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Defining a 5G Coverage Map: Rohde & Schwarz and Ericsson Use Drones to Measure 5G Coverage Areas

Defining a 5G Coverage Map: Rohde & Schwarz and Ericsson Use Drones to Measure 5G Coverage Areas

Ericsson is measuring 5G coverage areas and verifying their performance using drone-borne solutions from Rohde & Schwarz.


News Sep 18, 2019 by Gary Elinoff
Diodes Incorporated Unveils Miniature Automotive MOSFETS for Power Management, DC-DC Converters

Diodes Incorporated Unveils Miniature Automotive MOSFETS for Power Management, DC-DC Converters

The 40V-rated DMTH4008LFDFWQ and the 60V-rated DMTH6016LFDFWQ sport space-saving DFN2020 packages.


News Sep 16, 2019 by Gary Elinoff
Taiwan Semiconductor Offers Four New Power MOSFETs for BLDC Motor Control

Taiwan Semiconductor Offers Four New Power MOSFETs for BLDC Motor Control

The dual N-channel devices offer DS breakdown voltages of 40 V and 60 V and current ratings of 25 A to 48 A.


News Sep 15, 2019 by Gary Elinoff
STMicroelectronics SiC Devices Will Power Renault-Nissan-Mitsubishi On-Board Battery Chargers

STMicroelectronics SiC Devices Will Power Renault-Nissan-Mitsubishi On-Board Battery Chargers

Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.


News Sep 13, 2019 by Gary Elinoff
Power Integrations’ Low-Noise, 200V AEC-Q100 Diodes Targets Automotive Audio Applications

Power Integrations’ Low-Noise, 200V AEC-Q100 Diodes Targets Automotive Audio Applications

Power Integrations' AEC-Q100-qualified LQ10N200CQ and LQ20N200CQ diodes target automotive audio systems.


News Sep 13, 2019 by Gary Elinoff
Where KNX Stands in Building Automation Designs

Where KNX Stands in Building Automation Designs

The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety.


News Sep 12, 2019 by Majeed Ahmad
IIoT Throwdown: BehrTech Pits Its MYTHINGS Technology Against LoRa for Industrial Applications

IIoT Throwdown: BehrTech Pits Its MYTHINGS Technology Against LoRa for Industrial Applications

A researcher has tested two competing IoT technologies, MYTHINGS and LoRa, against each other to see which one is more reliable. How did they do?


News Sep 11, 2019 by Robin Mitchell
Synopsys and NSITEXE Partnership Finds Success with Accelerated Processor SoC Development

Synopsys and NSITEXE Partnership Finds Success with Accelerated Processor SoC Development

NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.


News Sep 09, 2019 by Gary Elinoff
Tools for Future EEs: New Texas Instruments Robotics System Learning Kit Supports STEM Education

Tools for Future EEs: New Texas Instruments Robotics System Learning Kit Supports STEM Education

The TI-RSLK Max allows students to gain hands-on experience building a robot and programming it.


News Sep 06, 2019 by Gary Elinoff
ON Semiconductor Offers New Power Over Ethernet Controllers to Support IEEE 802.3bt PoE

ON Semiconductor Offers New Power Over Ethernet Controllers to Support IEEE 802.3bt PoE

The NCP1095 and NCP1096 deliver 90 Watts power-over-internet (POE) in compliance with IEEE's 802.3bt standard.


News Sep 05, 2019 by Gary Elinoff
Firmware Enables Gas Sensors to Personalize Monitoring Services

Firmware Enables Gas Sensors to Personalize Monitoring Services

A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms.


News Sep 05, 2019 by Majeed Ahmad
TDK Introduces Power Inductors for Automotive LED Headlights

TDK Introduces Power Inductors for Automotive LED Headlights

The SPM-VT series meets the high thermal and current demands of the automotive LED headlight environment.


News Sep 04, 2019 by Gary Elinoff
Visual RF Detection, a New UAV RF System, and FCC RF Regulations: Radio Frequency News Roundup

Visual RF Detection, a New UAV RF System, and FCC RF Regulations: Radio Frequency News Roundup

What's new in RF?


News Sep 03, 2019 by Gary Elinoff
DARPA’s Subterranean Challenge Tasks Engineers with Communication and Sensor Issues

DARPA’s Subterranean Challenge Tasks Engineers with Communication and Sensor Issues

DARPA’s Subterranean (SubT) Challenge seeks to find new ways to cope with complex underground environments.


News Sep 02, 2019 by Gary Elinoff
Silicon Labs Debuts Si834x Family of Isolated Smart Switches for Industrial Applications

Silicon Labs Debuts Si834x Family of Isolated Smart Switches for Industrial Applications

The new SiLabs units aim at the PLCs, relay drivers, and servo motor controllers employed in industrial automation.


News Aug 30, 2019 by Gary Elinoff
TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.


News Aug 29, 2019 by Gary Elinoff
Xilinx Claims Title of “World’s Largest FPGA” with New VU19P

Xilinx Claims Title of “World’s Largest FPGA” with New VU19P

Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.


News Aug 28, 2019 by Gary Elinoff
High-speed Interfaces Bolster Connectivity in SSD Controllers

High-speed Interfaces Bolster Connectivity in SSD Controllers

The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity and speed of flash memory they serve in SSD designs.


News Aug 27, 2019 by Majeed Ahmad
Industrial Robotics Roundup: Articulated vs. SCARA vs. Cartesian Robots

Industrial Robotics Roundup: Articulated vs. SCARA vs. Cartesian Robots

From the typical pick-and-place down to the high-precision cobots, industrial robotics are changing rapidly.


News Aug 26, 2019 by Gary Elinoff
Time of Flight 3D Sensors Roundup: TI, Espros, AMS, and Artilux

Time of Flight 3D Sensors Roundup: TI, Espros, AMS, and Artilux

Learn the different ways companies are using time-of-flight 3D sensor technology to create products for facial recognition, smart cars, and manufacturing.


News Aug 24, 2019 by Gary Elinoff