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Designing Firmware for Embedded Systems Using Warnier-Orr Diagrams

Go from chaos to clarity by learning how to design programs for embedded systems leveraging the Warnier-Orr diagrams.

March 10, 2023 by Nthatisi Hlapisi

Engineering, Inspiration, and Advice—Intel VP Deepali Trehan’s Journey

Deepali Trehan’s story is a human story, an underdog story, that happens to involve engineering. In this Season 6 kickoff episode of Moore’s Lobby, we visit with the VP and GM of Intel’s Programmable Solutions Group about FPGAs, AI, chiplets, and more.

March 07, 2023 by Daniel Bogdanoff

ISSCC Papers from Renesas Tackle Wireless Charging and Car Gateway SoCs

In a pair of papers presented at last week’s 70th annual ISSCC event, Reneas engineers detailed IC designs for wireless power charging and nex-gen automotive gateways.

March 01, 2023 by Jeff Child

Power ICs Debut as High-side and Low-side Smart Switch Solutions

A slew of high-side and low-side smart switch chips have emerged, offering interesting alternatives for a variety of automotive and industrial use cases.

February 10, 2023 by Jake Hertz

DC-DC Switching Regulators Zero In on Automotive and Industrial Designs

While their issues and challenges are distinct, both automotive and industrial systems rely on DC-DC switching regulator technology. Learn how to navigate these issues and make smart engineering choices.

February 02, 2023 by Mitch Van Ochten, ROHM Semiconductor

Bluespec Teams Up with Synopsys for RISC-V Core Verification Effort

With their collaboration, the firms hope to enable faster and improved functional verification testing for Bluespec’s RISC-V cores.

January 24, 2023 by Jake Hertz

Panthronics Claims First One-chip Listener IC for NFC Wireless Charging

The company’s new chip gives engineers an all-in-one solution to incorporate NFC wireless charging in their smallest devices.

January 20, 2023 by Aaron Carman

Texas Instruments Announces First Ultrasonic Lens Cleaning Chipset

Texas Instruments has developed two ultrasonic lens cleaning ICs to enable self-cleaning cameras and sensors.

January 19, 2023 by Jake Hertz

Qualcomm Snapdragon SoC Marries Infotainment and ADAS Support

Building out its automotive portfolio, Qualcomm hopes its new SoC can enable the future of intelligent vehicles.

January 10, 2023 by Jake Hertz

NXP Unwraps One-chip Automotive Radar SoC Based on 28 nm RF CMOS

Claiming the industry’s first 28 nm RF CMOS one-chip radar IC, NXP hopes to enable a 360-degree safety cocoon of radar sensing in cars.

January 09, 2023 by Jeff Child

NXP Debuts i.MX 95 Armed with 3D Graphics and NPU Improvements

At CES today, NXP introduced its new i.MX 95 family. These application processors up the game for the 9 series in terms of 3D graphics, NPU functionality, and more.

January 04, 2023 by Jeff Child

MCU Vendors Grow Their Software Offerings for GUIs, Automotive, and More

Through collaborations and home grown efforts, microcontroller companies across the industry are beefing up their software portfolios.

December 28, 2022 by Jake Hertz

“RISC-V is Inevitable”—A Tale of Two RISC-V Summit Keynotes

At the annual summit, leaders in the RISC-V community had much to say about RISC-V taking over the world.

December 16, 2022 by Jeff Child

Solutions Disclosed at RISC-V Summit: Security, Verification, and More

At this year’s RISC-V Summit, stakeholders rolled out solutions revolving around verification, security, and software-defined SoCs.

December 15, 2022 by Jake Hertz

Lattice Debuts Low-power FPGA Family in Tiny Form Factor

In an effort to marry power efficiency with mid-range FPGA performance, the company has unveiled a new family of tiny form factor, low-power devices.

December 13, 2022 by Jeff Child

MCU Advances Focus on Neural Processing, RRAM, and Payment Security

MCU vendors continue to up their game. Latest chips serve up neural processing for the edge, innovations in on-chip non-volatile memory, and tech for secure biometric card payments.

December 10, 2022 by Jeff Child

Ambarella Disrupts 4D Imaging Automotive Radar with Centralized Approach

Pushing an alternative to edge-based radar processing, Ambarella is rolling out a centralized processed solution for 4D automotive imaging radar.

December 06, 2022 by Jeff Child

BittWare IA-420F Agilex™ FPGA Cards | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

December 04, 2022 by Mouser Electronics

NXP Semiconductors i.MX RT1050 Crossover MCUs | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

December 01, 2022 by Mouser Electronics

TSMC to Make 3nm Semiconductors at Arizona Fab

To meet worldwide demands, the largest semiconductor manufacturers are ramping up capacity. Among them, TSMC plans to build 3nm chips at its Arizona fab.

November 28, 2022 by Lianne Frith