2020 has seen a swathe of progress on the 5nm process node led by TSMC. Here’s a quick look at recent developments involving 5nm ASICs.
2020 has seen a swathe of progress on the 5nm process node led by TSMC. Here’s a quick look at recent developments involving 5nm ASICs.
Voltage-level translators are essential in devices like SD/micro SD card readers, wireless access points, and 5G…
Voltage-level translators are essential in devices like SD/micro SD card readers, wireless access points, and 5G femtocells. How exactly do these devices work?
As modulation scheme efficiency goes up, power amplifier efficiency goes down. Xilinx, TI, and Skyworks are bringing…
As modulation scheme efficiency goes up, power amplifier efficiency goes down. Xilinx, TI, and Skyworks are bringing their expertise to the table to reconcile the trade-off.
Although 2020 has been one of the biggest years for mergers and acquisitions in the chip industry, global trade conflicts…
Although 2020 has been one of the biggest years for mergers and acquisitions in the chip industry, global trade conflicts could slow deals from being finalized.
Advanced Micro Devices has agreed to buy rival Californian chipmaker Xilinx in a $35 billion all-stock deal, the latest…
Advanced Micro Devices has agreed to buy rival Californian chipmaker Xilinx in a $35 billion all-stock deal, the latest in a wave of high-profile mergers and acquisitions currently sweeping the semiconductor industry.
Xilinx solutions are surfacing for each new wave in the 5G rollout. Appearing in 2021, the new RFSoC DFE is forecasted to…
Xilinx solutions are surfacing for each new wave in the 5G rollout. Appearing in 2021, the new RFSoC DFE is forecasted to break all existing benchmarks.
FETs and MOSFETs don't always cut it for dynamic applications. Nexperia says it has created a new flavor of FETs designed…
FETs and MOSFETs don't always cut it for dynamic applications. Nexperia says it has created a new flavor of FETs designed to rise to the challenge.
As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to…
As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.
As 5G barrels forward, engineers are increasingly talking about one of the major design challenges of this technology:…
As 5G barrels forward, engineers are increasingly talking about one of the major design challenges of this technology: thermal management.
As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of…
As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.
5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards…
5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.
NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the…
NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.
Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a…
Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.
Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for…
Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.
With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet…
With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet (PoE)-based designs.
Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform…
Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform aimed at democratizing 5G.
Texas researchers realize the strengths of both solid-state and liquid-state batteries in the first room-temperature…
Texas researchers realize the strengths of both solid-state and liquid-state batteries in the first room-temperature liquid-metal battery.
The SuperFin is an enhanced FinFET combined with a super MIM capacitor and an interconnect metal stack. What doors will…
The SuperFin is an enhanced FinFET combined with a super MIM capacitor and an interconnect metal stack. What doors will this 10nm transistor open?
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