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DesignCon 2019 Begins, Highlights Signal Integrity and Test and Measurement Needed for 5G

DesignCon 2019 Begins, Highlights Signal Integrity and Test and Measurement Needed for 5G

DesignCon 2019 begins today in Santa Clara, California. Here's a brief overview of the show's goals and events.


News Jan 29, 2019 by Gary Elinoff
A New Line of Fast-Recovery Power MOSFETs from STMicroelectronics

A New Line of Fast-Recovery Power MOSFETs from STMicroelectronics

These superjunction devices are rated for a drain–source voltage of 600 V and target high-performance switching applications.


News Jan 25, 2019 by Robert Keim
High Speed Video Cameras: Interview with Dr. Jim Bales, Associate Director of MIT’s Edgerton Center

High Speed Video Cameras: Interview with Dr. Jim Bales, Associate Director of MIT’s Edgerton Center

Dr. Jim Bales is teaching engineers the value and basics of high-speed cameras.


News Jan 22, 2019 by Gary Elinoff
Sensors Behind Device Screens, Expression Tracking, and a New SDK: Facial Recognition Roundup

Sensors Behind Device Screens, Expression Tracking, and a New SDK: Facial Recognition Roundup

A look at some facial recognition-related info from around the industry.


News Jan 18, 2019 by Kate Smith
Hardware-Based Security and a Dev Kit for Alexa: A Look at Microchip Technology at CES 2019

Hardware-Based Security and a Dev Kit for Alexa: A Look at Microchip Technology at CES 2019

Catch up on what Microchip released at CES this year and which trends they're focusing on for 2019.


News Jan 16, 2019 by Mark Hughes
A New Non-Contact Current Sensor IC from ROHM Semiconductor

A New Non-Contact Current Sensor IC from ROHM Semiconductor

This high-sensitivity device is designed for space-constrained and low-power applications.


News Jan 14, 2019 by Robert Keim
Western Digital SweRVs Towards Open Source with New RISC-V Core, ISS, and Cache Coherency

Western Digital SweRVs Towards Open Source with New RISC-V Core, ISS, and Cache Coherency

Is open source changing the way we manage data? Western Digital, a data storage device company, switched to RISC-V's open-source ISA (instruction set architecture) a year ago. This month, they announced a series of open-source, collaborative initiatives that aim to make data more open, from processor cores to memory caches.


News Dec 18, 2018 by Kate Smith
Engineer Spotlight: Jeremy Blum, Director of Hardware at Shaper on Collaborative Design

Engineer Spotlight: Jeremy Blum, Director of Hardware at Shaper on Collaborative Design

Computer vision, designers vs. engineers, and the "nightmare" of engineering Google Glass.


News Dec 03, 2018 by Chantelle Dubois
As Emerging Technologies Outpace Semiconductor Processes, IBM Takes Leap Towards 7nm IC Fabrication

As Emerging Technologies Outpace Semiconductor Processes, IBM Takes Leap Towards 7nm IC Fabrication

IBM has developed several new materials that make selectively depositing materials on features as small as 15nm.


News Nov 21, 2018 by Gary Elinoff
Newest Dialog Semiconductor PMIC Tackles Big IoT Design Issue: Extending Battery Life for Wearables

Newest Dialog Semiconductor PMIC Tackles Big IoT Design Issue: Extending Battery Life for Wearables

Dialog Semiconductor's newest PMIC (power management IC) aims to help solve the battery life issue with wearables and other small, portable applications.


News Nov 20, 2018 by Kate Smith
An EV Made to Demo Motion Control: Monolithic Power Systems’ mCar Shows Off Angular Sensors

An EV Made to Demo Motion Control: Monolithic Power Systems’ mCar Shows Off Angular Sensors

The Monolithic Power Systems mCar EV demo at electronica 2018 showed off angle position sensors and motion control.


News Nov 19, 2018 by Kate Smith
Power Integrations Introduces New Family of Brushless DC Motor Drive ICs

Power Integrations Introduces New Family of Brushless DC Motor Drive ICs

Power Integrations’ BridgeSwitch™ family of ICs achieve conversion efficiency of up to 98.5% in brushless DC (BLDC) motor drive applications of up to 300 W.


News Nov 16, 2018 by Gary Elinoff
Environmental Sensors: Omron, Bosch, and Sensirion Sensors for Smart Homes, IoT Devices, Wearables

Environmental Sensors: Omron, Bosch, and Sensirion Sensors for Smart Homes, IoT Devices, Wearables

What counts as an environmental sensor anyway? Check out some of the leading environmental sensors and what they measure.


News Oct 29, 2018 by Kate Smith
Bridgetek Introduces “Credit Card” Dev Modules for EVE IC Geared Towards Human-Machine Interfaces

Bridgetek Introduces “Credit Card” Dev Modules for EVE IC Geared Towards Human-Machine Interfaces

Bridgetek recently released a slim "credit card" dev module for its EVE (embedded video engine) IC, the BT81x.


News Oct 24, 2018 by Gary Elinoff
Altium Announces New Cloud-Based Design Environment with Eye Towards Collaboration: Altium 365

Altium Announces New Cloud-Based Design Environment with Eye Towards Collaboration: Altium 365

Altium today announced Altium 365, a cloud-based design platform intended to bring manufacturing and sourcing into a hardware design environment.


News Oct 04, 2018 by Mark Hughes
Maxim Integrated Releases Development Platform for Biometrics Monitoring in Health Applications

Maxim Integrated Releases Development Platform for Biometrics Monitoring in Health Applications

Maxim Integrated just announced the second generation of its Health Sensor Platform, a development platform for designing wearable devices for remote biometric monitoring.


News Sep 26, 2018 by Gary Elinoff
Design Implementation in the Xilinx Vivado Design Suite

Design Implementation in the Xilinx Vivado Design Suite

This article will look at the techniques that Vivado employs to accelerate design implementation.


News Sep 07, 2018 by Dr. Steve Arar
How Design Kits Simplify IoT’s Last Mile to the Cloud

How Design Kits Simplify IoT’s Last Mile to the Cloud

A sneak peek of two IoT platforms allows developers to save time and cost while they streamline connectivity to the cloud services.


News Aug 31, 2018 by Majeed Ahmad
How Cloud-Based CAE Is Changing Prototyping: An Interview with Ian Campbell, CEO of OnScale

How Cloud-Based CAE Is Changing Prototyping: An Interview with Ian Campbell, CEO of OnScale

The days of manual prototyping may be numbered, but so could prohibitively expensive IP licenses.


News Aug 27, 2018 by Karissa Manske
FPGA Design Software: An Overview of Time-to-Integration Features in Xilinx’s Vivado Design Suite

FPGA Design Software: An Overview of Time-to-Integration Features in Xilinx’s Vivado Design Suite

This article will look at some of the most important features of the Xilinx Vivado Design Suite which accelerates the "time to integration" of the design procedure.


News Aug 24, 2018 by Dr. Steve Arar