By reducing component counts, power system designs can achieve critical advantages such as lower costs and easier manufacturing. Three recently announced power…
By reducing component counts, power system designs can achieve critical advantages such as lower costs and easier manufacturing. Three recently announced power solutions offer vivid examples of trend.
As the Qi standard increases in popularity for wireless charging, Microchip and Renesas announce their Qi-compliant…
As the Qi standard increases in popularity for wireless charging, Microchip and Renesas announce their Qi-compliant automotive-grade wireless power transmitter reference designs.
Learn about battery pack current measurement and analog-to-digital converters (ADCs) requirements within battery…
Learn about battery pack current measurement and analog-to-digital converters (ADCs) requirements within battery management systems (BMSs).
With the new Boson+ product line, Teledyne FLIR hopes to enable higher performance and more accurate thermal imaging systems.
With the new Boson+ product line, Teledyne FLIR hopes to enable higher performance and more accurate thermal imaging systems.
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of…
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context…
This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.
Focusing on performance and size, Texas Instruments is doubling down on EV power systems at this year's APEC.
Focusing on performance and size, Texas Instruments is doubling down on EV power systems at this year's APEC.
New research from UC Berkeley leverages micro-electromechanical system (MEMS) in LiDAR focal plane switch arrays (FPSAs)…
New research from UC Berkeley leverages micro-electromechanical system (MEMS) in LiDAR focal plane switch arrays (FPSAs) to achieve "record resolution." What challenges did they overcome to reach this record?
Combining technology with pavement, Integrated Roadways dreams of a future where roads are intelligent. Learn more…
Combining technology with pavement, Integrated Roadways dreams of a future where roads are intelligent. Learn more through AAC's interview with its CEO, Tim Sylvester.
Connectivity technology is no longer confined to houses and businesses. Now, Qualcomm has released a suite of new chips,…
Connectivity technology is no longer confined to houses and businesses. Now, Qualcomm has released a suite of new chips, SDKs, and services to enhance vehicle precision and communication.
Power management ICs (PMICs) are continually scaling down. Here's how a few companies are packing functionality in these…
Power management ICs (PMICs) are continually scaling down. Here's how a few companies are packing functionality in these devices in the face of miniaturization.
Targeting a breakthrough in digital vision, the ST’s family of high-resolution indirect Time-of-Flight (iToF) sensors…
Targeting a breakthrough in digital vision, the ST’s family of high-resolution indirect Time-of-Flight (iToF) sensors aims to improve efficient depth imaging in devices that perform 3D imaging functionalities.
As industrial power electronics move towards higher operating frequencies and voltage, silicon carbide (SiC) technologies…
As industrial power electronics move towards higher operating frequencies and voltage, silicon carbide (SiC) technologies are emerging to meet the demands of next-generation power electronics.
While the technology has existed for years in Canada and Europe, adaptive driving beams (ADBs) have historically been…
While the technology has existed for years in Canada and Europe, adaptive driving beams (ADBs) have historically been outlawed in the States—until now.
A new microcontroller unit (MCU) from STMicroelectronics (ST) seeks to optimize centralized electric vehicle (EV)…
A new microcontroller unit (MCU) from STMicroelectronics (ST) seeks to optimize centralized electric vehicle (EV) electronic and electrical (E/E) architectures.
The race to beat out silicon (Si) for the "best" semiconductor continues with a rush of gallium nitride (GaN)…
The race to beat out silicon (Si) for the "best" semiconductor continues with a rush of gallium nitride (GaN) announcements focusing on creating and furthering GaN-based device designs.
As the autonomous vehicle market heats up, new MCUs and ICs have hit the market this year to enable new ADAS functionalities.
As the autonomous vehicle market heats up, new MCUs and ICs have hit the market this year to enable new ADAS functionalities.
Image processing continues to be a major hurdle for advanced driver monitoring systems. Aiming to tackle this challenge,…
Image processing continues to be a major hurdle for advanced driver monitoring systems. Aiming to tackle this challenge, Arm's latest image signal processor eases the adoption of ADAS and automation technologies.
Last week the NVIDIA-Arm deal fell through, but it left us some questions to answer. What were the controversies and…
Last week the NVIDIA-Arm deal fell through, but it left us some questions to answer. What were the controversies and issues standing in the way? What did NVIDIA hope to gain? Where does that leave Arm?
With 2021 wrapped up, let's look back at the trends we saw happening in the semiconductor industry and then look at how…
With 2021 wrapped up, let's look back at the trends we saw happening in the semiconductor industry and then look at how 2022 is kicking off.
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