Pushing beyond the von Neumann bottleneck can be difficult for memory devices. One option is phase-change memory (PCM) which Stanford and IBM are researching for…
Pushing beyond the von Neumann bottleneck can be difficult for memory devices. One option is phase-change memory (PCM) which Stanford and IBM are researching for data storage and computing.
Reliability, speed, and large bandwidth per core are demanded by high-powered applications in personal computers. These…
Reliability, speed, and large bandwidth per core are demanded by high-powered applications in personal computers. These are exactly what Micron's latest Crucial DDR5 memory promises to deliver.
Hoping to create an end-to-end security solution for the Internet of Things (IoT), Macronix and Crypto Quantique are…
Hoping to create an end-to-end security solution for the Internet of Things (IoT), Macronix and Crypto Quantique are teaming up to take on IoT security challenges.
Based on the ARM Cortex-M23 32-bit core, the RA2E2 microcontroller unit (MCU) group hopes to bring more scalability to…
Based on the ARM Cortex-M23 32-bit core, the RA2E2 microcontroller unit (MCU) group hopes to bring more scalability to the internet of things (IoT) endpoint applications.
Data centers are facing serious challenges as technology continues to boom and Micron is out to keep them at bay with its…
Data centers are facing serious challenges as technology continues to boom and Micron is out to keep them at bay with its latest solid-state drive.
In an AAC interview with MIT's faculty Jennifer Rupp and Ericsson's Dr. Saeed Bastani, we learned how a new field,…
In an AAC interview with MIT's faculty Jennifer Rupp and Ericsson's Dr. Saeed Bastani, we learned how a new field, "lithionics," could be the key to advancing neuromorphic computing.
AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these…
AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these issues by combining processing-in-memory with high bandwidth memory.
Often overlooked, reference designs can be an EEs best friend. Maxim Integrated, STMicroelectronics, and Microchip aim to…
Often overlooked, reference designs can be an EEs best friend. Maxim Integrated, STMicroelectronics, and Microchip aim to help design facial detecting IoT, MasterGaN devices, and for Qi 1.3.
As the need for hardware security increases, companies are searching for ways to use PUF. CrossBar claims its newest…
As the need for hardware security increases, companies are searching for ways to use PUF. CrossBar claims its newest resistive-RAM technology could be suited for a new class of PUF applications.
Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release…
Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release of a new platform: the HGX HPC platform.
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP),…
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.
Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute…
Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute acceleration platforms, the Versal AI Edge series.
A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest…
A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest processor could be a hopeful contender in the world of edge computing.
Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and…
Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and data processing applications.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to…
You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to catch up on this cloud-focused technology.
Chasing low power consumption is the holy grail of IoT design considerations. With that in mind, Dialog introduces their…
Chasing low power consumption is the holy grail of IoT design considerations. With that in mind, Dialog introduces their new AT25EU NOR Flash to answer the call.
With its newest iteration of BlueField DPU technology, NVIDIA is reworking a new processing unit to support mountainous…
With its newest iteration of BlueField DPU technology, NVIDIA is reworking a new processing unit to support mountainous AI workloads.
While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are…
While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are still hard at work developing better memory technology for enhanced compute potential.
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