Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg to highlight new AI-focused Agilex 5 FPGAs.
Barely a month after its creation (or re-creation), FGPA company Altera hit the stage at Embedded World 2024 in Nuremberg to highlight new AI-focused Agilex 5 FPGAs.
At Embedded World 2024, AMD announced two new adaptive SoC chips targeting edge AI and high-load edge computing…
At Embedded World 2024, AMD announced two new adaptive SoC chips targeting edge AI and high-load edge computing systems—both of which will be deployed in Subaru's Eyesight ADAS.
With support for a bevy of wireless standards, the latest NXP MCUs, unveiled at Embedded World 2024, ease the transition…
With support for a bevy of wireless standards, the latest NXP MCUs, unveiled at Embedded World 2024, ease the transition to a connected world.
At Embedded World today, Renesas lifted the curtain on a new family of entry-level MCUs filling out its RA series. We…
At Embedded World today, Renesas lifted the curtain on a new family of entry-level MCUs filling out its RA series. We spoke to Renesas' Masashi Ueda to learn more.
Georg Ohm, the man behind the most well-known electrical equation, had a surprisingly hard time convincing others of its…
Georg Ohm, the man behind the most well-known electrical equation, had a surprisingly hard time convincing others of its importance at the time.
Infineon has added three PSOC Edge MCUs with Arm Cores and dual-domain architectures to ramp up edge performance.
Infineon has added three PSOC Edge MCUs with Arm Cores and dual-domain architectures to ramp up edge performance.
The Connectivity Standards Alliance has released its IoT Device Security Specification V1.0 to unify many different…
The Connectivity Standards Alliance has released its IoT Device Security Specification V1.0 to unify many different standards for global use.
In contrast to current cardiac sensors, which can only measure mechanical or electrical data in bulky form factors, the…
In contrast to current cardiac sensors, which can only measure mechanical or electrical data in bulky form factors, the new one-atom-thin device measures both.
Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show…
Check out the technologies and products these leading companies plan to showcase at next week's Embedded World trade show in Nuremberg, Germany.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
The 7.4 magnitude earthquake today in Taiwan has caused devastating loss and suffering. Our thoughts with all those affected.
From small appliances to edge AI, the latest MCUs from Renesas, Ambiq, and Nuvoton provide higher performance and efficiency.
From small appliances to edge AI, the latest MCUs from Renesas, Ambiq, and Nuvoton provide higher performance and efficiency.
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional…
With speeds up to 143 MHz, the new 2-Mb and 4-Mb serial SRAM devices can be a lower-cost alternative to traditional parallel SRAM products.
The two new chips target mid- and premium-tier wireless earbuds, headphones, and speakers.
The two new chips target mid- and premium-tier wireless earbuds, headphones, and speakers.
To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are…
To meet demands for higher densities, faster performance, and compliance to open standards, connector manufacturers are racing to keep pace.
For our final feature celebrating Women’s History Month, we interviewed Chiara Bartolozzi, a senior researcher moving…
For our final feature celebrating Women’s History Month, we interviewed Chiara Bartolozzi, a senior researcher moving the needle in neuromorphic engineering.
Some of the leaders of the networking industry showed up to the Optical Fiber Conference, including Broadcom, MediaTek,…
Some of the leaders of the networking industry showed up to the Optical Fiber Conference, including Broadcom, MediaTek, Semtech, and MaxLinear.
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI…
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.
Today, NXP announced a new platform and automotive processor that promises more integration and utility in SDVs—no…
Today, NXP announced a new platform and automotive processor that promises more integration and utility in SDVs—no matter the architecture.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
The new MCUs focus on power efficiency and high-accuracy analog-to-digital conversion.
The new MCUs focus on power efficiency and high-accuracy analog-to-digital conversion.
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