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MIT’s Encryption Chip Reduces Public-Key Encryption Power Consumption by 99.75%

MIT’s Encryption Chip Reduces Public-Key Encryption Power Consumption by 99.75%

Encryption takes energy. MIT's public-key encryption chip reportedly reduces encryption energy consumption by 99.75%.


News Mar 28, 2018 by Chantelle Dubois
NXP and Microsoft Collaborations Focus on Enhancing IoT Security

NXP and Microsoft Collaborations Focus on Enhancing IoT Security

NXP Semiconductors, a Dutch manufacturer of semiconductor chips and SoCs, has recently announced a few new collaborations with Microsoft that will enhance Industrial IoT applications with it’s hardware suite.


News Mar 18, 2018 by Chantelle Dubois
News Brief: New Transceiver and Wi-Fi Modules for Low-Power IoT Applications from Silicon Labs

News Brief: New Transceiver and Wi-Fi Modules for Low-Power IoT Applications from Silicon Labs

This News Brief covers Silicon Labs' WF200 transceiver and WFM200 module, recently added to their Wi-Fi portfolio.


News Mar 13, 2018 by Chantelle Dubois
Two Tiny Form Factors: An NFC Sensor Tag and Data Logger IC from ams

Two Tiny Form Factors: An NFC Sensor Tag and Data Logger IC from ams

A new tiny sensor tag and data logger IC offers efficient and accurate monitoring of sensitive assets.


News Mar 12, 2018 by Nick Davis
Cold Storage and Cold Chain Monitoring: A Highly Accurate Digital Temperature Sensor from ams

Cold Storage and Cold Chain Monitoring: A Highly Accurate Digital Temperature Sensor from ams

A new highly accurate cold chain digital temperature sensor from ams makes the design of refrigerators and data loggers, in cold-chain storage equipment, a little easier.


News Mar 05, 2018 by Nick Davis
DeepCover: Maxim Integrated’s Secure Authenticator with a Host of Security Services

DeepCover: Maxim Integrated’s Secure Authenticator with a Host of Security Services

Maxim Integrated recently announced the DS28E36 IC, which is a secure authenticator that uses Maxim's DeepCover embedded security solutions.


News Feb 23, 2018 by Nick Davis
A New High-Performance Digital MEMS Microphone from Infineon

A New High-Performance Digital MEMS Microphone from Infineon

Here's a breakdown of Infineon's new high-performance digital MEMS microphone that offers power-optimized modes for low-current consumption devices.


News Feb 21, 2018 by Nick Davis
Three of the Top FPGA Dev Boards for New Designers

Three of the Top FPGA Dev Boards for New Designers

Looking to get a new FPGA development board? Maybe you aren’t, but this article might persuade you to get one like our previous article did to me.


News Feb 18, 2018 by Donald Krambeck
TAIYO YUDEN’s EYSHSNZWZ: ‘The World’s Smallest Bluetooth Module’

TAIYO YUDEN’s EYSHSNZWZ: ‘The World’s Smallest Bluetooth Module’

TAIYO YUDEN showcased three Bluetooth low energy modules at CES 2018, one of which is less than a millimeter thick.


News Feb 14, 2018 by Justin Kirkham
Developing an Open Source Voice Assistant: Interview with Mycroft AI’s Steve Penrod

Developing an Open Source Voice Assistant: Interview with Mycroft AI’s Steve Penrod

A look at Mycroft, a machine-learning AI home voice assistant—that's open source.


News Feb 09, 2018 by Kate Smith
Design Kits Raising the Game for Amazon’s Alexa Voice Service

Design Kits Raising the Game for Amazon’s Alexa Voice Service

Here is a view of development boards for Amazon's Alexa audio technology and how they simplify design for voice-enabled speakers, appliances, and panels.


News Feb 06, 2018 by Majeed Ahmad
Georgia Tech Research Aims to Solve Organic Thin-Film Transistors’ Stability Problem

Georgia Tech Research Aims to Solve Organic Thin-Film Transistors’ Stability Problem

Georgia Tech's Center for Organic Photonics and Electronics (COPE) has made a large improvement of the operation and stability of organic thin-film transistors (OTFTs).


News Feb 05, 2018 by Donald Krambeck
Breakdown on Piezo Actuators from TDK at CES 2018

Breakdown on Piezo Actuators from TDK at CES 2018

TDK has just released a new line of piezo actuators with haptic feedback. The PiezoHap comes in three compact sizes - 2.5G, 7G, and 15G, with a large acceleration of 2.5 g. 7 g, and 15 g, respectfully, under a load of 100 grams.


News Jan 26, 2018 by Donald Krambeck
A Configurable Sensor Monitor for Power-Sensitive Designs from Texas Instruments

A Configurable Sensor Monitor for Power-Sensitive Designs from Texas Instruments

Texas Instruments recently announced a new nanopower, dual-channel, programmable sensor monitor to help designers optimize system power.


News Jan 25, 2018 by Nick Davis
Security Is the Focus of New WPA Updates in 2018

Security Is the Focus of New WPA Updates in 2018

The Wi-Fi Alliance, which manages the certification standard for Wi-Fi devices, has announced enhancements to the Wi-Fi Protected Access II (WPA2) protocol, as well as a pending arrival of a new WPA3 protocol.


News Jan 23, 2018 by Chantelle Dubois
RF Test and Measurement: RIGOL Releases Real-Time Spectrum Analyzer with Time-Dependent Features

RF Test and Measurement: RIGOL Releases Real-Time Spectrum Analyzer with Time-Dependent Features

Today RIGOL announced the release of the RSA5000 real-time spectrum analyzer.


News Jan 18, 2018 by John Spreer
ams Releases New Data-Logging NFC Sensor Tag

ams Releases New Data-Logging NFC Sensor Tag

Last month, ams released their newest sensor tag, the AS39513, a device that can help monitor the state of temperature-sensitive medical and food products.


News Jan 17, 2018 by Justin Kirkham
Increasing Data Demands Pushing New Data Storage Technologies

Increasing Data Demands Pushing New Data Storage Technologies

An uptick in interest in cryptocurrencies has also increased interest in fast, high-capacity, and especially secure data storage. Here are some developments in the data storage realm.


News Jan 01, 2018 by Chantelle Dubois
Teardown Tuesday: Samsung’s SmartThings Smart Home Hub and IoT Water Leak Sensor

Teardown Tuesday: Samsung’s SmartThings Smart Home Hub and IoT Water Leak Sensor

In this teardown, we open up Samsung's SmartThings Hub and a Water Leak Sensor to see what we can find.


News Dec 19, 2017 by Nick Davis
Possible IC Packaging Shortages in 2018

Possible IC Packaging Shortages in 2018

Experts in semiconductor manufacturing are predicting longer lead times and higher demand for IC packaging in 2018. This news comes during a time when the electronics industry is already facing several shortages and high volume demands for components such as OLED displays, DRAM, and NAND flash memory.


News Dec 18, 2017 by Chantelle Dubois