What Do You Do When Your Design Gets Set Back by a Part’s End-of-Life Notice?

What Do You Do When Your Design Gets Set Back by a Part’s End-of-Life Notice?

Getting an end-of-life notice on a component can be a major setback for both new and existing designs. How do you work around the inconvenience?


News Jun 15, 2020 by Nicholas St. John