Can IoT devices handle edge processing for machine learning and DSP? Arm's newly-announced Helium vector extension for Cortex-M processors aims to facilitate…
Can IoT devices handle edge processing for machine learning and DSP? Arm's newly-announced Helium vector extension for Cortex-M processors aims to facilitate more complex development on the edge.
The future of electrical engineering, the freedom of giving code away for free, and the importance of professional…
The future of electrical engineering, the freedom of giving code away for free, and the importance of professional curiosity: an interview with Signal Integrity Engineers David Banas and Davi Correia.
The wearables market is by many measures still in its infancy, but many manufacturers continue to push wearable products…
The wearables market is by many measures still in its infancy, but many manufacturers continue to push wearable products into the market. How are component manufacturers involved in the wearable market and what are they currently producing?
Microcontroller specifications have changed little over the last few decades, but the expansion of languages and…
Microcontroller specifications have changed little over the last few decades, but the expansion of languages and supporting software has opened up many choices. Learn about several new languages available for microcontrollers in this guide.
Let's look back at the last year in AI and forward to what may be in store for 2019.
Let's look back at the last year in AI and forward to what may be in store for 2019.
A brief overview of silicon carbide AKA SiC, which may replace silicon in power electronics altogether.
A brief overview of silicon carbide AKA SiC, which may replace silicon in power electronics altogether.
This week, X-FAB Silicon Foundries SE released news that it was going into production with a new galvanic isolation…
This week, X-FAB Silicon Foundries SE released news that it was going into production with a new galvanic isolation semiconductor process for manufacturing.
This week, Microsemi announced their latest unified design suite to help streamline the process of developing on FPGAs.
This week, Microsemi announced their latest unified design suite to help streamline the process of developing on FPGAs.
Take a look at a new range of Wi-Fi modules from Silicon Labs.
Take a look at a new range of Wi-Fi modules from Silicon Labs.
Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.
Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.
Check out three tiny sensors for environment sensing and biometric monitoring applications.
Check out three tiny sensors for environment sensing and biometric monitoring applications.
Catch up on what Microchip released at CES this year and which trends they're focusing on for 2019.
Catch up on what Microchip released at CES this year and which trends they're focusing on for 2019.
This high-sensitivity device is designed for space-constrained and low-power applications.
This high-sensitivity device is designed for space-constrained and low-power applications.
SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on…
SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on UMC's 55nm platform, allowing it to make headway into the automotive sector.
The recent software acquisitions from leading MCU suppliers show how the hardware and software worlds are converging and…
The recent software acquisitions from leading MCU suppliers show how the hardware and software worlds are converging and colliding in the rapidly changing IoT design landscape.
Computer vision, designers vs. engineers, and the "nightmare" of engineering Google Glass.
Computer vision, designers vs. engineers, and the "nightmare" of engineering Google Glass.
Auto-balancing gets complicated when handling more than two supercapacitor cells. The new board can balance up to six…
Auto-balancing gets complicated when handling more than two supercapacitor cells. The new board can balance up to six supercapacitors of any size.
In its third wave of intelligent MEMs sensor technologies, Bosch has recently announced the BHI160BP—a lightweight,…
In its third wave of intelligent MEMs sensor technologies, Bosch has recently announced the BHI160BP—a lightweight, small form factor, and low power consumption, position tracking sensor.
IBM has developed several new materials that make selectively depositing materials on features as small as 15nm.
IBM has developed several new materials that make selectively depositing materials on features as small as 15nm.
Dialog Semiconductor's newest PMIC (power management IC) aims to help solve the battery life issue with wearables and…
Dialog Semiconductor's newest PMIC (power management IC) aims to help solve the battery life issue with wearables and other small, portable applications.
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