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Researchers Use Photons & Phonons for Long-Distance Qubit Communication

Researchers Use Photons & Phonons for Long-Distance Qubit Communication

The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.


News Aug 18, 2026 by Dr. Steve Arar
Nuvoton Teams up With Klippel To Reimagine Smart Audio Amplifiers

Nuvoton Teams up With Klippel To Reimagine Smart Audio Amplifiers

New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices


News Aug 17, 2026 by Duane Benson
Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.


News Aug 17, 2026 by Luke James
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.


News Aug 12, 2026 by Duane Benson
Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.


News Jul 28, 2026 by Jeff Child
Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.


News Jul 24, 2026 by Luke James
AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.


News Jul 23, 2026 by Jeff Child
Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.


News Jul 17, 2026 by Dr. Steve Arar
Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.


News Jul 15, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.


News Jul 07, 2026 by Luke James
Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James
The Intel 8051: How a 1980 Microcontroller Lasts the Test of Time

The Intel 8051: How a 1980 Microcontroller Lasts the Test of Time

Intel's 1980 microcontroller put a CPU, memory, timers, and serial I/O on a single chip. It’s an architecture that still ships inside billions of devices.


News Jul 03, 2026 by Luke James
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child