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New Renesas Power Modules Claim Highest Density at 10A and 15A, Leverage New Packaging and PMBus

New Renesas Power Modules Claim Highest Density at 10A and 15A, Leverage New Packaging and PMBus

At APEC 2019, Renesas highlighted new PMBus DC-DC power modules.


News Mar 27, 2019 by Kate Smith
TDK Claims World’s Smallest Point-of-Load DC-DC Converter

TDK Claims World’s Smallest Point-of-Load DC-DC Converter

Tiny DC-DC converters with highest power density point-of-load, work with a wide variety of applications.


News Mar 25, 2019 by Gary Elinoff
Micron Multichip Packages | New Product Brief

Micron Multichip Packages | New Product Brief

Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.


How to Interface a 16×2 LCD Module with an MCU

How to Interface a 16×2 LCD Module with an MCU

This article will discuss the details of interfacing a 16x2 LCD module with an MCU.


Adesto Releases New Low-Power Flash Memory Devices Targeted at Wearable Applications and the IoT

Adesto Releases New Low-Power Flash Memory Devices Targeted at Wearable Applications and the IoT

This week, Adesto Technologies introduced its new FusionHD non-volatile memories (NVMs).


News Mar 03, 2019 by Gary Elinoff
Artificial Intelligence Grew Faster, Better, and More Controversial in 2018. What’s Ahead in 2019?

Artificial Intelligence Grew Faster, Better, and More Controversial in 2018. What’s Ahead in 2019?

Let's look back at the last year in AI and forward to what may be in store for 2019.


News Feb 04, 2019 by Baker Lawley
NXP Semiconductors i.MX RT1060 Crossover Processor | Featured Product Spotlight

NXP Semiconductors i.MX RT1060 Crossover Processor | Featured Product Spotlight

NXP Semiconductor’s i.MX RT1060 Crossover Processor can be used in a wide range of applications from professional audio, consumer products, home, and building automation to motor control, power conversion, and industrial computing.


Omron Electronics 2JCIE-BL01-P1 Sensor Development Kit | New Product Brief

Omron Electronics 2JCIE-BL01-P1 Sensor Development Kit | New Product Brief

Omron Electronics 2JCIE-BL01-P1 sensor development kit combines sensors, wireless connectivity, and onboard memory for environmental monitoring in smart homes, offices, and many other environments.


Introduction to Supercapacitors

Introduction to Supercapacitors

Get a primer on the basics of supercapacitors, their functionality, and which applications they're best for.


Toshiba Memory America Introduces UFS Ver 3.0 Embedded Flash Memory

Toshiba Memory America Introduces UFS Ver 3.0 Embedded Flash Memory

Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.


News Jan 23, 2019 by Gary Elinoff
Hybrid Memory Cubes: What They Are and How They Work

Hybrid Memory Cubes: What They Are and How They Work

In this article, the engineering team at Promwad examines hybrid memory cubes (HMCs), which can provide a 15-fold increase in performance with up to a 70% energy savings per bit compared to DDR3 DRAM.


Pointers in C Programming: What Is a Pointer and What Does It Do?

Pointers in C Programming: What Is a Pointer and What Does It Do?

This article will help you to understand the pointer, which is an interesting and important aspect of the C language.


SST SuperFlash Embedded Memory Platform Gains AEC-Q100 Qualification for Automotive Applications

SST SuperFlash Embedded Memory Platform Gains AEC-Q100 Qualification for Automotive Applications

SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on UMC's 55nm platform, allowing it to make headway into the automotive sector.


News Jan 09, 2019 by Baker Lawley
NXP Semiconductors S32R274 Radar MCU | New Product Brief

NXP Semiconductors S32R274 Radar MCU | New Product Brief

NXP’s S32R274 RADAR MCU combines advanced radar signal processing capabilities with a multicore MCU for use in a variety of automotive radar applications, as well as applications such as surveillance or industrial automation.


Microchip Technology dsPIC33CK Digital Signal Controllers | Featured Product Spotlight

Microchip Technology dsPIC33CK Digital Signal Controllers | Featured Product Spotlight

Microchip dsPIC33CK 16-bit digital signal controllers provide fast, deterministic performance for motor control, digital power, safety-critical and high-performance embedded applications.


Implementing Sequential Circuitry with Pass-Transistor Logic

Implementing Sequential Circuitry with Pass-Transistor Logic

This article discusses the use of pass-transistor configurations in the design of gated latches.


Lower Power, More Reliable Memory, and More Ambitious Applications: Implantable Tech Roundup

Lower Power, More Reliable Memory, and More Ambitious Applications: Implantable Tech Roundup

Here's a snapshot of some of the most recent developments in the implantable tech space.


News Dec 26, 2018 by Gary Elinoff
Big Endian, Little Endian, Endianness: Understanding Byte Arrangements in Digital Systems

Big Endian, Little Endian, Endianness: Understanding Byte Arrangements in Digital Systems

The various “endian” terms may sound a bit odd, but the underlying concept is straightforward. If you’re not yet an endian expert, read on!


Western Digital SweRVs Towards Open Source with New RISC-V Core, ISS, and Cache Coherency

Western Digital SweRVs Towards Open Source with New RISC-V Core, ISS, and Cache Coherency

Is open source changing the way we manage data? Western Digital, a data storage device company, switched to RISC-V's open-source ISA (instruction set architecture) a year ago. This month, they announced a series of open-source, collaborative initiatives that aim to make data more open, from processor cores to memory caches.


News Dec 18, 2018 by Kate Smith
Fast Screening for Next-Gen Memory Chips: A Look at Intermolecular, a Silicon Valley Fab Company

Fast Screening for Next-Gen Memory Chips: A Look at Intermolecular, a Silicon Valley Fab Company

Here is the profile of a fab that provides composition screening and stack engineering services for new materials used in the next-generation memory devices.


News Dec 10, 2018 by Majeed Ahmad