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STMicroelectronics Unveils the STM32G4 Series of Microcontrollers

STMicroelectronics Unveils the STM32G4 Series of Microcontrollers

ST's new MCUs target applications in e-mobility, digital power supplies, motor control, lighting, and building automation.


News May 30, 2019 by Gary Elinoff
“Extend Beyond Moore’s Law”: Xperi Unveils New Semiconductor Wafer Bonding Technology

“Extend Beyond Moore’s Law”: Xperi Unveils New Semiconductor Wafer Bonding Technology

Watch out, Moore's Law. Growing demands on memory have pushed semiconductor companies to pack more onto chips.


News May 27, 2019 by Gary Elinoff
Popular Toshiba Flash Memory Platform Now Qualified for Automotive Applications

Popular Toshiba Flash Memory Platform Now Qualified for Automotive Applications

The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.


News Mar 27, 2019 by Gary Elinoff
New Renesas Power Modules Claim Highest Density at 10A and 15A, Leverage New Packaging and PMBus

New Renesas Power Modules Claim Highest Density at 10A and 15A, Leverage New Packaging and PMBus

At APEC 2019, Renesas highlighted new PMBus DC-DC power modules.


News Mar 27, 2019 by Kate Smith
TDK Claims World’s Smallest Point-of-Load DC-DC Converter

TDK Claims World’s Smallest Point-of-Load DC-DC Converter

Tiny DC-DC converters with highest power density point-of-load, work with a wide variety of applications.


News Mar 25, 2019 by Gary Elinoff
Adesto Releases New Low-Power Flash Memory Devices Targeted at Wearable Applications and the IoT

Adesto Releases New Low-Power Flash Memory Devices Targeted at Wearable Applications and the IoT

This week, Adesto Technologies introduced its new FusionHD non-volatile memories (NVMs).


News Mar 03, 2019 by Gary Elinoff
Artificial Intelligence Grew Faster, Better, and More Controversial in 2018. What’s Ahead in 2019?

Artificial Intelligence Grew Faster, Better, and More Controversial in 2018. What’s Ahead in 2019?

Let's look back at the last year in AI and forward to what may be in store for 2019.


News Feb 04, 2019 by Baker Lawley
Toshiba Memory America Introduces UFS Ver 3.0 Embedded Flash Memory

Toshiba Memory America Introduces UFS Ver 3.0 Embedded Flash Memory

Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.


News Jan 23, 2019 by Gary Elinoff
SST SuperFlash Embedded Memory Platform Gains AEC-Q100 Qualification for Automotive Applications

SST SuperFlash Embedded Memory Platform Gains AEC-Q100 Qualification for Automotive Applications

SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on UMC's 55nm platform, allowing it to make headway into the automotive sector.


News Jan 09, 2019 by Baker Lawley
Lower Power, More Reliable Memory, and More Ambitious Applications: Implantable Tech Roundup

Lower Power, More Reliable Memory, and More Ambitious Applications: Implantable Tech Roundup

Here's a snapshot of some of the most recent developments in the implantable tech space.


News Dec 26, 2018 by Gary Elinoff
Western Digital SweRVs Towards Open Source with New RISC-V Core, ISS, and Cache Coherency

Western Digital SweRVs Towards Open Source with New RISC-V Core, ISS, and Cache Coherency

Is open source changing the way we manage data? Western Digital, a data storage device company, switched to RISC-V's open-source ISA (instruction set architecture) a year ago. This month, they announced a series of open-source, collaborative initiatives that aim to make data more open, from processor cores to memory caches.


News Dec 18, 2018 by Kate Smith
Fast Screening for Next-Gen Memory Chips: A Look at Intermolecular, a Silicon Valley Fab Company

Fast Screening for Next-Gen Memory Chips: A Look at Intermolecular, a Silicon Valley Fab Company

Here is the profile of a fab that provides composition screening and stack engineering services for new materials used in the next-generation memory devices.


News Dec 10, 2018 by Majeed Ahmad
The Power of Transistor Density: A Look at AMD, Intel, and How Moore’s Law Is Affecting the Market

The Power of Transistor Density: A Look at AMD, Intel, and How Moore’s Law Is Affecting the Market

While chip company business dealings and endless research into nanometer transistors can sometimes seem worlds apart, here are some consequences of how engineers' battle with Moore's Law directly affects the industry.


News Sep 11, 2018 by David Jones
How Cloud-Based CAE Is Changing Prototyping: An Interview with Ian Campbell, CEO of OnScale

How Cloud-Based CAE Is Changing Prototyping: An Interview with Ian Campbell, CEO of OnScale

The days of manual prototyping may be numbered, but so could prohibitively expensive IP licenses.


News Aug 27, 2018 by Karissa Manske
Power Storage for Renewables: The History of Batteries and the Advent of the Virtual Power Station

Power Storage for Renewables: The History of Batteries and the Advent of the Virtual Power Station

With renewable energies on the rise there is a growing need for high capacity energy storage and one possible solution are “virtual power plants”. What is a virtual power plant?


News Jul 30, 2018 by Robin Mitchell
Ultra-Low Jitter: A Programmable Oscillator with Internal EEPROM from Texas Instruments

Ultra-Low Jitter: A Programmable Oscillator with Internal EEPROM from Texas Instruments

The LMK61E07 is an I2C-controlled programmable variable frequency oscillator that can be used as an adjustable frequency source in computer networking, medical imaging, FPGA, and broadcast video applications.


News Jun 14, 2018 by Mark Hughes
Engineers of History: Jerry Lawson, Video Game Pioneer (1940-2011)

Engineers of History: Jerry Lawson, Video Game Pioneer (1940-2011)

Jerry Lawson is most well known for his work as Chief Engineer of Fairchild’s Video Game division, playing a vital role during the dawn of video game consoles. He’s an overview of his decorated career


News Jun 11, 2018 by Chantelle Dubois
Memory Roundup: Resistive RAM for AI, Upcoming DDR5 Specifications, and the Latest on 3D NAND

Memory Roundup: Resistive RAM for AI, Upcoming DDR5 Specifications, and the Latest on 3D NAND

Today’s roundup touches on how resistive RAM could change artificial intelligence applications, what to expect with upcoming DDR5 RAM specifications, and the latest news on 3D NAND flash memory.


News Jun 06, 2018 by Chantelle Dubois
The First Telegraph Message to the IBM 704: The May 2018 Hardware History Roundup

The First Telegraph Message to the IBM 704: The May 2018 Hardware History Roundup

From the first telegraph message sent in 1884 to the founding of Dell computers in 1984 here is a roundup of history for the month of May.


News May 23, 2018 by Chantelle Dubois
SiP, SoC, SoM, CoM—What’s the Difference?

SiP, SoC, SoM, CoM—What’s the Difference?

What's the difference between SiP, SoC, SoM, and CoM?


News Apr 02, 2018 by Chantelle Dubois