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MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.


News Mar 03, 2021 by Jake Hertz
Emerging DDR5 Technology Shows Promise in Securing Automotive Memory

Emerging DDR5 Technology Shows Promise in Securing Automotive Memory

While DDR5 is often hailed for its increased memory, processing reliability, and performance, an often-overlooked feature of this DRAM is its security capabilities—especially in automotive applications.


ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.


News Mar 02, 2021 by Jake Hertz
New Automotive SoCs Provide a Window to ADAS Trends

New Automotive SoCs Provide a Window to ADAS Trends

Taking a survey of new automotive-facing chips can tip us off to the design trends ADAS may take in the future.


News Feb 16, 2021 by Jake Hertz
New Switch Families Aim to Break Down Complicated Network Infrastructure Walls

New Switch Families Aim to Break Down Complicated Network Infrastructure Walls

Microchip is seeking to cut through the fog of network complexity with two new families—one family of Ethernet switches and one family of PCIe 5.0 switches.


News Feb 05, 2021 by Jake Hertz
As mmWave Tech Matures, T&M Equipment and Techniques are Shifting, Too

As mmWave Tech Matures, T&M Equipment and Techniques are Shifting, Too

While millimeter wave technology is by no means new, test and measurement suppliers are releasing innovative tips and equipment to help test engineers address higher-frequency challenges.


Micron Unveils 1α DRAM Process Node—the Highest-Density DRAM to Date

Micron Unveils 1α DRAM Process Node—the Highest-Density DRAM to Date

Micron claims to have broken the glass ceiling of the 1z DRAM node with a new process that improves memory density by 40%.


News Jan 27, 2021 by Jake Hertz
On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

On a Single Chip, ST Integrates ESD Protection and Network Matching for GNSS

While impedance-matching and electrostatic-discharge protection usually fall on the shoulders of discrete components, a new chipset is said to integrate both features in the same IC package.


News Jan 25, 2021 by Adrian Gibbons
The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The Rollout of Wi-Fi 6E-Compatible Devices Has (Slowly) Begun

The CES 2021 stage has debuted the hardware of some of the first Wi-Fi 6E devices. What are the benefits and challenges of this new connectivity protocol?


News Jan 15, 2021 by Tyler Charboneau
More Cells, More Range: TI’s Wireless Battery Management System Frees EV Space for More Design Innovation

More Cells, More Range: TI’s Wireless Battery Management System Frees EV Space for More Design Innovation

We spoke with Texas Instruments to learn more about this new tech, which they feel can shake up the EV industry.


News Jan 07, 2021 by Jake Hertz
Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Designers Can Synchronize Clocks Without External Oscillators Thanks to IEEE 1588

Updates to the IEEE 1588 standard protocol map out a low-cost method for synchronizing distributed clocks.


Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Snapdragon 888: Qualcomm’s First High-End Chip with a Build-In Modem

Qualcomm recently unveiled Snapdragon 888, the company’s new high-end mobile platform built on the N5 process node.


News Dec 08, 2020 by Luke James
Figures of Merit in Power Design: A Reliable Benchmark or an Evolving Standard?

Figures of Merit in Power Design: A Reliable Benchmark or an Evolving Standard?

Design teams, especially in the power sector, may be increasingly asked to benchmark performance with Figures of Merit. What is this standard and how might it be evolving alongside component innovation?


The New IEC 62368-1 Safety Standard Is Upon Us. Here’s What You Should Know

The New IEC 62368-1 Safety Standard Is Upon Us. Here’s What You Should Know

IEC 62368-1 will be in effect on December 20, 2020. What are the key takeaways designers should know?


News Dec 01, 2020 by Tyler Charboneau
How Ethernet Switches are Branching Into Industries Far Beyond IT

How Ethernet Switches are Branching Into Industries Far Beyond IT

While Ethernet switches were once solely associated with IT applications, today they are staples in industries from military to rail communications.


News Nov 25, 2020 by Luke James
Classical CAN vs. CAN FD Protocols: the Differences that Matter for Designers

Classical CAN vs. CAN FD Protocols: the Differences that Matter for Designers

While CAN FD has been around since 2011, this protocol is still, in many cases, the preferable option to Classical CAN for many designers. Here's why.


How Does Qi, the Wireless Charging Standard, Work?

How Does Qi, the Wireless Charging Standard, Work?

Qi-certified wireless charging devices are now commonplace in the consumer market. But how exactly does Qi achieve wireless power transfer at the circuit level?


News Nov 19, 2020 by Dr. Steve Arar
While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.


News Oct 14, 2020 by Nicholas St. John
Maxim Hopes Low-Power NN Accelerator Chip for Edge Devices Will Lead an “Embedded Revolution”

Maxim Hopes Low-Power NN Accelerator Chip for Edge Devices Will Lead an “Embedded Revolution”

This morning, Maxim Integrated released its newest product, a low-power NN accelerator chip, with the hopes of bringing AI to the edge. We interviewed Kris Ardis, executive director of Micros, Security, and Software Business Unit at Maxim Integrated, to get the details.


News Oct 07, 2020 by Jake Hertz
What is DrMOS—the IC Powering Next-Gen Processors?

What is DrMOS—the IC Powering Next-Gen Processors?

Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.


News Sep 30, 2020 by Adrian Gibbons