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ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.


News Feb 23, 2024 by Aaron Carman
Siemens Unveils 3-Piece Emulation and Prototyping Solution

Siemens Unveils 3-Piece Emulation and Prototyping Solution

The new hardware-assisted verification and validation system marks a first for the EDA industry.


News Feb 21, 2024 by Jake Hertz
AMD Launches Embedded+ Architecture Blending Ryzen and Versal

AMD Launches Embedded+ Architecture Blending Ryzen and Versal

Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.


News Feb 06, 2024 by Jake Hertz
Researchers Create World’s First Graphene Semiconductor

Researchers Create World’s First Graphene Semiconductor

Georgia Tech research could bring graphene's benefits for semiconductors in microelectronics.


News Jan 18, 2024 by Jake Hertz
Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.


News Jan 17, 2024 by Duane Benson
Editor’s Choice: Our Top 10 News Articles of 2023

Editor’s Choice: Our Top 10 News Articles of 2023

Looking back on the year, here’s a review of the most popular News articles on All About Circuits.


News Dec 31, 2023 by Jeff Child
Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.


News Dec 27, 2023 by Jeff Child
Quantum Technology Takes on the Task of Electrical Die Sorting

Quantum Technology Takes on the Task of Electrical Die Sorting

Rohm has teamed up with Quanmatics to deploy quantum technology in a large-scale semiconductor manufacturing facility for the first time.


News Dec 20, 2023 by Jake Hertz
CHIPS Act Gets a Boost With the Semiconductor Technology Pilot Program

CHIPS Act Gets a Boost With the Semiconductor Technology Pilot Program

The new program from the USPTO aims to jump-start research, development, and investment in the domestic semiconductor industry.


News Dec 08, 2023 by Jake Hertz
I’m Thankful for These 6 EE Online Resources on All About Circuits

I’m Thankful for These 6 EE Online Resources on All About Circuits

On Thanksgiving today, Jeff reflects on how electronics technology enables all our amazing devices, and shares six useful All About Circuits online resources to be thankful for.


News Nov 23, 2023 by Jeff Child
Microsoft Ventures Into Custom Silicon With New AI Accelerator and CPU

Microsoft Ventures Into Custom Silicon With New AI Accelerator and CPU

Microsoft is making its debut into in-house silicon with two new custom chips, claimed to improve AI performance in its data centers.


News Nov 20, 2023 by Aaron Carman
RISC-V Rollouts Abound at This Week’s North America RISC-V Summit

RISC-V Rollouts Abound at This Week’s North America RISC-V Summit

Reporting a “banner year” for adoption, these RISC-V developments show the versatility of the ISA.


News Nov 10, 2023 by Aaron Carman
Your 2023 Back-to-School Guide to All About Circuits’ Educational Resources

Your 2023 Back-to-School Guide to All About Circuits’ Educational Resources

Whether you are just starting your first year as an engineering student, working on a second or third degree, or simply want to brush up on key topics, All About Circuits has the resources you need: awesome textbooks, technical articles, calculators, and more for your EE studies.


News Oct 11, 2023 by Jeff Child
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
Navitas Technology Takes GaN to New Power Heights

Navitas Technology Takes GaN to New Power Heights

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.


AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new applications.


News Sep 21, 2023 by Aaron Carman
AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
Memory, Processing, & Security: Focal Points of New Automotive Releases

Memory, Processing, & Security: Focal Points of New Automotive Releases

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products may help to meet such targets.


News Sep 13, 2023 by Darshil Patel
Semiconductor Skills Shortage May Escalate to ‘Crisis’ by 2030

Semiconductor Skills Shortage May Escalate to ‘Crisis’ by 2030

Although the semiconductor industry is historically one of the most lucrative and fast-paced industries in the world, it now faces an unprecedented challenge.


News Aug 14, 2023 by Jake Hertz
IBM’s Analog AI Chip Takes New Approach to Mixed-signal Architecture

IBM’s Analog AI Chip Takes New Approach to Mixed-signal Architecture

Combining the compute performance of analog with the flexibility of digital makes for a device uniquely suited to complex AI challenges.


News Aug 14, 2023 by Aaron Carman