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“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.


News Jan 29, 2020 by Robin Mitchell
MicroPower Direct’s 1W DC-DC Converters Geared for Board-level Power Distribution

MicroPower Direct’s 1W DC-DC Converters Geared for Board-level Power Distribution

The ML100E series offers 41 standard models with varying VDC inputs and output ranges along with short circuit protection and a wide range of temperature tolerances.


News Jan 15, 2020 by Cabe Atwell
Zuken Announces New High-speed Configuration for Its Online PCB Design Platform

Zuken Announces New High-speed Configuration for Its Online PCB Design Platform

Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.


News Dec 28, 2019 by Gary Elinoff
Polyphenylene Sulfide: Toray Industries’ New Polymer Film for 5G Circuit Boards

Polyphenylene Sulfide: Toray Industries’ New Polymer Film for 5G Circuit Boards

A new polyphenylene sulfide (PPS) film from Toray Industries offers low dielectric losses as well as thermal and flame resistance.


News Dec 25, 2019 by Gary Elinoff
ST Praises Power Management IC for Saving Board Space, BOM, & Power

ST Praises Power Management IC for Saving Board Space, BOM, & Power

ST’s STPMIC1 is both a general-purpose system power management device and a companion chip for the STM32MP1 microprocessor.


News Dec 10, 2019 by Gary Elinoff
NIC Components’ SMT Power Inductors Built to Operate Up to +155°C

NIC Components’ SMT Power Inductors Built to Operate Up to +155°C

The NPIM_PE series are automotive-grade metal composite SMT power inductors with an operating temperature range of ‐55°C to +155°C.


News Nov 20, 2019 by Cabe Atwell
New Connectors Around the Market Described as Light Weight, Durable, and Water Resistant

New Connectors Around the Market Described as Light Weight, Durable, and Water Resistant

Here are some connectors around the industry that can endure harsh environments, save PCB space, and withstand water exposure.


News Nov 16, 2019 by Robin Mitchell
GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

GaN Systems and ON Semi Develop Half-Bridge Evaluation Board to Drive GaN Power Switches

The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.


News Nov 11, 2019 by Gary Elinoff
Flex Power Modules’ New Point-Of-Load Regulator Aims to Pack Power, Save PCB Space

Flex Power Modules’ New Point-Of-Load Regulator Aims to Pack Power, Save PCB Space

The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.


News Nov 08, 2019 by Gary Elinoff
Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

Infineon’s Evaluation Board Built to Anticipate SiC in Motor Drives

The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.


News Nov 07, 2019 by Gary Elinoff
Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip Unveils Dual-Mode, Bluetooth 5.0-Certified IC for Audio Solutions

Microchip's newest SoC and module feature a power amplifier and flash memory, enabling them to better support Sony’s LDAC technology.


News Oct 08, 2019 by Gary Elinoff
STMicroelectronics SiC Devices Will Power Renault-Nissan-Mitsubishi On-Board Battery Chargers

STMicroelectronics SiC Devices Will Power Renault-Nissan-Mitsubishi On-Board Battery Chargers

Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.


News Sep 13, 2019 by Gary Elinoff
3D Printing Electronic Components? Nano Dimension Releases DragonFly LDM Manufacturing Platform

3D Printing Electronic Components? Nano Dimension Releases DragonFly LDM Manufacturing Platform

DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.


News Jul 29, 2019 by Gary Elinoff
New App Tool for Augmented Reality PCB Design Enters Beta

New App Tool for Augmented Reality PCB Design Enters Beta

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.


News Jul 22, 2019 by Mark Hughes
TT Electronics’ New Reflective Optical Sensor and Fiber Optic Transmitters

TT Electronics’ New Reflective Optical Sensor and Fiber Optic Transmitters

These new components debuted at Sensors Expo ahead of a new dev board for optical sensor development.


News Jul 02, 2019 by Gary Elinoff
Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.


News Jun 22, 2019 by Mark Hughes
Amphenol’s Jason Ellison on Signal Integrity Careers and His Free, Open Source PCB Design Software

Amphenol’s Jason Ellison on Signal Integrity Careers and His Free, Open Source PCB Design Software

Ellison speaks on the importance of networking, giving to the EE community, and helping younger engineers.


News Jun 19, 2019 by Mark Hughes
How Do Avionics Systems Communicate? New ARINC-429 Bus Board Announced by UEI

How Do Avionics Systems Communicate? New ARINC-429 Bus Board Announced by UEI

Learn about a new board that uses an FPGA for serial communication in avionics applications.


News May 28, 2019 by Gary Elinoff
Cree Invests $1 Billion in Expanding SiC Semiconductor Fab Capacity, Develops MOSFET Portfolio

Cree Invests $1 Billion in Expanding SiC Semiconductor Fab Capacity, Develops MOSFET Portfolio

Wolfspeed doubles down on SiC with a $1 billion investment towards Wolfspeed Schottky diodes and MOSFETs.


News May 14, 2019 by Gary Elinoff
X-FAB Announces Substrate Coupling Analysis Tool To Combat Troublesome Parasitic Effects

X-FAB Announces Substrate Coupling Analysis Tool To Combat Troublesome Parasitic Effects

A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.


News May 13, 2019 by Gary Elinoff