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Understanding Dimensional Resonance in High-Frequency Magnetic Cores

Understanding Dimensional Resonance in High-Frequency Magnetic Cores

In this article, we explore the effect of dimensional resonance on the magnetic field distribution in high-frequency ferrite cores.


Understanding the Effect of Eddy Currents on the High-Frequency Behavior of Magnetic Cores

Understanding the Effect of Eddy Currents on the High-Frequency Behavior of Magnetic Cores

The formation of eddy currents can cause problems for magnetic cores at high frequencies. To mitigate these undesirable effects, we first need to understand them.


SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.


News Jun 11, 2024 by Arjun Nijhawan
Efabless Welcomes Weebit Nano’s ReRAM to Its Custom Chip Design Platform

Efabless Welcomes Weebit Nano’s ReRAM to Its Custom Chip Design Platform

Weebit Nano and Efabless are teaming up to make it easier for chip designers to prototype intelligent devices using Weebit's advanced memory technology.


News Jun 05, 2024 by Arjun Nijhawan
Using Complex Permeability to Characterize Magnetic Core Losses

Using Complex Permeability to Characterize Magnetic Core Losses

In this article, we use the concept of magnetic field intensity to help explain how complex permeability models the losses of a magnetic core.


Phison Carves Out New SSD Brand Along With Inaugural Series

Phison Carves Out New SSD Brand Along With Inaugural Series

The new Pascari brand will provide SSDs for data-heavy enterprise applications.


News May 23, 2024 by Aaron Carman
Diamagnetic, Paramagnetic, and Ferromagnetic Materials Explained

Diamagnetic, Paramagnetic, and Ferromagnetic Materials Explained

This article examines three different types of magnetic materials and how they react to an external magnetic field.


The Ripple Effects of Robert H. Dennard, Inventor of DRAM and Dennard Scaling

The Ripple Effects of Robert H. Dennard, Inventor of DRAM and Dennard Scaling

Dr. Robert Dennard passed away last month. He dedicated more than half a century of his professional life to microelectronics research, resulting in pivotal MOSFET scaling equations and DRAM.


News May 13, 2024 by Robert Keim
Key Concepts of Magnetic Materials

Key Concepts of Magnetic Materials

This article discusses the following basic concepts related to magnetic materials: the magnetic dipole moment, magnetization vectors, susceptibility, and permeability.


Switching Losses in Bipolar Junction Transistors

Switching Losses in Bipolar Junction Transistors

With the help of SPICE simulations, we examine two types of power dissipation that occur when BJTs are used as switches.


Density Demands Push Memory Solutions to New Heights

Density Demands Push Memory Solutions to New Heights

From embedded systems to high-performance storage, the latest memory advancements are stacking skyward to maximize density and speed.


News Apr 29, 2024 by Aaron Carman
Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0

Rambus Presents First GDDR7 Memory Controller in the Age of AI 2.0

Today's processors support large-language models scaling to over a trillion parameters. Rambus is keeping up with this computational load with a new memory solution.


News Apr 24, 2024 by Aaron Carman
Applying IP Customization to Improve AI Chips: A Case Study

Applying IP Customization to Improve AI Chips: A Case Study

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.


Micron to ‘Revolutionize’ Smart Vehicles With First Quad-Port SSD

Micron to ‘Revolutionize’ Smart Vehicles With First Quad-Port SSD

Micron simplifies data access in new vehicle architectures with its first multi-port automotive SSD.


News Apr 16, 2024 by Aaron Carman
Circuit and Operation of a D Flip-Flop

Circuit and Operation of a D Flip-Flop

D-type flip-flops are fundamental digital memory components. Here, we examine their input-output behavior and internal circuitry.


Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

Microchip Expands Its Serial SRAM Devices to 2 Mb and 4 Mb

With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.


News Apr 02, 2024 by Jake Hertz
Infineon SEMPER™ X1 | Fast Facts

Infineon SEMPER™ X1 | Fast Facts

Enable next-generation automotive E/E architectures.


Pragmatic Semi is Breaking the Rules and Bending Silicon Electronics

Pragmatic Semi is Breaking the Rules and Bending Silicon Electronics

Pragmatic Semiconductor’s Founder and Executive Director joins us to discuss their thin-film, low-cost alternative to traditional silicon manufacturing and their aim to disrupt applications from smart labeling to IoT sensors and fingerprint sensors.


Understanding How CXL 3.0 Links the Data Center Fabric

Understanding How CXL 3.0 Links the Data Center Fabric

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements and benefits of this protocol, along with what’s new in CXL version 3.0.


Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.


News Mar 13, 2024 by Duane Benson