Traditional NAND often faces power, performance, and cost inefficiencies. NEO Semiconductor has announced recently-patented X-NAND to bypass these limitations.
Traditional NAND often faces power, performance, and cost inefficiencies. NEO Semiconductor has announced recently-patented X-NAND to bypass these limitations.
Often overlooked, reference designs can be an EEs best friend. Maxim Integrated, STMicroelectronics, and Microchip aim to…
Often overlooked, reference designs can be an EEs best friend. Maxim Integrated, STMicroelectronics, and Microchip aim to help design facial detecting IoT, MasterGaN devices, and for Qi 1.3.
As the need for hardware security increases, companies are searching for ways to use PUF. CrossBar claims its newest…
As the need for hardware security increases, companies are searching for ways to use PUF. CrossBar claims its newest resistive-RAM technology could be suited for a new class of PUF applications.
Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release…
Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release of a new platform: the HGX HPC platform.
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP),…
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.
Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute…
Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute acceleration platforms, the Versal AI Edge series.
A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest…
A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest processor could be a hopeful contender in the world of edge computing.
Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and…
Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and data processing applications.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to…
You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to catch up on this cloud-focused technology.
Chasing low power consumption is the holy grail of IoT design considerations. With that in mind, Dialog introduces their…
Chasing low power consumption is the holy grail of IoT design considerations. With that in mind, Dialog introduces their new AT25EU NOR Flash to answer the call.
With its newest iteration of BlueField DPU technology, NVIDIA is reworking a new processing unit to support mountainous…
With its newest iteration of BlueField DPU technology, NVIDIA is reworking a new processing unit to support mountainous AI workloads.
While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are…
While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are still hard at work developing better memory technology for enhanced compute potential.
Leakage current is yet another hurdle as Moore's law marches on. Manufacturing techniques, design methods, and research…
Leakage current is yet another hurdle as Moore's law marches on. Manufacturing techniques, design methods, and research projects are taking on the challenge.
With mounting data demands, Samsung has unveiled a new DDR5 module with HKMG process technology to accommodate AI, ML,…
With mounting data demands, Samsung has unveiled a new DDR5 module with HKMG process technology to accommodate AI, ML, and supercomputing applications.
Micron has announced the sale of its Utah chip factory as it ceases production of a once "revolutionary" memory chip…
Micron has announced the sale of its Utah chip factory as it ceases production of a once "revolutionary" memory chip developed in partnership with Intel.
While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature…
While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.
Researchers at MIT have created an algorithm-based architecture called SpAtten that reduces attention computation and…
Researchers at MIT have created an algorithm-based architecture called SpAtten that reduces attention computation and memory access in natural language processing (NLP) systems.
Renesas recently released 12 new MCUs for IoT and industrial use cases—the key focal point being its wakeup time, along…
Renesas recently released 12 new MCUs for IoT and industrial use cases—the key focal point being its wakeup time, along with high performance, low power, and enhanced security.
Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.
Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.
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