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From AI to Aerospace: New Memory Solutions Evolve to Meet Data Demands

From AI to Aerospace: New Memory Solutions Evolve to Meet Data Demands

New memory technologies, including HBM4, DDR5 DRAM, and MRAM, each respond to various industries outgrowing current storage infrastructure.


News Sep 13, 2024 by Mike Falter
Global Efforts Heat Up to Boost Semiconductor Production

Global Efforts Heat Up to Boost Semiconductor Production

Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.


News Aug 22, 2024 by Jake Hertz
New AI Efforts Touch Everything From Data Ownership to Humanoid Robots

New AI Efforts Touch Everything From Data Ownership to Humanoid Robots

Startups are using and supporting AI in a myriad of ways.


News Aug 20, 2024 by Jake Hertz
Memory Leaders Rise to Meet the Storage Challenges of AI

Memory Leaders Rise to Meet the Storage Challenges of AI

At this year's Future of Memory and Storage show, Microchip, Micron, and Samsung presented new memory solutions in the age of AI—from SSD controllers to LPDDR5X DRAM.


News Aug 08, 2024 by Jake Hertz
Micron, SK Hynix, and Others Debut Memory Firsts Ahead of Storage Show

Micron, SK Hynix, and Others Debut Memory Firsts Ahead of Storage Show

This week, memory makers big and small have rolled out NAND Flash, MRAM, and DDR innovations ahead of the rebranded Future of Memory Storage show.


News Aug 05, 2024 by Duane Benson
Rethinking MCU Architectures for the AI Era

Rethinking MCU Architectures for the AI Era

MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.


Teledyne e2v Upgrades Processors and DDR4 for Space

Teledyne e2v Upgrades Processors and DDR4 for Space

Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.


News Jul 22, 2024 by Aaron Carman
Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.


News Jul 15, 2024 by Darshil Patel
Moving Data Through an LTspice Parallel-Load Shift Register

Moving Data Through an LTspice Parallel-Load Shift Register

This article demonstrates the operation of an LTspice shift register and discusses details of its schematic and timing relationships.


Creating a Parallel-Load Shift Register in LTspice

Creating a Parallel-Load Shift Register in LTspice

We explore the design and functionality of a digital shift register intended for use in mixed-signal circuit simulations.


Understanding Dimensional Resonance in High-Frequency Magnetic Cores

Understanding Dimensional Resonance in High-Frequency Magnetic Cores

In this article, we explore the effect of dimensional resonance on the magnetic field distribution in high-frequency ferrite cores.


Understanding the Effect of Eddy Currents on the High-Frequency Behavior of Magnetic Cores

Understanding the Effect of Eddy Currents on the High-Frequency Behavior of Magnetic Cores

The formation of eddy currents can cause problems for magnetic cores at high frequencies. To mitigate these undesirable effects, we first need to understand them.


SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.


News Jun 11, 2024 by Arjun Nijhawan
Efabless Welcomes Weebit Nano’s ReRAM to Its Custom Chip Design Platform

Efabless Welcomes Weebit Nano’s ReRAM to Its Custom Chip Design Platform

Weebit Nano and Efabless are teaming up to make it easier for chip designers to prototype intelligent devices using Weebit's advanced memory technology.


News Jun 05, 2024 by Arjun Nijhawan
Using Complex Permeability to Characterize Magnetic Core Losses

Using Complex Permeability to Characterize Magnetic Core Losses

In this article, we use the concept of magnetic field intensity to help explain how complex permeability models the losses of a magnetic core.


Phison Carves Out New SSD Brand Along With Inaugural Series

Phison Carves Out New SSD Brand Along With Inaugural Series

The new Pascari brand will provide SSDs for data-heavy enterprise applications.


News May 23, 2024 by Aaron Carman
Diamagnetic, Paramagnetic, and Ferromagnetic Materials Explained

Diamagnetic, Paramagnetic, and Ferromagnetic Materials Explained

This article examines three different types of magnetic materials and how they react to an external magnetic field.


The Ripple Effects of Robert H. Dennard, Inventor of DRAM and Dennard Scaling

The Ripple Effects of Robert H. Dennard, Inventor of DRAM and Dennard Scaling

Dr. Robert Dennard passed away last month. He dedicated more than half a century of his professional life to microelectronics research, resulting in pivotal MOSFET scaling equations and DRAM.


News May 13, 2024 by Robert Keim
Key Concepts of Magnetic Materials

Key Concepts of Magnetic Materials

This article discusses the following basic concepts related to magnetic materials: the magnetic dipole moment, magnetization vectors, susceptibility, and permeability.


Switching Losses in Bipolar Junction Transistors

Switching Losses in Bipolar Junction Transistors

With the help of SPICE simulations, we examine two types of power dissipation that occur when BJTs are used as switches.