Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.
Two new NPUs, along with a GPU and DPU, expand the scope of the doable for low-cost devices.
New solutions enable both legacy and IEEE 802.3bt-2018-compliant devices to be powered via existing Ethernet frameworks.
New solutions enable both legacy and IEEE 802.3bt-2018-compliant devices to be powered via existing Ethernet frameworks.
ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.
ST's new secure payment SoCs aim to increase contactless performance and protection while reducing power demand.
New members of the BMD product series encompass both indoor and long-range Bluetooth solutions.
New members of the BMD product series encompass both indoor and long-range Bluetooth solutions.
The newly announced Click board series extends the reach of ST's STSPIN motor driver ICs into the Mikroe ecosystem.
The newly announced Click board series extends the reach of ST's STSPIN motor driver ICs into the Mikroe ecosystem.
The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.
The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.
Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s…
Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.
Arm TechCon begins today in San Jose, CA. Here's what you need to know.
Arm TechCon begins today in San Jose, CA. Here's what you need to know.
Renesas and StradVision are leveling up automotive camera solutions with deep learning for object recognition on low-power SoCs.
Renesas and StradVision are leveling up automotive camera solutions with deep learning for object recognition on low-power SoCs.
Cree is doubling down on SiC with new facility expansions and the creation of what it claims will be the largest silicon…
Cree is doubling down on SiC with new facility expansions and the creation of what it claims will be the largest silicon carbide device manufacturing facility in the world.
Dialog Semi's four new high-frequency, I2C-controlled buck converters aim to save onboard space and external component count.
Dialog Semi's four new high-frequency, I2C-controlled buck converters aim to save onboard space and external component count.
The dual N-channel devices offer DS breakdown voltages of 40 V and 60 V and current ratings of 25 A to 48 A.
The dual N-channel devices offer DS breakdown voltages of 40 V and 60 V and current ratings of 25 A to 48 A.
The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions…
The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety.
NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.
NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.
The TI-RSLK Max allows students to gain hands-on experience building a robot and programming it.
The TI-RSLK Max allows students to gain hands-on experience building a robot and programming it.
The NCP1095 and NCP1096 deliver 90 Watts power-over-internet (POE) in compliance with IEEE's 802.3bt standard.
The NCP1095 and NCP1096 deliver 90 Watts power-over-internet (POE) in compliance with IEEE's 802.3bt standard.
A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of…
A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms.
Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.
Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.
The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity…
The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity and speed of flash memory they serve in SSD designs.
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