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In Its First Public Acquisition, SpaceX Snatches Up Satellite Startup Swarm

In Its First Public Acquisition, SpaceX Snatches Up Satellite Startup Swarm

SpaceX is known to create almost all of its technology in-house. What inspired the tech giant to acquire Swarm's technology?


News Aug 12, 2021 by Adrian Gibbons
Intel’s Roadmap Targets Through-silicon Via Issues in Foveros Technology

Intel’s Roadmap Targets Through-silicon Via Issues in Foveros Technology

Knowing the issues with Foveros technology, Intel includes improvements, from interference to power consumption, into its roadmap. How is Intel aiming to improve this technology?


News Jul 29, 2021 by Jake Hertz
Ousting 1900s-era Tech? Solid-state Circuit Breakers Extract DC from AC without Magnetics

Ousting 1900s-era Tech? Solid-state Circuit Breakers Extract DC from AC without Magnetics

Extracting DC from AC without any magnetics at all? A new solid-state circuit breaker put forth by Amber Solutions in partnership with Infineon Technologies stands to cause some pretty intense waves by displacing the nearly century-old technology upon which our electrical infrastructure is built.


News Jul 06, 2021 by Kate Smith
Simplifying Power IC Designs: 3 Companies Tackle Power Conversion Systems

Simplifying Power IC Designs: 3 Companies Tackle Power Conversion Systems

Simplifying designs are never easy, especially with power. So how did these three companies tackle simplifying power conversion systems?


Moving Space to Earth: Perseverance Tech for Earth Applications

Moving Space to Earth: Perseverance Tech for Earth Applications

Space technology is a testbed for promising, new technologies, not only for space but for Earth applications as well. How are recent advances in space affecting Earth?


News May 21, 2021 by Tyler Charboneau
Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.


News May 10, 2021 by Adrian Gibbons
Single-chip Controllers Fuel the Ultra-wide Touchscreens Taking Over Dashboards

Single-chip Controllers Fuel the Ultra-wide Touchscreens Taking Over Dashboards

While capacitive touch sensors attract the spotlight in automotive touchscreen technology (and rightly so), single-chip controllers also warrant consideration for the ever-popular ultra-wide touchscreens in vehicles today.


News Apr 22, 2021 by Adrian Gibbons
Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?


News Apr 18, 2021 by Jake Hertz
Why Physical Verification Is Only Getting Tougher With Advanced Nodes

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.


Chip vs. PIFA: Selecting the Right Antenna for a Booming IoT Medical Industry

Chip vs. PIFA: Selecting the Right Antenna for a Booming IoT Medical Industry

Amidst a burgeoning medical device market, choosing the correct IoT antenna means balancing competing requirements, including frequency of operation, PCB space, and cost.


News Apr 05, 2021 by Adrian Gibbons
Texas Power Outages Illustrate the State’s Importance to the Semi Industry

Texas Power Outages Illustrate the State’s Importance to the Semi Industry

The outages last month marked yet another setback to an industry that was already having serious trouble with meeting demand from automakers.


News Mar 28, 2021 by Luke James
MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.


News Mar 03, 2021 by Jake Hertz
The Race Toward Room-temperature Superconductors Heats Up

The Race Toward Room-temperature Superconductors Heats Up

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create room-temperature superconductors.


News Feb 25, 2021 by Jake Hertz
Increased Funds Could Catalyze TSMC’s 3D IC Research

Increased Funds Could Catalyze TSMC’s 3D IC Research

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.


News Feb 22, 2021 by Luke James
iRel40: The European Initiative Determined to Improve Component Reliability

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.


News Feb 17, 2021 by Luke James
As GaN Adoption Accelerates, an Industry Expert Offers Three Design Tips

As GaN Adoption Accelerates, an Industry Expert Offers Three Design Tips

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.


News Feb 01, 2021 by Jake Hertz
PCB Design Considerations When Using Bi-Directional Translators

PCB Design Considerations When Using Bi-Directional Translators

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.


News Dec 11, 2020 by Nicholas St. John
Department of Defense Backs New Secure Electron Beam Lithography Initiative

Department of Defense Backs New Secure Electron Beam Lithography Initiative

U.S. Department of Defense-backed secure fab SkyWater is set to adopt Multibeam’s Multicolumn Electron-Beam Lithography system in its 45 nm process.


News Nov 28, 2020 by Luke James
Security IC Solutions: Build or Buy?

Security IC Solutions: Build or Buy?

Depending on the project, designers have a number of options to either etch security at the silicon level or buy a pre-fabricated and pre-programmed security IC.


TI Turns to GaN FETs to Cut Board Space and Boost Power Density in EVs

TI Turns to GaN FETs to Cut Board Space and Boost Power Density in EVs

The new GaN FET family, which includes an integrated gate driver, is said to double power density in onboard chargers and industrial power supplies.


News Nov 10, 2020 by Jake Hertz