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Diodes Tackles Signal Integrity with Latest ReDrivers for HDMI to PCIe 4.0

Diodes Tackles Signal Integrity with Latest ReDrivers for HDMI to PCIe 4.0

Recently, Diodes Inc. has pushed out new ReDriver technologies, which aim to improve signal integrity. What are these new releases and how do ReDrivers stack up to ReTimers?


News Aug 02, 2021 by Adrian Gibbons
Breaking 5G Barriers: Qualcomm’s Snapdragon x65 Speeds Through 10 Gbps

Breaking 5G Barriers: Qualcomm’s Snapdragon x65 Speeds Through 10 Gbps

Breaking the 10 Gbps ‘barrier’ might be the point where mobile broadband starts to match the functionality of fiber services. Qualcomm’s modem-RF system recently achieved standalone 10 Gbps.


News Jul 30, 2021 by Adrian Gibbons
Qualcomm’s 5G Open RAN Platform Elevates 5G Small Cell Technology

Qualcomm’s 5G Open RAN Platform Elevates 5G Small Cell Technology

Small cell technology is becoming increasingly important as 5G continues its rollout, but why is that and what role is Qualcomm taking?


News Jul 08, 2021 by Jake Hertz
The Story of Bluetooth: The Slow Road to Becoming an Industry Standard

The Story of Bluetooth: The Slow Road to Becoming an Industry Standard

Bluetooth seems like a commonplace technology in 2021; however, this wasn't always the case. What did the slow adoption of this industry-standard technology look like?


News Jul 03, 2021 by Lianne Frith
A Week of GaN: 3 MMICs Target Ka-band, Reduced Area, and 5G Base Stations

A Week of GaN: 3 MMICs Target Ka-band, Reduced Area, and 5G Base Stations

Qorvo, Microchip, MaxLinear, and Cree Wolfspeed have gone wide, electrically wide-band that is, with newly released GaN-based RF products for 5G and satellite communications.


News Jun 28, 2021 by Adrian Gibbons
From 1G to 5G: A Brief Evolution of Telephony and Wireless Networks

From 1G to 5G: A Brief Evolution of Telephony and Wireless Networks

Mobile telephony is entering its fifth decade. Today, we look back at the previous generations of mobile telephony technology leading to 5G.


News Jun 22, 2021 by Adrian Gibbons
A “Shelf-life” for FinFETs? Samsung and TSMC Improve Node Density for RF

A “Shelf-life” for FinFETs? Samsung and TSMC Improve Node Density for RF

Single-digit node process is nothing new, but existing technology hampers RF performance due to parasitics. Samsung Foundry and TSMC seek to bring single-digit node performance to RF chips.


News Jun 17, 2021 by Adrian Gibbons
Xilinx Aims to Speed Up System Design with Gen3 RF SoM

Xilinx Aims to Speed Up System Design with Gen3 RF SoM

One method of accelerating system design is with a system-on-module (SoM). The newest XRF16-Gen3 Xilinx-based SoM from AVNET has improvements worth evaluating.


News May 24, 2021 by Adrian Gibbons
Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

This week All About Circuits had the chance to sit down with Qualcomm and talk about its newest chipset for IIoT and how it is moving 5G to industrial settings.


News May 21, 2021 by Jake Hertz
3 Ways the EE Industry Is Affecting Low Earth Orbit (LEO) Satellite Programs

3 Ways the EE Industry Is Affecting Low Earth Orbit (LEO) Satellite Programs

With life cycles under five years, LEO satellite rollouts require trusted technology and rapid development windows where industry partnerships are key.


News Apr 27, 2021 by Adrian Gibbons
Honda and Verizon Put 5G on Wheels With Mobile Edge Computing

Honda and Verizon Put 5G on Wheels With Mobile Edge Computing

When it comes to vehicle safety, processing latency can be a matter of life and death. Honda and Verizon are now remixing edge computing technology for the road.


News Apr 19, 2021 by Dr. Steve Arar
How SpaceX’s Starlink Project Seeks to Bridge the “Digital Divide”

How SpaceX’s Starlink Project Seeks to Bridge the “Digital Divide”

Despite the essential role the internet now plays across the globe, it’s still out of reach to a huge number of people worldwide, including in the U.S. What is Starlink doing to bridge this so-called “digital divide?" 


News Apr 10, 2021 by Luke James
As Chips Scale Down, Leakage Current Goes Up. How Are Developers Responding?

As Chips Scale Down, Leakage Current Goes Up. How Are Developers Responding?

Leakage current is yet another hurdle as Moore's law marches on. Manufacturing techniques, design methods, and research projects are taking on the challenge.


News Apr 05, 2021 by Jake Hertz
In the Cloud or in the Sea? Facebook and Google to Lay Transoceanic Cables to Asia Pacific

In the Cloud or in the Sea? Facebook and Google to Lay Transoceanic Cables to Asia Pacific

After years of political and national security disputes, the two companies finally feel they’ll get the approval to connect North America and the Asia Pacific region.


News Mar 31, 2021 by Jake Hertz
From Space to the Farm, RF Advancements Fuel New 5G Applications

From Space to the Farm, RF Advancements Fuel New 5G Applications

5G will undoubtedly make its mark in crowded urban centers. But how can RF technologies for this spectrum make a difference in rural and even space settings?


News Mar 31, 2021 by Tyler Charboneau
Qualcomm’s Processors Are in High Demand—and Short Supply

Qualcomm’s Processors Are in High Demand—and Short Supply

As the global chip shortage intensifies, Qualcomm is struggling to keep up with the demand for its processor chips that are used in consumer electronics.


News Mar 29, 2021 by Luke James
ADI’s New ASIC Transceiver Platform Marks How 5G Has Matured

ADI’s New ASIC Transceiver Platform Marks How 5G Has Matured

Analog Devices' new ASIC-based 5G O-RAN radio platform might be indicative of maturing network technology.


News Mar 29, 2021 by Adrian Gibbons
It’s All About the Timing: 5G Brings Timing Synchronization Burdens

It’s All About the Timing: 5G Brings Timing Synchronization Burdens

Renesas has released three new ICs in its communication timing portfolio to help alleviate the burden of 5G timing constraints.


News Mar 25, 2021 by Jake Hertz
Apple Settles on Munich for Its European IC Design Center

Apple Settles on Munich for Its European IC Design Center

In an effort to solidify its European presence and expand wireless technologies, Apple will soon break ground on a new silicon design center in Germany.


News Mar 17, 2021 by Luke James
AMD Says Its “Highest-performing Server Processor” Is Here

AMD Says Its “Highest-performing Server Processor” Is Here

Designed to level up with burgeoning data center demands, AMD claims its new EPYC 7003 Series CPUs outperform competitors in terms of speed and security.


News Mar 16, 2021 by Jake Hertz