Latest Custom News

For students back in college for their Fall semester—and anyone who needs a refresher—here’s the lowdown on our…

For students back in college for their Fall semester—and anyone who needs a refresher—here’s the lowdown on our top-notch textbooks, technical articles, and calculators for EE studies.

Arm has accused Qualcomm of breaching its licenses and wants the chipmaker to destroy its NUVIA CPU designs, plus…

Arm has accused Qualcomm of breaching its licenses and wants the chipmaker to destroy its NUVIA CPU designs, plus offering up compensation.

At this week’s Design Automation Conference (DAC), Siemens EDA rolled out a next generation version of its mixed-signal…

At this week’s Design Automation Conference (DAC), Siemens EDA rolled out a next generation version of its mixed-signal IC verification tool adding new capabilities.

While Shockley Semiconductor may have been the first company of Silicon Valley, it was Fairchild Semiconductor—founded…

While Shockley Semiconductor may have been the first company of Silicon Valley, it was Fairchild Semiconductor—founded by eight former Shockley engineers—who proliferated thousands of tech companies.

A bill currently going through Congress which would see semiconductor firms handed an extra $3 billion in funding could…

A bill currently going through Congress which would see semiconductor firms handed an extra $3 billion in funding could do more harm than good if its language isn’t modified, some defense firms have said.

Samsung announced the availability of its 3D IC technology at both 7nm and 5nm. How does this technology help system designers?

Samsung announced the availability of its 3D IC technology at both 7nm and 5nm. How does this technology help system designers?

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design…

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.

Cadence Design Systems and Imec have recently introduced the world’s first 3nm tapeout. The companies have achieved a…

Cadence Design Systems and Imec have recently introduced the world’s first 3nm tapeout. The companies have achieved a reduction in size of transistor (FinFET) nodes which will allow even more transistors to be packed onto a chip.